DE69404015D1 - Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile - Google Patents
Vorrichtung und Verfahren zur automatischen Bestückung elektronischer TeileInfo
- Publication number
- DE69404015D1 DE69404015D1 DE69404015T DE69404015T DE69404015D1 DE 69404015 D1 DE69404015 D1 DE 69404015D1 DE 69404015 T DE69404015 T DE 69404015T DE 69404015 T DE69404015 T DE 69404015T DE 69404015 D1 DE69404015 D1 DE 69404015D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic parts
- automatic assembly
- automatic
- assembly
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27237793A JP3223009B2 (ja) | 1993-10-29 | 1993-10-29 | 電子部品自動装着装置 |
JP05288251A JP3128409B2 (ja) | 1993-11-17 | 1993-11-17 | 電子部品自動装着装置及び電子部品の装着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404015D1 true DE69404015D1 (de) | 1997-08-07 |
DE69404015T2 DE69404015T2 (de) | 1998-02-12 |
Family
ID=26550168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404015T Expired - Lifetime DE69404015T2 (de) | 1993-10-29 | 1994-10-28 | Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile |
Country Status (4)
Country | Link |
---|---|
US (1) | US5539977A (de) |
EP (1) | EP0652699B1 (de) |
KR (1) | KR100329586B1 (de) |
DE (1) | DE69404015T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5727300A (en) * | 1995-02-07 | 1998-03-17 | The Boeing Company | Fastener verification system |
JPH0930649A (ja) * | 1995-07-13 | 1997-02-04 | Mitsubishi Electric Corp | ピックアップ装置 |
US6168009B1 (en) | 1995-12-28 | 2001-01-02 | Fuji Machine Mfg. Co. Ltd. | Apparatus for positioning electronic component holder head and apparatus for transferring electronic component |
US5926950A (en) * | 1995-12-28 | 1999-07-27 | Fuji Machine Mfg. Co., Ltd. | Electronic component transferring device and method, and electronic component mounting system and method |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
JPH1041687A (ja) * | 1996-07-19 | 1998-02-13 | Matsushita Electric Ind Co Ltd | 電子部品供給装置 |
JP3402988B2 (ja) * | 1997-01-31 | 2003-05-06 | 三洋電機株式会社 | 電子部品装着装置の上下動カム機構 |
US5953812A (en) * | 1997-07-03 | 1999-09-21 | Schlumberger Technologies, Inc. | Misinsert sensing in pick and place tooling |
US6230393B1 (en) * | 1997-07-07 | 2001-05-15 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting electronic component |
US6276051B1 (en) * | 1998-01-29 | 2001-08-21 | Fuji Machine Mfg. Co., Ltd. | Electric-component transferring apparatus |
US6587743B1 (en) | 1999-01-29 | 2003-07-01 | B P Microsystems, Inc. | Pick and place teaching method and apparatus for implementing the same |
JP2001135995A (ja) * | 1999-11-05 | 2001-05-18 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
EP1187524B1 (de) * | 2000-08-29 | 2010-07-21 | Panasonic Corporation | Verfahren und Einrichtung zur Montage von Bauteilen |
EP1319327A2 (de) * | 2000-09-19 | 2003-06-18 | Matsushita Electric Industrial Co., Ltd. | Bauteilansaugvorrichtung, bauteilbestückungseinrichtung und bauteilbestückungsverfahren |
JP2002100896A (ja) * | 2000-09-25 | 2002-04-05 | Matsushita Electric Ind Co Ltd | 部品実装機 |
US20020041481A1 (en) * | 2000-09-28 | 2002-04-11 | Yoshinori Kano | Linear motor and electronic component feeding apparatus |
JP4681174B2 (ja) * | 2001-09-28 | 2011-05-11 | 株式会社日立ハイテクインスツルメンツ | 電子部品自動装着装置 |
JP2004193261A (ja) * | 2002-12-10 | 2004-07-08 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
US7533459B2 (en) * | 2004-04-27 | 2009-05-19 | Hitachi High-Tech Instruments, Co., Ltd. | Electronic component mounting method and electronic component mounting apparatus |
JP2006049336A (ja) * | 2004-07-30 | 2006-02-16 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP4450772B2 (ja) * | 2005-06-30 | 2010-04-14 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
KR100742314B1 (ko) * | 2005-11-23 | 2007-07-24 | 서울전력주식회사 | 내부전원으로 작동하는 연등용 조명장치. |
JP4450788B2 (ja) * | 2005-11-30 | 2010-04-14 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US9676507B2 (en) * | 2008-07-23 | 2017-06-13 | Best Packaging, Inc. | Stretch wrapping system and process |
CN107535089B (zh) | 2015-05-25 | 2019-10-01 | 株式会社富士 | 元件安装机 |
EP3331337B1 (de) * | 2015-07-28 | 2021-05-05 | FUJI Corporation | Komponentenmontagemaschine |
JP6654109B2 (ja) * | 2016-06-28 | 2020-02-26 | 株式会社Fuji | 判断装置 |
CN107498307B (zh) * | 2017-10-23 | 2023-05-16 | 浙江盛越电子科技有限公司 | 全自动电机总装机及其组装方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121671A (ja) * | 1983-12-02 | 1985-06-29 | Yuasa Battery Co Ltd | アルカリ電池の製造法 |
JP2537770B2 (ja) * | 1984-08-31 | 1996-09-25 | 松下電器産業株式会社 | 電子部品の装着方法 |
DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
JPH0767033B2 (ja) * | 1987-01-14 | 1995-07-19 | 三洋電機株式会社 | 自動装着装置 |
EP0293175A3 (de) * | 1987-05-28 | 1990-08-22 | Sanyo Electric Co., Ltd. | Bauteilemontagegerät |
JPS6444100A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Device for mounting electronic component |
KR910003705B1 (en) * | 1988-07-26 | 1991-06-08 | Samsung Electronic | Driving apparatus and method thereof for a assembling machine |
JPH02303100A (ja) * | 1989-05-17 | 1990-12-17 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
US5212881A (en) * | 1990-09-20 | 1993-05-25 | Tokico Ltd. | Electronic component mounting apparatus |
JP2599510B2 (ja) * | 1991-03-28 | 1997-04-09 | 松下電器産業株式会社 | 部品装着機 |
DE69300850T2 (de) * | 1992-07-01 | 1996-03-28 | Yamaha Motor Co Ltd | Verfahren zum Montieren von Komponenten und Vorrichtung dafür. |
JPH0618215A (ja) * | 1992-07-01 | 1994-01-25 | Yamaha Motor Co Ltd | 部品装着方法及び装置 |
-
1994
- 1994-10-28 US US08/330,749 patent/US5539977A/en not_active Expired - Lifetime
- 1994-10-28 EP EP94117101A patent/EP0652699B1/de not_active Expired - Lifetime
- 1994-10-28 KR KR1019940027849A patent/KR100329586B1/ko not_active IP Right Cessation
- 1994-10-28 DE DE69404015T patent/DE69404015T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0652699B1 (de) | 1997-07-02 |
DE69404015T2 (de) | 1998-02-12 |
KR100329586B1 (ko) | 2002-09-19 |
US5539977A (en) | 1996-07-30 |
EP0652699A1 (de) | 1995-05-10 |
KR950013343A (ko) | 1995-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP |