JP2009105463A - 電子部品装着装置 - Google Patents
電子部品装着装置 Download PDFInfo
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- JP2009105463A JP2009105463A JP2009032082A JP2009032082A JP2009105463A JP 2009105463 A JP2009105463 A JP 2009105463A JP 2009032082 A JP2009032082 A JP 2009032082A JP 2009032082 A JP2009032082 A JP 2009032082A JP 2009105463 A JP2009105463 A JP 2009105463A
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- 238000001514 detection method Methods 0.000 claims abstract description 16
- 238000000605 extraction Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 abstract description 10
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012840 feeding operation Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000003813 thumb Anatomy 0.000 description 2
- 208000028752 abnormal posture Diseases 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
【解決手段】古い収納テープCに新しい収納テープCを連結した後、部品供給ユニット6にCPU110は送り指令を送り、当該供給ユニット6のサーボモータ28及び駆動モータ42を駆動させて、部品送り動作等を行わせる。その後、吸着ミスの検出回数が所定回数になると、当該供給ユニット6の吸着取出位置に基板認識カメラ14を移動させ、収納テープCの収納部Ccを撮像し、認識処理装置117が認識処理する。この認識処理結果に基づき、補正値をRAM111に格納し、この補正値を考慮したX軸駆動モータ12X及びY軸駆動モータ12Yの駆動後、上下軸駆動モータ16Aを駆動させ、吸着ノズル18は下降して電子部品の取出をする。
【選択図】図11
Description
6 部品供給ユニット
17 基板認識カメラ
28 サーボモータ
110 CPU
102 継ぎ目検出装置
108A 連結テープ
109A、109B カウンタ
109C ラインセンサ
110 CPU
111 RAM
117 認識処理装置
130 コネクタ
Claims (3)
- フィーダベース上に部品取出位置まで収納テープ内の電子部品を供給する部品供給ユニットを複数並設して、この部品供給ユニットより供給された電子部品を吸着ノズルが取出してプリント基板上に装着する電子部品装着装置において、装着ヘッドに設けられ前記吸着ノズルによる電子部品の吸着ミスを検出する検出装置と、この検出装置の連続した吸着ミスの検出回数を計数するもので前記部品供給ユニット毎に設けられるカウンタと、このカウンタが所定回数を計数すると当該部品供給ユニットが処理する前記収納テープの電子部品を収納する収納凹部を撮像する認識カメラと、この認識カメラが撮像した画像を認識処理する認識処理装置と、この認識処理装置の認識処理結果に基づいて当該部品供給ユニットの電子部品を取出す前記吸着ノズルが下降して取出す位置を補正するように制御する制御装置とを設けたことを特徴とする電子部品装着装置。
- フィーダベース上に部品取出位置まで収納テープ内の電子部品を供給する部品供給ユニットを複数並設して、この部品供給ユニットより供給された電子部品を吸着ノズルが取出してプリント基板上に装着する電子部品装着装置において、前記部品供給ユニット毎に算出された電子部品の吸着率を格納する記憶装置と、前記吸着ノズルにより電子部品が取出す際に当該部品供給ユニットの前記吸着率が所定以下の場合に当該部品供給ユニットが処理する前記収納テープの電子部品を収納する収納凹部を撮像する認識カメラと、この認識カメラが撮像した画像を認識処理する認識処理装置と、この認識処理装置の認識処理結果に基づいて当該部品供給ユニットの電子部品を取出す前記吸着ノズルが下降して取出す位置を補正するように制御する制御装置とを設けたことを特徴とする電子部品装着装置。
- フィーダベース上に部品取出位置まで収納テープ内の電子部品を供給する部品供給ユニットを複数並設して、この部品供給ユニットより供給された電子部品を吸着ノズルが取出してプリント基板上に装着する電子部品装着装置において、前記部品供給ユニットに装填された収納テープ内の電子部品の残数を管理する管理装置と、この管理装置による電子部品の残数が所定の数になり電子部品が前記所定の数供給された後に当該部品供給ユニットが処理する新しい収納テープの電子部品を収納する収納凹部を撮像する認識カメラと、この認識カメラが撮像した画像を認識処理する認識処理装置と、この認識処理装置の認識処理結果に基づいて当該部品供給ユニットの電子部品を取出す前記吸着ノズルが下降して取出す位置を補正するように制御する制御装置とを設けたことを特徴とする電子部品装着装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009032082A JP4418011B2 (ja) | 2005-06-30 | 2009-02-14 | 電子部品装着装置 |
JP2009262353A JP2010034607A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2009262347A JP2010034606A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192116A JP4450772B2 (ja) | 2005-06-30 | 2005-06-30 | 電子部品装着装置 |
JP2009032082A JP4418011B2 (ja) | 2005-06-30 | 2009-02-14 | 電子部品装着装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005192116A Division JP4450772B2 (ja) | 2005-06-30 | 2005-06-30 | 電子部品装着装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009262353A Division JP2010034607A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2009262347A Division JP2010034606A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009105463A true JP2009105463A (ja) | 2009-05-14 |
JP4418011B2 JP4418011B2 (ja) | 2010-02-17 |
Family
ID=37598170
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005192116A Active JP4450772B2 (ja) | 2005-06-30 | 2005-06-30 | 電子部品装着装置 |
JP2009032082A Active JP4418011B2 (ja) | 2005-06-30 | 2009-02-14 | 電子部品装着装置 |
JP2009149859A Pending JP2009283949A (ja) | 2005-06-30 | 2009-06-24 | 電子部品装着装置 |
JP2009262353A Pending JP2010034607A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2009262347A Pending JP2010034606A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2010251888A Expired - Fee Related JP4696182B2 (ja) | 2005-06-30 | 2010-11-10 | 電子部品装着装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005192116A Active JP4450772B2 (ja) | 2005-06-30 | 2005-06-30 | 電子部品装着装置 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009149859A Pending JP2009283949A (ja) | 2005-06-30 | 2009-06-24 | 電子部品装着装置 |
JP2009262353A Pending JP2010034607A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2009262347A Pending JP2010034606A (ja) | 2005-06-30 | 2009-11-17 | 電子部品装着装置 |
JP2010251888A Expired - Fee Related JP4696182B2 (ja) | 2005-06-30 | 2010-11-10 | 電子部品装着装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20070011869A1 (ja) |
EP (3) | EP2273863B1 (ja) |
JP (6) | JP4450772B2 (ja) |
KR (1) | KR101238996B1 (ja) |
CN (2) | CN101742898B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011228377A (ja) * | 2010-04-16 | 2011-11-10 | Panasonic Corp | 部品実装方法 |
JP2016111152A (ja) * | 2014-12-04 | 2016-06-20 | 富士機械製造株式会社 | 部品実装装置 |
Families Citing this family (38)
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CN101496463B (zh) * | 2006-07-31 | 2011-06-22 | 松下电器产业株式会社 | 组件安装条件确定方法 |
JP4922014B2 (ja) * | 2007-02-28 | 2012-04-25 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
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JP5342159B2 (ja) * | 2008-03-25 | 2013-11-13 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
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JP2011228377A (ja) * | 2010-04-16 | 2011-11-10 | Panasonic Corp | 部品実装方法 |
JP2016111152A (ja) * | 2014-12-04 | 2016-06-20 | 富士機械製造株式会社 | 部品実装装置 |
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CN1893810A (zh) | 2007-01-10 |
JP2007012888A (ja) | 2007-01-18 |
JP2010034606A (ja) | 2010-02-12 |
CN1893810B (zh) | 2012-05-09 |
CN101742898A (zh) | 2010-06-16 |
US8181337B2 (en) | 2012-05-22 |
JP2010034607A (ja) | 2010-02-12 |
EP2273864A1 (en) | 2011-01-12 |
EP2273864B1 (en) | 2012-03-21 |
JP4696182B2 (ja) | 2011-06-08 |
CN101742898B (zh) | 2012-05-23 |
US20090119912A1 (en) | 2009-05-14 |
JP2009283949A (ja) | 2009-12-03 |
JP4418011B2 (ja) | 2010-02-17 |
EP1821589A1 (en) | 2007-08-22 |
EP1821589B1 (en) | 2011-06-08 |
EP2273863B1 (en) | 2012-03-21 |
EP2273863A1 (en) | 2011-01-12 |
US20070011869A1 (en) | 2007-01-18 |
KR20070003662A (ko) | 2007-01-05 |
JP2011029674A (ja) | 2011-02-10 |
KR101238996B1 (ko) | 2013-03-04 |
JP4450772B2 (ja) | 2010-04-14 |
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