DE69404015T2 - Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile - Google Patents

Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile

Info

Publication number
DE69404015T2
DE69404015T2 DE69404015T DE69404015T DE69404015T2 DE 69404015 T2 DE69404015 T2 DE 69404015T2 DE 69404015 T DE69404015 T DE 69404015T DE 69404015 T DE69404015 T DE 69404015T DE 69404015 T2 DE69404015 T2 DE 69404015T2
Authority
DE
Germany
Prior art keywords
electronic parts
automatic assembly
automatic
assembly
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69404015T
Other languages
English (en)
Other versions
DE69404015D1 (de
Inventor
Yoshinori Kano
Kazunori Takata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP27237793A external-priority patent/JP3223009B2/ja
Priority claimed from JP05288251A external-priority patent/JP3128409B2/ja
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of DE69404015D1 publication Critical patent/DE69404015D1/de
Application granted granted Critical
Publication of DE69404015T2 publication Critical patent/DE69404015T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53061—Responsive to work or work-related machine element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69404015T 1993-10-29 1994-10-28 Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile Expired - Lifetime DE69404015T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27237793A JP3223009B2 (ja) 1993-10-29 1993-10-29 電子部品自動装着装置
JP05288251A JP3128409B2 (ja) 1993-11-17 1993-11-17 電子部品自動装着装置及び電子部品の装着方法

Publications (2)

Publication Number Publication Date
DE69404015D1 DE69404015D1 (de) 1997-08-07
DE69404015T2 true DE69404015T2 (de) 1998-02-12

Family

ID=26550168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404015T Expired - Lifetime DE69404015T2 (de) 1993-10-29 1994-10-28 Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile

Country Status (4)

Country Link
US (1) US5539977A (de)
EP (1) EP0652699B1 (de)
KR (1) KR100329586B1 (de)
DE (1) DE69404015T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5727300A (en) * 1995-02-07 1998-03-17 The Boeing Company Fastener verification system
JPH0930649A (ja) * 1995-07-13 1997-02-04 Mitsubishi Electric Corp ピックアップ装置
US6168009B1 (en) 1995-12-28 2001-01-02 Fuji Machine Mfg. Co. Ltd. Apparatus for positioning electronic component holder head and apparatus for transferring electronic component
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JPH1041687A (ja) * 1996-07-19 1998-02-13 Matsushita Electric Ind Co Ltd 電子部品供給装置
JP3402988B2 (ja) * 1997-01-31 2003-05-06 三洋電機株式会社 電子部品装着装置の上下動カム機構
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
US6276051B1 (en) * 1998-01-29 2001-08-21 Fuji Machine Mfg. Co., Ltd. Electric-component transferring apparatus
US6587743B1 (en) * 1999-01-29 2003-07-01 B P Microsystems, Inc. Pick and place teaching method and apparatus for implementing the same
JP2001135995A (ja) * 1999-11-05 2001-05-18 Matsushita Electric Ind Co Ltd 部品実装装置及び方法
US6862803B2 (en) * 2000-08-29 2005-03-08 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic component
US7017261B2 (en) * 2000-09-19 2006-03-28 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
JP2002100896A (ja) * 2000-09-25 2002-04-05 Matsushita Electric Ind Co Ltd 部品実装機
US20020041481A1 (en) * 2000-09-28 2002-04-11 Yoshinori Kano Linear motor and electronic component feeding apparatus
JP4681174B2 (ja) * 2001-09-28 2011-05-11 株式会社日立ハイテクインスツルメンツ 電子部品自動装着装置
JP2004193261A (ja) * 2002-12-10 2004-07-08 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
US7533459B2 (en) * 2004-04-27 2009-05-19 Hitachi High-Tech Instruments, Co., Ltd. Electronic component mounting method and electronic component mounting apparatus
JP2006049336A (ja) * 2004-07-30 2006-02-16 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP4450772B2 (ja) * 2005-06-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
KR100742314B1 (ko) * 2005-11-23 2007-07-24 서울전력주식회사 내부전원으로 작동하는 연등용 조명장치.
JP4450788B2 (ja) * 2005-11-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US9676507B2 (en) * 2008-07-23 2017-06-13 Best Packaging, Inc. Stretch wrapping system and process
JP6717816B2 (ja) 2015-05-25 2020-07-08 株式会社Ｆｕｊｉ 部品実装機
EP3331337B1 (de) * 2015-07-28 2021-05-05 FUJI Corporation Komponentenmontagemaschine
JP6654109B2 (ja) * 2016-06-28 2020-02-26 株式会社Ｆｕｊｉ 判断装置
CN107498307B (zh) * 2017-10-23 2023-05-16 浙江盛越电子科技有限公司 全自动电机总装机及其组装方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121671A (ja) * 1983-12-02 1985-06-29 Yuasa Battery Co Ltd アルカリ電池の製造法
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPH0767033B2 (ja) * 1987-01-14 1995-07-19 三洋電機株式会社 自動装着装置
EP0293175A3 (de) * 1987-05-28 1990-08-22 Sanyo Electric Co., Ltd. Bauteilemontagegerät
JPS6444100A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Device for mounting electronic component
KR910003705B1 (en) * 1988-07-26 1991-06-08 Samsung Electronic Driving apparatus and method thereof for a assembling machine
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5212881A (en) * 1990-09-20 1993-05-25 Tokico Ltd. Electronic component mounting apparatus
JP2599510B2 (ja) * 1991-03-28 1997-04-09 松下電器産業株式会社 部品装着機
JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
US5377405A (en) * 1992-07-01 1995-01-03 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor

Also Published As

Publication number Publication date
DE69404015D1 (de) 1997-08-07
KR100329586B1 (ko) 2002-09-19
EP0652699B1 (de) 1997-07-02
EP0652699A1 (de) 1995-05-10
KR950013343A (ko) 1995-05-17
US5539977A (en) 1996-07-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP