TW445496B - Wafer mapping system - Google Patents
Wafer mapping system Download PDFInfo
- Publication number
- TW445496B TW445496B TW088117810A TW88117810A TW445496B TW 445496 B TW445496 B TW 445496B TW 088117810 A TW088117810 A TW 088117810A TW 88117810 A TW88117810 A TW 88117810A TW 445496 B TW445496 B TW 445496B
- Authority
- TW
- Taiwan
- Prior art keywords
- receiver
- door panel
- wafer
- workpiece
- transmitter
- Prior art date
Links
- 238000013507 mapping Methods 0.000 title claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 19
- 230000002079 cooperative effect Effects 0.000 claims description 14
- 235000015170 shellfish Nutrition 0.000 claims description 8
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 239000008186 active pharmaceutical agent Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 285
- 238000000034 method Methods 0.000 abstract description 52
- 230000008569 process Effects 0.000 abstract description 46
- 238000012546 transfer Methods 0.000 abstract description 19
- 238000003384 imaging method Methods 0.000 description 55
- 230000007246 mechanism Effects 0.000 description 25
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 10
- 230000008901 benefit Effects 0.000 description 10
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 239000002775 capsule Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 210000005069 ears Anatomy 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 206010011878 Deafness Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/173,710 US6188323B1 (en) | 1998-10-15 | 1998-10-15 | Wafer mapping system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW445496B true TW445496B (en) | 2001-07-11 |
Family
ID=22633178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088117810A TW445496B (en) | 1998-10-15 | 1999-12-16 | Wafer mapping system |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6188323B1 (enExample) |
| EP (1) | EP1121672A4 (enExample) |
| JP (1) | JP4616477B2 (enExample) |
| KR (1) | KR100589753B1 (enExample) |
| TW (1) | TW445496B (enExample) |
| WO (1) | WO2000022589A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI425590B (zh) * | 2007-12-20 | 2014-02-01 | Dainippon Screen Mfg | 基板處理裝置及其基板搬送方法 |
| TWI812466B (zh) * | 2017-11-06 | 2023-08-11 | 日商昕芙旎雅股份有限公司 | 對照方法，設備前端模組 |
Families Citing this family (77)
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| JPH11144496A (ja) * | 1997-11-10 | 1999-05-28 | Nec Corp | Ｌｓｉセル位置情報出力装置、出力方法およびｌｓｉセル位置情報出力プログラムの記録媒体 |
| FR2778496B1 (fr) | 1998-05-05 | 2002-04-19 | Recif Sa | Procede et dispositif de changement de position d'une plaque de semi-conducteur |
| US20040075822A1 (en) * | 1998-07-03 | 2004-04-22 | Nikon Corporation | Exposure apparatus and its making method, substrate carrying method, device manufacturing method and device |
| US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
| US6075334A (en) * | 1999-03-15 | 2000-06-13 | Berkeley Process Control, Inc | Automatic calibration system for wafer transfer robot |
| US6591162B1 (en) | 2000-08-15 | 2003-07-08 | Asyst Technologies, Inc. | Smart load port with integrated carrier monitoring and fab-wide carrier management system |
| KR100741186B1 (ko) * | 2000-08-23 | 2007-07-19 | 동경 엘렉트론 주식회사 | 피처리체의 처리시스템 |
| US6848876B2 (en) | 2001-01-12 | 2005-02-01 | Asyst Technologies, Inc. | Workpiece sorter operating with modular bare workpiece stockers and/or closed container stockers |
| US6452503B1 (en) * | 2001-03-15 | 2002-09-17 | Pri Automation, Inc. | Semiconductor wafer imaging system |
| US6717171B2 (en) * | 2001-06-05 | 2004-04-06 | Semitool, Inc. | Method and apparatus for accessing microelectronic workpiece containers |
| US6897463B1 (en) * | 2001-07-13 | 2005-05-24 | Cyberoptics Semiconductor, Inc. | Wafer carrier mapping sensor assembly |
| US6530736B2 (en) * | 2001-07-13 | 2003-03-11 | Asyst Technologies, Inc. | SMIF load port interface including smart port door |
| US6825486B1 (en) * | 2001-07-13 | 2004-11-30 | Cyberoptics Corporation | System for mapping wafers using predictive dynamic lighting |
| US7100340B2 (en) * | 2001-08-31 | 2006-09-05 | Asyst Technologies, Inc. | Unified frame for semiconductor material handling system |
| US7066707B1 (en) | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
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| JP4669643B2 (ja) * | 2001-09-17 | 2011-04-13 | ローツェ株式会社 | ウエハマッピング装置およびそれを備えたロードポート |
| US6914233B2 (en) * | 2001-12-12 | 2005-07-05 | Shinko Electric Co., Ltd. | Wafer mapping system |
| US7054713B2 (en) * | 2002-01-07 | 2006-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Calibration cassette pod for robot teaching and method of using |
| FR2835337B1 (fr) * | 2002-01-29 | 2004-08-20 | Recif Sa | Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation |
| KR100490203B1 (ko) * | 2002-02-04 | 2005-05-17 | 삼성전자주식회사 | 웨이퍼 맵핑 방법 |
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| JP2003303869A (ja) * | 2002-04-05 | 2003-10-24 | Sankyo Seiki Mfg Co Ltd | 基板搬送装置における蓋部材開閉装置 |
| JP4118592B2 (ja) * | 2002-04-22 | 2008-07-16 | 富士通株式会社 | ロードポート及び半導体製造装置 |
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| US7677859B2 (en) * | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
| DE10250353B4 (de) * | 2002-10-25 | 2008-04-30 | Brooks Automation (Germany) Gmbh | Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten |
| JP3916148B2 (ja) * | 2002-11-15 | 2007-05-16 | Ｔｄｋ株式会社 | ウェハーマッピング機能を備えるウェハー処理装置 |
| US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
| WO2004054755A2 (fr) * | 2002-12-13 | 2004-07-01 | Recif | Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture |
| KR100511373B1 (ko) * | 2003-02-20 | 2005-08-30 | 주식회사 신성이엔지 | 후프오프너 매핑장치 |
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| US7720558B2 (en) * | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
| JP4012189B2 (ja) * | 2004-10-26 | 2007-11-21 | Ｔｄｋ株式会社 | ウエハ検出装置 |
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| TWI463587B (zh) | 2005-07-08 | 2014-12-01 | Asyst Technologies | 工件支撐結構及使用該結構之裝置 |
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| KR100754271B1 (ko) * | 2005-12-13 | 2007-09-03 | 동부일렉트로닉스 주식회사 | 에스엠아이에프 시스템 |
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| JP4893425B2 (ja) * | 2007-03-30 | 2012-03-07 | 東京エレクトロン株式会社 | 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体 |
| JP4740414B2 (ja) * | 2007-04-24 | 2011-08-03 | 東京エレクトロン株式会社 | 基板搬送装置 |
| KR101571182B1 (ko) * | 2007-12-27 | 2015-11-23 | 램 리써치 코포레이션 | 플라즈마 프로세싱 시스템에서 엔드 이펙터 정렬을 교정하는 방법 및 시스템 |
| KR101590655B1 (ko) * | 2007-12-27 | 2016-02-18 | 램 리써치 코포레이션 | 동적 정렬 빔 교정의 방법 및 시스템 |
| JP5409649B2 (ja) * | 2007-12-27 | 2014-02-05 | ラム リサーチ コーポレーション | 位置およびオフセットを決定するためのシステムおよび方法 |
| CN101911276B (zh) * | 2007-12-27 | 2012-04-25 | 朗姆研究公司 | 使用至少一个光源校准末端执行器对准的系统和方法 |
| US20100034621A1 (en) * | 2008-04-30 | 2010-02-11 | Martin Raymond S | End effector to substrate offset detection and correction |
| JP4488255B2 (ja) * | 2008-05-27 | 2010-06-23 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法 |
| TWI330707B (en) | 2008-08-27 | 2010-09-21 | Gudeng Prec Industral Co Ltd | A system for measuring the vertical distance between the thin substrates |
| US8234003B2 (en) * | 2009-01-20 | 2012-07-31 | Macronix International Co., Ltd. | Monitoring circuit, monitoring device and monitoring method thereof |
| TWI384578B (zh) * | 2009-02-13 | 2013-02-01 | Macronix Int Co Ltd | 監測電路、監測裝置及其監測方法 |
| US8275478B2 (en) * | 2009-03-13 | 2012-09-25 | Globalfoundries Inc. | Method and apparatus for routing wafer pods to allow parallel processing |
| DE102009042891A1 (de) * | 2009-09-24 | 2011-03-31 | Giesecke & Devrient Gmbh | Behälter und System für die Bearbeitung von Banknoten |
| WO2011062138A1 (ja) | 2009-11-17 | 2011-05-26 | シンフォニアテクノロジー株式会社 | ウエハ検出装置 |
| JP5168329B2 (ja) * | 2010-08-31 | 2013-03-21 | Ｔｄｋ株式会社 | ロードポート装置 |
| TWI627696B (zh) | 2013-01-22 | 2018-06-21 | 布魯克斯自動機械公司 | 基材運送 |
| CN103217187B (zh) * | 2013-03-01 | 2015-07-15 | 合肥京东方光电科技有限公司 | 识别实物在容器内的层号的设备及自动取出实物的系统 |
| US9545724B2 (en) | 2013-03-14 | 2017-01-17 | Brooks Automation, Inc. | Tray engine with slide attached to an end effector base |
| KR101432137B1 (ko) * | 2013-03-27 | 2014-08-20 | 주식회사 싸이맥스 | 웨이퍼의 존재 유무 및 위치를 검출하는 일체형 매핑바가 형성된 매핑장치 |
| JP6309756B2 (ja) * | 2013-12-26 | 2018-04-11 | 川崎重工業株式会社 | エンドエフェクタ装置 |
| JP6248788B2 (ja) * | 2014-04-28 | 2017-12-20 | シンフォニアテクノロジー株式会社 | ウエハマッピング装置およびそれを備えたロードポート |
| US9966290B2 (en) | 2015-07-30 | 2018-05-08 | Lam Research Corporation | System and method for wafer alignment and centering with CCD camera and robot |
| KR102522899B1 (ko) * | 2016-02-05 | 2023-04-19 | (주)테크윙 | 전자부품 적재상태 점검장치 |
| JP6689539B2 (ja) * | 2016-08-12 | 2020-04-28 | 株式会社ディスコ | 判定装置 |
| JP6697984B2 (ja) * | 2016-08-31 | 2020-05-27 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| WO2019109020A1 (en) * | 2017-11-30 | 2019-06-06 | Leica Biosystems Imaging, Inc. | Safety light curtain to disable carousel rotation |
| US11469123B2 (en) | 2019-08-19 | 2022-10-11 | Applied Materials, Inc. | Mapping of a replacement parts storage container |
| US12002696B2 (en) * | 2020-06-30 | 2024-06-04 | Brooks Automation Us, Llc | Substrate mapping apparatus and method therefor |
| US20220258363A1 (en) * | 2021-02-12 | 2022-08-18 | Hine Automation, Llc | Devices and Methods for Improved Detection of Anomalous Substrates in Automated Material-Handling Systems |
| JP7714946B2 (ja) * | 2021-07-27 | 2025-07-30 | 信越半導体株式会社 | ウェーハ搬送方法およびウェーハ搬送装置 |
| KR102714618B1 (ko) * | 2022-02-15 | 2024-10-07 | 정경미 | 웨이퍼 맵핑 장치 |
| JP2023122739A (ja) * | 2022-02-24 | 2023-09-05 | 株式会社ディスコ | 搬送装置 |
| US12394647B2 (en) * | 2022-09-23 | 2025-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer shift detection |
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| US4532970A (en) * | 1983-09-28 | 1985-08-06 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
| US4534389A (en) * | 1984-03-29 | 1985-08-13 | Hewlett-Packard Company | Interlocking door latch for dockable interface for integrated circuit processing |
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| US4806773A (en) * | 1984-10-18 | 1989-02-21 | Canon Kabushiki Kaisha | Wafer position detecting method and apparatus |
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-
1998
- 1998-10-15 US US09/173,710 patent/US6188323B1/en not_active Expired - Lifetime
-
1999
- 1999-10-13 JP JP2000576424A patent/JP4616477B2/ja not_active Expired - Lifetime
- 1999-10-13 EP EP99954634A patent/EP1121672A4/en not_active Withdrawn
- 1999-10-13 KR KR1020017004782A patent/KR100589753B1/ko not_active Expired - Lifetime
- 1999-10-13 WO PCT/US1999/021619 patent/WO2000022589A1/en not_active Ceased
- 1999-12-16 TW TW088117810A patent/TW445496B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI425590B (zh) * | 2007-12-20 | 2014-02-01 | Dainippon Screen Mfg | 基板處理裝置及其基板搬送方法 |
| TWI812466B (zh) * | 2017-11-06 | 2023-08-11 | 日商昕芙旎雅股份有限公司 | 對照方法，設備前端模組 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1121672A4 (en) | 2009-05-06 |
| KR100589753B1 (ko) | 2006-06-15 |
| US6188323B1 (en) | 2001-02-13 |
| KR20010085928A (ko) | 2001-09-07 |
| EP1121672A1 (en) | 2001-08-08 |
| JP2002527897A (ja) | 2002-08-27 |
| WO2000022589A9 (en) | 2000-09-21 |
| JP4616477B2 (ja) | 2011-01-19 |
| WO2000022589A1 (en) | 2000-04-20 |
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