WO2011062138A1 - ウエハ検出装置 - Google Patents
ウエハ検出装置 Download PDFInfo
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- WO2011062138A1 WO2011062138A1 PCT/JP2010/070283 JP2010070283W WO2011062138A1 WO 2011062138 A1 WO2011062138 A1 WO 2011062138A1 JP 2010070283 W JP2010070283 W JP 2010070283W WO 2011062138 A1 WO2011062138 A1 WO 2011062138A1
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Definitions
- the present invention relates to a wafer detection device for detecting the accommodation state of a wafer accommodated in a wafer container that accommodates a plurality of wafers.
- a wafer container has been used in which a plurality of wafers are accommodated in slots provided in the wafer container, and the accommodated wafers can be taken in and out through a front opening.
- Such a wafer container is transferred by a robot or the like and placed on an opening / closing device (hereinafter referred to as a load port) that opens and closes the lid of the wafer container.
- This load port is an additional device attached to, for example, a wafer processing apparatus that performs predetermined processing on a wafer.
- the wafer detection apparatus of Patent Document 1 is a light transmission type apparatus, in which a transmitter for light irradiation is arranged on one side of the wafer in the left-right direction, and a receiver for receiving light emitted from the transmitter is arranged on the other side. Accordingly, the light reaching the receiver from the transmitter is shielded by the wafer, and by detecting the shielded vertical width, it is possible to confirm the cross slot state in addition to the overlapping state. Further, when there is a region that is not shielded at all, it is possible to check the state of the wafer being removed.
- the wafer may be bent or warped by heat treatment during semiconductor manufacturing or by its own weight.
- the width in the vertical direction that is shielded from light increases, and the above-described plural sheets are in an overlapping state despite the fact that there is only one wafer. May be erroneously detected.
- the wafer becomes larger for example, from 300 mm to 450 mm
- the number of false detections increases.
- This detection apparatus includes an illumination light source in the upper part of the detection head and an imaging apparatus in the lower part. Therefore, the light from the illumination light source is irradiated onto the end surface of the wafer, and the reflected light from the end surface is imaged by the imaging device, so that the above-described wafer can be removed even if the wafer is bent or warped.
- the cross slot state can be reliably detected in addition to the state and the overlapping state of the plurality of sheets, there are the following three disadvantages.
- an illumination light source (not shown) in the detection head K irradiates light from the front of the wafer W in the XA direction as shown in FIG.
- Light cannot be irradiated from the XB and XC directions on both the left and right sides.
- the range that can be imaged by an imaging device (not shown) in the detection head K is a narrow range near the central portion in the left-right direction of the wafer W, and thus is affected by partial contamination of the wafer W. It is easy to detect the cross slot state.
- the illumination light source and the imaging device can be moved in the left-right direction in FIG. 13 to reliably detect the cross slot state, the wafer can be imaged at a plurality of locations in the left-right direction, but the overall configuration of the device is complicated. In addition, the detection time increases and it is difficult to implement.
- an object of the invention is to provide a wafer detection apparatus capable of accurately detecting a wafer accommodation state.
- the wafer detection apparatus of the present invention is capable of accommodating a plurality of wafers stacked in the vertical direction in order to solve the above-described problem, and the wafer storage state in the wafer storage container in which the wafers stored from the front can be taken in and out.
- a wafer detection device for detection which is a vertically long illuminating device for irradiating light to the wafer in the wafer container, and light from the illuminating device hits the wafer and is reflected, and the reflected light is incident
- the imaging device is disposed on the front side of the wafer container, and the illumination device is disposed on at least one of the left and right sides of the imaging device.
- the illumination device is disposed on at least one of the left and right sides of the imaging device, and the imaging device is disposed on the front side of the wafer container, whereby the optical axis of the illumination device and the optical axis of the imaging device are arranged. Therefore, the light from the illuminator is reflected by the inner wall surface of the wafer container and reflected, and the reflected light impinges on the edge of the wafer and bounces back to the imaging device. it can. That is, the inconvenience of FIG. 11 can be solved. Moreover, since the lighting device has a vertically long shape that is long in the vertical direction, light can be irradiated over a predetermined range in the vertical direction.
- the two wafers can be irradiated with light from above and below.
- the light from the illumination device can be reliably applied to both the end face of the upper wafer and the end face of the lower wafer.
- the illumination device arranged on at least one of the left and right sides of the imaging device irradiates light on at least one of the left and right sides of the wafer, and the end surface of at least one of the sides of the wafer Is imaged by an imaging device.
- the cross slot state since the image of the wafer in which the inclination in the horizontal direction is greatly different on the left and right sides compared to the left and right center part, the image of the wafer on at least one of the left and right sides is obtained.
- the cross slot state can be reliably detected. That is, the inconvenience of FIG. 13 can be solved.
- the range in which the illumination device illuminates the wafer may be configured to irradiate the end faces of all the wafers in the vertical direction, or at least overlap so that the overlapping state of a plurality of wafers can be reliably detected.
- the imaging device is preferably arranged at a position that is in front of the wafer container, but may not necessarily be in front if it is between the illumination devices on both sides. That is, any position may be used as long as it is the front side of the wafer container.
- the wafer is accommodated. It is possible to provide a wafer detection apparatus capable of accurately detecting.
- An illuminating device is shown, (a) is the side view, (b) is the top view. It is explanatory drawing which shows the imaging range in the up-down direction of an imaging device.
- (A) is a front view which shows the state in which the accommodation state of a wafer is normal
- (b) is a figure which shows the image which imaged (a).
- A) is a front view showing a state in which a plurality of wafers are overlapped
- (b) is a diagram showing an image obtained by imaging (a).
- (A) is a front view which shows the cross slot state of a wafer
- (b) is a figure which shows the image which imaged (a). It is a top view which is imaging the wafer in a square-shaped wafer storage container. It is a top view which is imaging the wafer in a round shaped wafer storage container. It is a side view which is imaged in a state where the upper wafer of the two stacked wafers has moved forward relative to the lower wafer. It is a side view which shows the state in which the light reflected on the inner wall face of the wafer container in the conventional wafer detection apparatus is input into an imaging device with the reflected light from a wafer end surface.
- FIG. 1 and 2 show a wafer detection apparatus according to the present embodiment.
- illumination devices 3 and 3 disposed on the left and right sides of a load port 2 on which a wafer container 1 that accommodates a wafer W is placed, and light from the illumination devices 3 and 3 are applied to the end surface of the wafer W.
- An imaging device 4 is provided for receiving reflected light that has been irradiated and reflected from the end face to pick up an image of the end face.
- the reflection type wafer detection device it is possible to detect the wafer without causing any problem with respect to the bending or warping of the wafer.
- the wafer storage container 1 includes a housing 11 having an open front, and a number of slots 12 for storing and storing wafers W in the housing 11 at predetermined intervals in the vertical direction (FIG. 5A). And a lid 13 for closing an opening for taking in and out the wafer W from the front of the housing 11.
- the casing 11 and the lid 13 are partially or entirely made of a transparent or translucent material so that the wafer W inside can be seen through, but may be made of a material that cannot be seen through.
- the load port 2 includes a transfer table 21 on which the wafer container 1 is mounted and an opening / closing part 22 for opening / closing the lid 13.
- the transfer robot 5 is configured so that the wafer W in the wafer container 1 can be taken out and processed in a manufacturing apparatus (not shown) and then returned to the wafer container 1.
- the transfer robot 5 includes a hand 51 for gripping the wafer W, telescopic arms 52 and 53 for moving the hand 51 in the front-rear direction, and elevating and lowering the hand 51 and the telescopic arms 52 and 53.
- a shaft 54 is provided.
- the imaging device 4 is attached to the upper surface of the base end portion of the hand 51, and the imaging device 4 can be moved up and down by the lifting shaft 54. Further, the imaging device 4 is connected to the image processing unit 6, and processes the images captured by the imaging device 4 to create images on the left and right sides of the wafer W, for example, as shown in FIG. .
- each of the illumination devices 3 is disposed in a longitudinally long casing 31 having a length extending over the entire vertical direction of the wafer container 1 and the casing 31.
- a large number of infrared LED elements 32 are provided. And although the left and right illuminating devices 3 and 3 are each attached via the attachment member which is not shown in figure on both the right and left sides of the said load port 2, you may install independently.
- the large number of infrared LED elements 32 are composed of 60 infrared LED elements 32 in total, and 60 of them are arranged in a grid in the vertical and horizontal directions.
- a light diffusing plate 33 is attached to the front surface of the casing 31, and the illumination device 3 is configured as a diffusing light source having a vertically long shape that can irradiate light uniformly over the entire vertical direction of the wafer container 1. Yes.
- the imaging device 4 includes a CCD camera 41, a lens 42 integrated at the front end of the CCD camera 41, and a filter 43 attached to the entire surface of the lens 42.
- the filter 43 has a property of transmitting the emission wavelength of the infrared LED element and cutting visible light, and thereby, disturbing light (illumination of a fluorescent lamp installed in a clean room) inserted from the housing 11. Light, etc.) can be blocked or attenuated so as not to interfere with detection of reflected light from the wafer end face.
- the opening / closing portion 22 of the load port 2 opens the lid 13
- the opening / closing portion 22 is lowered downward while holding the lid 13 (see FIG. 1).
- the transfer robot 5 can access the wafer container 1.
- the operation of detecting the accommodation state of the internal wafer W is started.
- the illumination devices 3 and 3 on both the left and right sides are turned on to irradiate the left and right sides of the wafer W with the light from the illumination devices 3 and 3.
- the imaging device 4 is lowered by a predetermined distance from the wafer W positioned at the uppermost position toward the wafer W positioned at the lowermost position, and an image of the wafer W in a predetermined range that can be imaged is captured.
- the wafers W may be imaged one by one, but the imaging range S of the imaging device 4 is set so that a plurality of (for example, three) wafers W can be imaged as shown in FIG. It may be set.
- the image processing unit 6 performs image processing to detect the accommodation state of the wafers W in the wafer container 1. finish.
- FIG. 5B As shown in FIG. 5A, a captured image in the case where the wafer W is stored in a normal state is shown, and images of the end surfaces of only the left and right sides of each wafer W are displayed on the display screen H. Has been.
- the third stage slot 12 has no wafer W
- the second stage slot 12 has two wafers W and W overlapped.
- the captured image G ⁇ b> 1 in a state where the wafers are in an overlapping state (a plurality of overlapping states) is shown, and images of the end faces of only the left and right sides of each wafer W are displayed on the display screen H. This is because, by making the illuminating device long vertically long, it is possible to irradiate the wafers W and W with light from above and light from below, so that a plurality of overlapping states are reliably detected.
- the captured image G1 can be displayed.
- FIG. 7B as shown in FIG. 7A, the right end portion of the wafer W to be placed in the second-stage slot 12 is placed in the third-stage slot 12.
- a captured image G2 in a so-called cross-slot state is shown, and images of the end surfaces of only the left and right sides of each wafer W are displayed on the display screen H. This is because the image of the wafer on both the left and right sides of the wafer is captured, so that the image of the wafer in which the vertical position (or inclination in the horizontal direction) differs greatly on both sides in the vertical direction can be detected reliably.
- the captured image G2 can be displayed.
- the lighting devices 3 and 3 are arranged on both the left and right sides of the load port 2, and light is applied to the front surface of the load port 2 from an oblique direction that is approximately 60 degrees (the angle may be any number).
- the casing 11 of the wafer container 1 of FIG. 8 is square, the following advantages are obtained. That is, when light is irradiated from the illumination devices 3 and 3, a part of the irradiation light does not hit the wafer W but reaches the wall surface 11A of the housing 11 and is reflected. The light does not enter the imaging device 4 that does not face the wall surface 11 ⁇ / b> A of the housing 11. As a result, there is an advantage that the wafer W can be reliably imaged without being able to image the wafer W.
- the light from one lighting device 3 is reflected at the point A on the curved surface, and the reflection thereof.
- the light A1 and the light beam B1 reflected at the end surface B point of the wafer W from the other illumination device 3 are incident on the image pickup device 4 and cannot display an accurate image of the wafer W. .
- the two illuminating devices 3 and 3 are alternately turned on to perform imaging for two times, the two lights A1 and B1 do not overlap and enter the imaging device 4, and the wafer W is surely attached. An image can be taken.
- an element with a fast response speed such as an LED for the lighting devices 3 and 3
- FIG. 10 shows a case where the wafers W overlap each other and the upper wafer W1 is displaced forward with respect to the lower wafer W2. And it is a case where the state is continuing in the up-down direction (in FIG. 10, it is continuing three places in the up-down direction).
- the wafer detection apparatus of the present embodiment all of the end surfaces of the wafers W, W, which overlap each other in three places in FIG. Since irradiation can be performed, even if there are two overlapping wafers W1 and W2 as shown in FIG. 10 at all locations, the end faces of all the wafers W1 and W2 are reliably imaged by the imaging device 4. be able to.
- FIG. 10 shows a case where the wafers W overlap each other and the upper wafer W1 is displaced forward with respect to the lower wafer W2. And it is a case where the state is continuing in the up-down direction (in FIG. 10, it is continuing three places in the up-down direction).
- the viewing angle of the imaging device 4 is an angle at which the end faces of the wafers W1, W2, W1, and W2 that overlap at two locations indicated by the solid line can be imaged. Accordingly, the wafers W1 and W2 indicated by the broken lines image the end faces of the wafers W1, W2, W1, and W2 that overlap at two locations indicated by the solid lines, and then the wafers W1 and W2 indicated by the broken lines are at the viewing angle of the imaging device 4.
- the imaging device 4 is moved up and down (actually lowered) to the height position where it enters, and the image is taken. In this way, by performing the detection multiple times by limiting the imaging range by one imaging, for example, when imaging all wafers by one imaging, an error occurs in the detection of the height position of the wafer. There is an effect that can be prevented.
- the infrared LED element 32 is used for the illumination device 3, but various light sources that irradiate near infrared rays such as an incandescent lamp may be used. Further, it may be a fluorescent lamp that is long in the vertical direction.
- the infrared LED element 32 is used in the illumination device 3 and the filter 43 that blocks visible light is attached to the imaging device 4, thereby reducing the influence of ambient light entering the wafer container 1. .
- the light of the fluorescent lamp as the indoor lighting used in the clean room of the semiconductor factory can be reduced to a level that does not cause a problem in imaging, but if there is disturbance light including near infrared rays such as sunlight, the filter 43 Then, disturbance light may not be removed.
- a light shielding plate for blocking ambient light may be provided on the side opposite to the imaging device 4 with the wafer container 1 interposed therebetween. Moreover, it can also be provided with a raising / lowering mechanism for raising / lowering this light-shielding plate as needed. That is, when there is no wafer storage container 1, the light shielding plate is lowered by the elevating mechanism so that it can be stored in the transfer table 21, and the wafer storage container 1 is transferred to the transfer table 21 and is captured by the imaging device 4. Before the start of imaging, the light shielding plate may be protruded upward from the transfer table 21 by an elevating mechanism so that ambient light can be blocked.
- the material of the light shielding plate a non-transparent metal plate, a resin plate, or the like can be used, but a material that transmits visible light that can be blocked by the filter 43 and shields near infrared light that passes through the filter 43 is used.
- the load port 2 and the wafer W in the wafer container 1 can be visually confirmed from the outside through the light shielding plate without being affected by disturbance light.
- the illumination device 3 is configured to be vertically elongated so as to irradiate the entire region in the vertical direction of the wafer container 1.
- the illumination device 3 may be configured to irradiate light only to a predetermined region in the vertical direction of the wafer container 1. Good.
- an elevating mechanism that elevates and lowers the illumination device in synchronization with the elevating and lowering of the imaging device 4 is provided.
- the two illumination devices 3 and 3 are provided on the left and right sides, and the images of the end surfaces of the two left and right sides of the wafer W are taken, so that the reliability of detecting the accommodation state of the wafer W can be improved.
- the lighting device may be arranged only on either the left or right side for imaging. In this case, for example, it is possible to detect the tilt of the wafer W by imaging only the right side of FIG.
- three or more illumination devices may be provided. In this case, when the illuminating device has a problem in removing the wafer W, a moving mechanism for moving the illuminating device to an unobstructed place is provided.
- the wafer container 1 is transferred from above the load port 2 by an overhead traveling transfer device or the like, it is not necessary to store the light shielding plate on the transfer table 21.
- the imaging device 4 is attached to the transport robot 5.
- the imaging device 4 may be provided in a lifting mechanism different from the transport robot 5.
- the single imaging device 4 is provided, but a plurality of imaging devices may be provided.
- the optical axis of the imaging device 4 is horizontal is shown, but the optical axis may be set downward or upward. With this setting, even if strong disturbance light that cannot be sufficiently blocked by the filter 43 is incident through the housing 11, the reflected light from the wafer edge and the disturbance light do not overlap and enter the imaging device 4. The reliability of wafer detection can be further increased. Note that the downward angle range or the upward angle range is set to such a range that the lower wafer end face cannot be detected when the wafer is displaced forward.
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Abstract
Description
第1の不都合としては、図11に示すように、検出ヘッドK内において照明光源100が撮像装置101の上方に位置しているため、照明光源100からの光軸100aが斜め下方に向いた状態になる。このとき照明光源100の光軸以外の光100bがウエハ収容容器の内壁面102に当たって反射し、その反射した光101cがウエハWの端面からの反射光101dと一緒に撮像装置101に入射してしまう。その結果、ウエハWの端面の画像を検出することができない。尚、前記撮像装置101の前方には、投影レンズ101Aが配置されている。
しかも、照明装置が上下方向に長い縦長状であることから、上下方向において所定範囲に渡って光を照射することができる。このことから、重なり合っている2枚のウエハのうちの上側のウエハが前側(蓋側)に移動してしまった状態においても、これら2枚のウエハに上下から光を当てることができるから、重なっている上側のウエハの端面及び下側のウエハの端面の両方に確実に照明装置からの光を当てることができる。その結果、ウエハの複数枚重なり状態を確実に検出することができる。つまり、図12の不都合を解消できる。
更に、撮像装置の左右両側のうちの少なくとも一方側に配置された照明装置によって、ウエハの左右両側のうちの少なくとも一方側の端面に光を照射し、ウエハの両側のうちの少なくとも一方側の端面を撮像装置にて撮像する。このようにすることによって、クロススロット状態であれば、左右中央部に比べて左右両側で水平方向における傾きが大きく異なるウエハの画像になることから、左右両側のうちの少なくとも一方側のウエハの画像によりクロススロット状態を確実に検出することができる。つまり、図13の不都合を解消できる。
更にまた、反射型のウエハ検出装置を用いることによって、ウエハの撓みや反りに対しても何ら不具合が出ることなく、ウエハを検出することができる。
前記照明装置がウエハを照らす範囲は、上下方向において全てのウエハの端面を照射する構成であってもよいし、ウエハの複数枚重なり状態を確実に検出することができるように、少なくとも重なっている2枚のウエハの端面に光を確実に当てることができる範囲に設定してもよい。尚、一部のウエハの端面を照射する構成では、照明装置と撮像装置とが一体的に昇降しながら、撮像する構成が好ましい。また、撮像装置は、ウエハ収容容器に対して正面となる位置に配置されることが好ましいが、両側の照明装置の間であれば、必ずしも正面でなくてもよい。つまり、ウエハ収容容器の前側であれば、どの位置でもよい。
図5(b)では、図5の(a)に示すように、ウエハWの収容状態が正常の場合の撮像画像を示し、各ウエハWの左右両側のみの端面の画像が表示画面Hに表示されている。
Claims (1)
- 複数のウエハを上下方向に積んで収容可能で、前方から収容したウエハを出し入れ可能なウエハ収容容器内のウエハの収容状態を検出するウエハ検出装置であって、
前記ウエハ収容容器内のウエハに光照射を行う上下方向に長い縦長状の照明装置と、該照明装置からの光がウエハに当たって反射し、その反射光が入射される撮像装置とを備え、前記撮像装置が、前記ウエハ収容容器の前側に配置され、前記照明装置が、前記撮像装置の左右両側のうちの少なくとも一方側に配置されていることを特徴とするウエハ検出装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2011541913A JP5881007B2 (ja) | 2009-11-17 | 2010-11-15 | ウエハ検出装置 |
CN201080045740.7A CN102576687B (zh) | 2009-11-17 | 2010-11-15 | 晶圆检测装置 |
US13/468,353 US8837777B2 (en) | 2009-11-17 | 2012-05-10 | Wafer detecting apparatus |
HK12110265.3A HK1169742A1 (zh) | 2009-11-17 | 2012-10-17 | 晶圓檢測裝置 |
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JP2009-262020 | 2009-11-17 | ||
JP2009262020 | 2009-11-17 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/468,353 Continuation US8837777B2 (en) | 2009-11-17 | 2012-05-10 | Wafer detecting apparatus |
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WO2011062138A1 true WO2011062138A1 (ja) | 2011-05-26 |
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US (1) | US8837777B2 (ja) |
JP (1) | JP5881007B2 (ja) |
KR (1) | KR20120103565A (ja) |
CN (1) | CN102576687B (ja) |
HK (1) | HK1169742A1 (ja) |
TW (1) | TWI496231B (ja) |
WO (1) | WO2011062138A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
JP5881007B2 (ja) | 2016-03-09 |
KR20120103565A (ko) | 2012-09-19 |
HK1169742A1 (zh) | 2013-02-01 |
US20120281875A1 (en) | 2012-11-08 |
TW201138001A (en) | 2011-11-01 |
CN102576687A (zh) | 2012-07-11 |
US8837777B2 (en) | 2014-09-16 |
JPWO2011062138A1 (ja) | 2013-04-04 |
TWI496231B (zh) | 2015-08-11 |
CN102576687B (zh) | 2015-11-25 |
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