KR100589753B1 - 웨이퍼 매핑 시스템 - Google Patents

웨이퍼 매핑 시스템 Download PDF

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Publication number
KR100589753B1
KR100589753B1 KR1020017004782A KR20017004782A KR100589753B1 KR 100589753 B1 KR100589753 B1 KR 100589753B1 KR 1020017004782 A KR1020017004782 A KR 1020017004782A KR 20017004782 A KR20017004782 A KR 20017004782A KR 100589753 B1 KR100589753 B1 KR 100589753B1
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KR
South Korea
Prior art keywords
wafer
receiver
port
pod
transmitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020017004782A
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English (en)
Korean (ko)
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KR20010085928A (ko
Inventor
로센퀴스트프레데릭티.
리챠드손브루스
포스나이트윌리엄제이.
보노라안소니씨.
Original Assignee
어사이스트 테크놀로지스, 인코포레이티드
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Application filed by 어사이스트 테크놀로지스, 인코포레이티드 filed Critical 어사이스트 테크놀로지스, 인코포레이티드
Publication of KR20010085928A publication Critical patent/KR20010085928A/ko
Application granted granted Critical
Publication of KR100589753B1 publication Critical patent/KR100589753B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020017004782A 1998-10-15 1999-10-13 웨이퍼 매핑 시스템 Expired - Lifetime KR100589753B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/173,710 1998-10-15
US09/173,710 US6188323B1 (en) 1998-10-15 1998-10-15 Wafer mapping system

Publications (2)

Publication Number Publication Date
KR20010085928A KR20010085928A (ko) 2001-09-07
KR100589753B1 true KR100589753B1 (ko) 2006-06-15

Family

ID=22633178

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017004782A Expired - Lifetime KR100589753B1 (ko) 1998-10-15 1999-10-13 웨이퍼 매핑 시스템

Country Status (6)

Country Link
US (1) US6188323B1 (enExample)
EP (1) EP1121672A4 (enExample)
JP (1) JP4616477B2 (enExample)
KR (1) KR100589753B1 (enExample)
TW (1) TW445496B (enExample)
WO (1) WO2000022589A1 (enExample)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11144496A (ja) * 1997-11-10 1999-05-28 Nec Corp Ｌｓｉセル位置情報出力装置、出力方法およびｌｓｉセル位置情報出力プログラムの記録媒体
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
US20040075822A1 (en) * 1998-07-03 2004-04-22 Nikon Corporation Exposure apparatus and its making method, substrate carrying method, device manufacturing method and device
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6591162B1 (en) 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
KR100741186B1 (ko) * 2000-08-23 2007-07-19 동경 엘렉트론 주식회사 피처리체의 처리시스템
US6848876B2 (en) 2001-01-12 2005-02-01 Asyst Technologies, Inc. Workpiece sorter operating with modular bare workpiece stockers and/or closed container stockers
US6452503B1 (en) * 2001-03-15 2002-09-17 Pri Automation, Inc. Semiconductor wafer imaging system
US6717171B2 (en) * 2001-06-05 2004-04-06 Semitool, Inc. Method and apparatus for accessing microelectronic workpiece containers
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door
US6825486B1 (en) * 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US6897463B1 (en) * 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
US7217076B2 (en) 2001-08-31 2007-05-15 Asyst Technologies, Inc. Semiconductor material handling system
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
US7066707B1 (en) 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
JP4669643B2 (ja) * 2001-09-17 2011-04-13 ローツェ株式会社 ウエハマッピング装置およびそれを備えたロードポート
TWI288961B (en) * 2001-12-12 2007-10-21 Shinko Electric Co Ltd Substrate detection apparatus
US7054713B2 (en) * 2002-01-07 2006-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration cassette pod for robot teaching and method of using
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
KR100490203B1 (ko) * 2002-02-04 2005-05-17 삼성전자주식회사 웨이퍼 맵핑 방법
WO2003080479A2 (en) 2002-03-20 2003-10-02 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
JP2003303869A (ja) * 2002-04-05 2003-10-24 Sankyo Seiki Mfg Co Ltd 基板搬送装置における蓋部材開閉装置
JP4118592B2 (ja) * 2002-04-22 2008-07-16 富士通株式会社 ロードポート及び半導体製造装置
AU2003245484A1 (en) * 2002-06-14 2003-12-31 Fortrend Engineering Corporation Universal reticle transfer system
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US7204669B2 (en) * 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US7677859B2 (en) 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
DE10250353B4 (de) * 2002-10-25 2008-04-30 Brooks Automation (Germany) Gmbh Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten
JP3916148B2 (ja) * 2002-11-15 2007-05-16 Ｔｄｋ株式会社 ウェハーマッピング機能を備えるウェハー処理装置
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers
AU2003296827A1 (en) * 2002-12-13 2004-07-09 Recif Device for gripping a semiconductor plate through a transfer opening, using the closure of the opening
KR100511373B1 (ko) * 2003-02-20 2005-08-30 주식회사 신성이엔지 후프오프너 매핑장치
US7255524B2 (en) * 2003-04-14 2007-08-14 Brooks Automation, Inc. Substrate cassette mapper
US6934606B1 (en) * 2003-06-20 2005-08-23 Novellus Systems, Inc. Automatic calibration of a wafer-handling robot
KR20050019445A (ko) * 2003-08-19 2005-03-03 삼성전자주식회사 맵핑 장치 및 그 제어 방법
US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
JP4012189B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 ウエハ検出装置
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
CN101253614B (zh) 2005-07-08 2011-02-02 埃塞斯特科技有限公司 工件支撑结构及其使用设备
US8821099B2 (en) * 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7596456B2 (en) * 2005-11-18 2009-09-29 Texas Instruments Incorporated Method and apparatus for cassette integrity testing using a wafer sorter
KR100754271B1 (ko) * 2005-12-13 2007-09-03 동부일렉트로닉스 주식회사 에스엠아이에프 시스템
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
JP4893425B2 (ja) * 2007-03-30 2012-03-07 東京エレクトロン株式会社 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
WO2009086164A2 (en) * 2007-12-27 2009-07-09 Lam Research Corporation Systems and methods for calibrating end effector alignment using at least a light source
KR101571182B1 (ko) * 2007-12-27 2015-11-23 램 리써치 코포레이션 플라즈마 프로세싱 시스템에서 엔드 이펙터 정렬을 교정하는 방법 및 시스템
CN101911277B (zh) * 2007-12-27 2012-04-04 朗姆研究公司 确定位置和偏移的装置和方法
SG186664A1 (en) * 2007-12-27 2013-01-30 Lam Res Corp Systems and methods for dynamic alignment beamcalibration
US20100034621A1 (en) * 2008-04-30 2010-02-11 Martin Raymond S End effector to substrate offset detection and correction
JP4488255B2 (ja) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法
TWI330707B (en) 2008-08-27 2010-09-21 Gudeng Prec Industral Co Ltd A system for measuring the vertical distance between the thin substrates
US8234003B2 (en) * 2009-01-20 2012-07-31 Macronix International Co., Ltd. Monitoring circuit, monitoring device and monitoring method thereof
TWI384578B (zh) * 2009-02-13 2013-02-01 Macronix Int Co Ltd 監測電路、監測裝置及其監測方法
US8275478B2 (en) * 2009-03-13 2012-09-25 Globalfoundries Inc. Method and apparatus for routing wafer pods to allow parallel processing
DE102009042891A1 (de) * 2009-09-24 2011-03-31 Giesecke & Devrient Gmbh Behälter und System für die Bearbeitung von Banknoten
CN102576687B (zh) 2009-11-17 2015-11-25 昕芙旎雅有限公司 晶圆检测装置
JP5168329B2 (ja) * 2010-08-31 2013-03-21 Ｔｄｋ株式会社 ロードポート装置
JP6510423B2 (ja) 2013-01-22 2019-05-08 ブルックス オートメーション インコーポレイテッド 基板搬送部
CN103217187B (zh) * 2013-03-01 2015-07-15 合肥京东方光电科技有限公司 识别实物在容器内的层号的设备及自动取出实物的系统
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
KR101432137B1 (ko) * 2013-03-27 2014-08-20 주식회사 싸이맥스 웨이퍼의 존재 유무 및 위치를 검출하는 일체형 매핑바가 형성된 매핑장치
JP6309756B2 (ja) * 2013-12-26 2018-04-11 川崎重工業株式会社 エンドエフェクタ装置
JP6248788B2 (ja) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 ウエハマッピング装置およびそれを備えたロードポート
US9831110B2 (en) 2015-07-30 2017-11-28 Lam Research Corporation Vision-based wafer notch position measurement
KR102522899B1 (ko) * 2016-02-05 2023-04-19 (주)테크윙 전자부품 적재상태 점검장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP6697984B2 (ja) * 2016-08-31 2020-05-27 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
CN118033164A (zh) * 2017-11-30 2024-05-14 徕卡生物系统成像股份有限公司 用于禁用转盘旋转的安全光幕
US11469123B2 (en) 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
JP7714946B2 (ja) * 2021-07-27 2025-07-30 信越半導体株式会社 ウェーハ搬送方法およびウェーハ搬送装置
KR102714618B1 (ko) * 2022-02-15 2024-10-07 정경미 웨이퍼 맵핑 장치
JP2023122739A (ja) * 2022-02-24 2023-09-05 株式会社ディスコ 搬送装置
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US4534389A (en) * 1984-03-29 1985-08-13 Hewlett-Packard Company Interlocking door latch for dockable interface for integrated circuit processing
US5350899A (en) * 1992-04-15 1994-09-27 Hiroichi Ishikawa Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber
US4806773A (en) * 1984-10-18 1989-02-21 Canon Kabushiki Kaisha Wafer position detecting method and apparatus
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
JPH0620097B2 (ja) * 1987-10-20 1994-03-16 富士通株式会社 ウエハ位置決め装置
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5319216A (en) * 1991-07-26 1994-06-07 Tokyo Electron Limited Substrate detector with light emitting and receiving elements arranged in staggered fashion and a polarization filter
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
US5308993A (en) 1993-03-28 1994-05-03 Avalon Engineering, Inc. Semiconductor wafer cassette mapper having dual vertical column of light emitting apertures and a single vertical column of light receiving apertures
CH689336A5 (de) * 1994-10-03 1999-02-26 Baumer Electric Ag Lichtschranke.
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US5810537A (en) * 1995-10-18 1998-09-22 Bye/Oasis Engineering Inc. Isolation chamber transfer apparatus
JPH1089904A (ja) * 1996-09-17 1998-04-10 Hitachi Electron Eng Co Ltd Ｖノッチウェハ位置決め装置
JPH10253396A (ja) * 1997-03-10 1998-09-25 Nidec Shimpo Corp ロータリエンコーダ
JP3380147B2 (ja) * 1997-11-13 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
US6082951A (en) * 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station

Also Published As

Publication number Publication date
KR20010085928A (ko) 2001-09-07
EP1121672A1 (en) 2001-08-08
WO2000022589A1 (en) 2000-04-20
TW445496B (en) 2001-07-11
EP1121672A4 (en) 2009-05-06
JP2002527897A (ja) 2002-08-27
JP4616477B2 (ja) 2011-01-19
WO2000022589A9 (en) 2000-09-21
US6188323B1 (en) 2001-02-13

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