JP4450772B2 - 電子部品装着装置 - Google Patents

電子部品装着装置 Download PDF

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Publication number
JP4450772B2
JP4450772B2 JP2005192116A JP2005192116A JP4450772B2 JP 4450772 B2 JP4450772 B2 JP 4450772B2 JP 2005192116 A JP2005192116 A JP 2005192116A JP 2005192116 A JP2005192116 A JP 2005192116A JP 4450772 B2 JP4450772 B2 JP 4450772B2
Authority
JP
Japan
Prior art keywords
component supply
supply unit
component
tape
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005192116A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007012888A5 (enExample
JP2007012888A (ja
Inventor
昭夫 渡辺
章祐 川合
哲治 小野
真希夫 亀田
和義 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005192116A priority Critical patent/JP4450772B2/ja
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Priority to CN2009102264408A priority patent/CN101742898B/zh
Priority to CN2006100932726A priority patent/CN1893810B/zh
Priority to US11/478,434 priority patent/US20070011869A1/en
Priority to KR1020060060445A priority patent/KR101238996B1/ko
Priority to EP10012562A priority patent/EP2273863B1/en
Priority to EP10012564A priority patent/EP2273864B1/en
Priority to EP06013575A priority patent/EP1821589B1/en
Publication of JP2007012888A publication Critical patent/JP2007012888A/ja
Publication of JP2007012888A5 publication Critical patent/JP2007012888A5/ja
Priority to US12/349,249 priority patent/US8181337B2/en
Priority to JP2009032082A priority patent/JP4418011B2/ja
Priority to JP2009149859A priority patent/JP2009283949A/ja
Priority to JP2009262353A priority patent/JP2010034607A/ja
Priority to JP2009262347A priority patent/JP2010034606A/ja
Application granted granted Critical
Publication of JP4450772B2 publication Critical patent/JP4450772B2/ja
Priority to JP2010251888A priority patent/JP4696182B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2005192116A 2005-06-30 2005-06-30 電子部品装着装置 Expired - Fee Related JP4450772B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2005192116A JP4450772B2 (ja) 2005-06-30 2005-06-30 電子部品装着装置
CN2009102264408A CN101742898B (zh) 2005-06-30 2006-06-23 电子零件安装装置
CN2006100932726A CN1893810B (zh) 2005-06-30 2006-06-23 电子零件安装装置
US11/478,434 US20070011869A1 (en) 2005-06-30 2006-06-30 Electronic component mounting apparatus
KR1020060060445A KR101238996B1 (ko) 2005-06-30 2006-06-30 전자 부품 장착 장치
EP10012562A EP2273863B1 (en) 2005-06-30 2006-06-30 Electronic component mounting apparatus
EP10012564A EP2273864B1 (en) 2005-06-30 2006-06-30 Electronic component mounting apparatus
EP06013575A EP1821589B1 (en) 2005-06-30 2006-06-30 Electronic component mounting apparatus
US12/349,249 US8181337B2 (en) 2005-06-30 2009-01-06 Electronic component mounting method
JP2009032082A JP4418011B2 (ja) 2005-06-30 2009-02-14 電子部品装着装置
JP2009149859A JP2009283949A (ja) 2005-06-30 2009-06-24 電子部品装着装置
JP2009262353A JP2010034607A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2009262347A JP2010034606A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2010251888A JP4696182B2 (ja) 2005-06-30 2010-11-10 電子部品装着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005192116A JP4450772B2 (ja) 2005-06-30 2005-06-30 電子部品装着装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009032082A Division JP4418011B2 (ja) 2005-06-30 2009-02-14 電子部品装着装置
JP2009149859A Division JP2009283949A (ja) 2005-06-30 2009-06-24 電子部品装着装置

Publications (3)

Publication Number Publication Date
JP2007012888A JP2007012888A (ja) 2007-01-18
JP2007012888A5 JP2007012888A5 (enExample) 2008-12-18
JP4450772B2 true JP4450772B2 (ja) 2010-04-14

Family

ID=37598170

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2005192116A Expired - Fee Related JP4450772B2 (ja) 2005-06-30 2005-06-30 電子部品装着装置
JP2009032082A Expired - Lifetime JP4418011B2 (ja) 2005-06-30 2009-02-14 電子部品装着装置
JP2009149859A Pending JP2009283949A (ja) 2005-06-30 2009-06-24 電子部品装着装置
JP2009262353A Pending JP2010034607A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2009262347A Pending JP2010034606A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2010251888A Expired - Fee Related JP4696182B2 (ja) 2005-06-30 2010-11-10 電子部品装着装置

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2009032082A Expired - Lifetime JP4418011B2 (ja) 2005-06-30 2009-02-14 電子部品装着装置
JP2009149859A Pending JP2009283949A (ja) 2005-06-30 2009-06-24 電子部品装着装置
JP2009262353A Pending JP2010034607A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2009262347A Pending JP2010034606A (ja) 2005-06-30 2009-11-17 電子部品装着装置
JP2010251888A Expired - Fee Related JP4696182B2 (ja) 2005-06-30 2010-11-10 電子部品装着装置

Country Status (5)

Country Link
US (2) US20070011869A1 (enExample)
EP (3) EP2273863B1 (enExample)
JP (6) JP4450772B2 (enExample)
KR (1) KR101238996B1 (enExample)
CN (2) CN101742898B (enExample)

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JP4450772B2 (ja) * 2005-06-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4450788B2 (ja) * 2005-11-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
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JP5434884B2 (ja) 2010-10-27 2014-03-05 パナソニック株式会社 電子部品実装装置および電子部品実装方法
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JP6199798B2 (ja) * 2014-04-30 2017-09-20 ヤマハ発動機株式会社 電子部品装着装置
JP6404359B2 (ja) * 2014-10-03 2018-10-10 株式会社Ｆｕｊｉ 部品装着システムおよび部品装着装置の異常停止診断方法
JP6448337B2 (ja) * 2014-12-04 2019-01-09 株式会社Ｆｕｊｉ 部品実装装置
CN105813395B (zh) * 2014-12-29 2019-11-01 鸿富锦精密电子(郑州)有限公司 拆料设备
JP6379354B2 (ja) * 2015-01-27 2018-08-29 パナソニックＩｐマネジメント株式会社 実装ライン及び部品実装システム
JP6706824B2 (ja) * 2015-01-27 2020-06-10 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6673902B2 (ja) * 2015-03-27 2020-03-25 株式会社Ｆｕｊｉ 部品実装機
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Also Published As

Publication number Publication date
US20070011869A1 (en) 2007-01-18
KR101238996B1 (ko) 2013-03-04
US8181337B2 (en) 2012-05-22
EP2273863A1 (en) 2011-01-12
EP2273864A1 (en) 2011-01-12
CN1893810A (zh) 2007-01-10
KR20070003662A (ko) 2007-01-05
JP2010034606A (ja) 2010-02-12
CN101742898A (zh) 2010-06-16
CN101742898B (zh) 2012-05-23
JP2010034607A (ja) 2010-02-12
JP4418011B2 (ja) 2010-02-17
JP2009105463A (ja) 2009-05-14
JP2007012888A (ja) 2007-01-18
EP2273864B1 (en) 2012-03-21
CN1893810B (zh) 2012-05-09
EP2273863B1 (en) 2012-03-21
JP4696182B2 (ja) 2011-06-08
JP2009283949A (ja) 2009-12-03
JP2011029674A (ja) 2011-02-10
EP1821589B1 (en) 2011-06-08
EP1821589A1 (en) 2007-08-22
US20090119912A1 (en) 2009-05-14

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