HK1169742A1 - 晶圓檢測裝置 - Google Patents

晶圓檢測裝置

Info

Publication number
HK1169742A1
HK1169742A1 HK12110265.3A HK12110265A HK1169742A1 HK 1169742 A1 HK1169742 A1 HK 1169742A1 HK 12110265 A HK12110265 A HK 12110265A HK 1169742 A1 HK1169742 A1 HK 1169742A1
Authority
HK
Hong Kong
Prior art keywords
detecting apparatus
wafer detecting
wafer
detecting
Prior art date
Application number
HK12110265.3A
Other languages
English (en)
Inventor
安田克己
神垣敏雄
溝河巧
Original Assignee
昕芙旎雅有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昕芙旎雅有限公司 filed Critical 昕芙旎雅有限公司
Publication of HK1169742A1 publication Critical patent/HK1169742A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK12110265.3A 2009-11-17 2012-10-17 晶圓檢測裝置 HK1169742A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009262020 2009-11-17
PCT/JP2010/070283 WO2011062138A1 (ja) 2009-11-17 2010-11-15 ウエハ検出装置

Publications (1)

Publication Number Publication Date
HK1169742A1 true HK1169742A1 (zh) 2013-02-01

Family

ID=44059616

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12110265.3A HK1169742A1 (zh) 2009-11-17 2012-10-17 晶圓檢測裝置

Country Status (7)

Country Link
US (1) US8837777B2 (zh)
JP (1) JP5881007B2 (zh)
KR (1) KR20120103565A (zh)
CN (1) CN102576687B (zh)
HK (1) HK1169742A1 (zh)
TW (1) TWI496231B (zh)
WO (1) WO2011062138A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5880265B2 (ja) * 2012-05-07 2016-03-08 株式会社ダイフク 基板収納設備
KR20230037672A (ko) 2013-01-22 2023-03-16 브룩스 오토메이션 인코퍼레이티드 기판 이송기
US9157868B2 (en) * 2013-03-07 2015-10-13 Kla-Tencor Corporation System and method for reviewing a curved sample edge
JP6309220B2 (ja) * 2013-08-12 2018-04-11 株式会社ダイヘン 搬送システム
KR102162366B1 (ko) 2014-01-21 2020-10-06 우범제 퓸 제거 장치
KR102522899B1 (ko) * 2016-02-05 2023-04-19 (주)테크윙 전자부품 적재상태 점검장치
JP6602691B2 (ja) * 2016-02-26 2019-11-06 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置
CN107799430B (zh) * 2016-08-29 2021-10-15 北京北方华创微电子装备有限公司 晶片位置检测方法
KR101982918B1 (ko) * 2017-05-02 2019-05-27 이충기 카세트용 소재 시트 단부 검출장치
US10784134B2 (en) * 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper
CN108716895A (zh) * 2018-05-18 2018-10-30 北京锐洁机器人科技有限公司 桌面级翘曲度扫描方法及设备
US10549427B1 (en) * 2018-08-31 2020-02-04 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot
JP7346839B2 (ja) * 2019-02-15 2023-09-20 Tdk株式会社 ロードポート
KR20220018043A (ko) * 2019-06-10 2022-02-14 미크로 기켄 가부시키가이샤 출하 검사 장치, 이것을 갖는 포장 장치 및 포장 시스템
CN110931409A (zh) * 2019-11-26 2020-03-27 武汉新芯集成电路制造有限公司 晶圆位置识别系统及方法
JP7447661B2 (ja) * 2020-04-23 2024-03-12 Tdk株式会社 板状対象物の配列検出装置およびロードポート
JP2022131428A (ja) * 2021-02-26 2022-09-07 Ckd株式会社 ウエハ検出システム
US20220285186A1 (en) * 2021-03-03 2022-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. Method for mapping wafers in a wafer carrier
CN114379830B (zh) * 2022-03-23 2022-06-10 南京伟测半导体科技有限公司 一种晶舟盒内晶圆位置检测装置
CN114975195B (zh) * 2022-04-06 2023-06-30 深圳市深科达智能装备股份有限公司 晶圆盒、晶圆搬运设备、晶圆搬运控制方法、电气设备及存储介质

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Publication number Priority date Publication date Assignee Title
JP2992854B2 (ja) * 1992-08-20 1999-12-20 東京エレクトロン株式会社 基板の枚葉検出装置
US5308993A (en) * 1993-03-28 1994-05-03 Avalon Engineering, Inc. Semiconductor wafer cassette mapper having dual vertical column of light emitting apertures and a single vertical column of light receiving apertures
US5418382A (en) * 1993-09-23 1995-05-23 Fsi International, Inc. Substrate location and detection apparatus
AU2075699A (en) * 1998-01-27 1999-08-09 Nikon Corporation Method and apparatus for detecting wafer
JPH11243130A (ja) * 1998-02-26 1999-09-07 Omron Corp 薄板材状態検出装置および薄板材の状態検出方法
DE19814046C1 (de) * 1998-03-30 1999-11-18 Jenoptik Jena Gmbh Anordnung zur Detektion von scheibenförmigen Objekten in einer Kassette
JP2000068360A (ja) * 1998-08-20 2000-03-03 Assist Kk ウェハ検出装置
US6188323B1 (en) 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
JP2001093964A (ja) * 1999-09-21 2001-04-06 Nikon Corp ウェハ検出装置
US6636626B1 (en) * 1999-11-30 2003-10-21 Wafermasters, Inc. Wafer mapping apparatus and method
US6452503B1 (en) * 2001-03-15 2002-09-17 Pri Automation, Inc. Semiconductor wafer imaging system
US6897463B1 (en) * 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
TWI288961B (en) 2001-12-12 2007-10-21 Shinko Electric Co Ltd Substrate detection apparatus
JP2003282675A (ja) 2002-03-20 2003-10-03 Tokyo Seimitsu Co Ltd ウエハマッピング装置
US7015492B2 (en) * 2003-08-15 2006-03-21 Asm International N.V. Method and apparatus for mapping of wafers located inside a closed wafer cassette
JP2009302392A (ja) * 2008-06-16 2009-12-24 Kawasaki Heavy Ind Ltd 基板検出装置および方法
JP2010232561A (ja) 2009-03-27 2010-10-14 Sinfonia Technology Co Ltd ウェーハ検出機構、及びｆｏｕｐ
JP2010232560A (ja) 2009-03-27 2010-10-14 Sinfonia Technology Co Ltd マッピング機構、ｆｏｕｐ、及びロードポート

Also Published As

Publication number Publication date
TWI496231B (zh) 2015-08-11
JPWO2011062138A1 (ja) 2013-04-04
US8837777B2 (en) 2014-09-16
WO2011062138A1 (ja) 2011-05-26
US20120281875A1 (en) 2012-11-08
JP5881007B2 (ja) 2016-03-09
KR20120103565A (ko) 2012-09-19
CN102576687A (zh) 2012-07-11
CN102576687B (zh) 2015-11-25
TW201138001A (en) 2011-11-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20201120