JP4337954B2 - シリコンインゴットの製造方法および製造装置 - Google Patents
シリコンインゴットの製造方法および製造装置 Download PDFInfo
- Publication number
- JP4337954B2 JP4337954B2 JP2009505240A JP2009505240A JP4337954B2 JP 4337954 B2 JP4337954 B2 JP 4337954B2 JP 2009505240 A JP2009505240 A JP 2009505240A JP 2009505240 A JP2009505240 A JP 2009505240A JP 4337954 B2 JP4337954 B2 JP 4337954B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- liquid
- eutectic
- ingot
- crucible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 213
- 229910052710 silicon Inorganic materials 0.000 title claims description 213
- 239000010703 silicon Substances 0.000 title claims description 213
- 238000004519 manufacturing process Methods 0.000 title claims description 51
- 239000007788 liquid Substances 0.000 claims description 88
- 230000005496 eutectics Effects 0.000 claims description 51
- 230000008018 melting Effects 0.000 claims description 33
- 238000002844 melting Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 24
- 229910000676 Si alloy Inorganic materials 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 239000012535 impurity Substances 0.000 claims description 16
- 238000005204 segregation Methods 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 72
- 229910002796 Si–Al Inorganic materials 0.000 description 30
- 239000000155 melt Substances 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 24
- 239000007789 gas Substances 0.000 description 16
- 230000007423 decrease Effects 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 13
- 239000007791 liquid phase Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000007790 solid phase Substances 0.000 description 9
- 230000008023 solidification Effects 0.000 description 9
- 238000007711 solidification Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000006023 eutectic alloy Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 238000010587 phase diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- -1 for example Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 229910021471 metal-silicon alloy Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007069741 | 2007-03-19 | ||
| JP2007069741 | 2007-03-19 | ||
| PCT/JP2008/055098 WO2008114822A1 (ja) | 2007-03-19 | 2008-03-19 | シリコンインゴットの製造方法および製造装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009112633A Division JP4358300B2 (ja) | 2007-03-19 | 2009-05-07 | シリコンインゴットの製造方法および製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4337954B2 true JP4337954B2 (ja) | 2009-09-30 |
| JPWO2008114822A1 JPWO2008114822A1 (ja) | 2010-07-08 |
Family
ID=39765926
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009505240A Expired - Fee Related JP4337954B2 (ja) | 2007-03-19 | 2008-03-19 | シリコンインゴットの製造方法および製造装置 |
| JP2009112633A Expired - Fee Related JP4358300B2 (ja) | 2007-03-19 | 2009-05-07 | シリコンインゴットの製造方法および製造装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009112633A Expired - Fee Related JP4358300B2 (ja) | 2007-03-19 | 2009-05-07 | シリコンインゴットの製造方法および製造装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100143231A1 (enExample) |
| EP (1) | EP2138610A1 (enExample) |
| JP (2) | JP4337954B2 (enExample) |
| KR (1) | KR20100015652A (enExample) |
| CN (1) | CN101680111A (enExample) |
| CA (1) | CA2681353A1 (enExample) |
| WO (1) | WO2008114822A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO329987B1 (no) | 2009-02-26 | 2011-01-31 | Harsharn Tathgar | Halvkontinuerlig fremgangsmate for dannelse, separasjon og smelting av store, rene silisiumkrystaller |
| CN101798705A (zh) * | 2010-03-12 | 2010-08-11 | 上海太阳能电池研究与发展中心 | 一种从低温熔体中连续拉晶提纯多晶硅的方法及专用装置 |
| CN101812727B (zh) * | 2010-04-13 | 2011-12-28 | 上海太阳能电池研究与发展中心 | 一种直流电场下定向凝固提纯多晶硅的方法 |
| JP5483591B2 (ja) * | 2010-10-08 | 2014-05-07 | 日鉄住金ファインテック株式会社 | 単結晶引上装置および坩堝支持装置 |
| KR101690490B1 (ko) * | 2010-10-21 | 2016-12-28 | 에스케이이노베이션 주식회사 | 탄화규소 단결정의 제조방법 및 장치 |
| CN102749128B (zh) * | 2011-04-19 | 2014-08-27 | 蒂雅克股份有限公司 | 测压元件单元 |
| JP5679120B2 (ja) * | 2011-04-19 | 2015-03-04 | ティアック株式会社 | ロードセルユニット |
| CN102311121A (zh) * | 2011-08-29 | 2012-01-11 | 大连理工大学 | 一种合金化分凝提纯工业硅的方法 |
| KR101317198B1 (ko) * | 2011-10-24 | 2013-10-15 | 한국생산기술연구원 | 성장로 감시 장치 |
| WO2013111314A1 (ja) * | 2012-01-27 | 2013-08-01 | Kaneko Kyojiro | シリコン純化法 |
| TWI627131B (zh) * | 2012-02-01 | 2018-06-21 | 美商希利柯爾材料股份有限公司 | 矽純化之模具及方法 |
| CN102605424A (zh) * | 2012-03-06 | 2012-07-25 | 浙江宏业新能源有限公司 | 多晶硅铸锭炉控制系统及控制方法 |
| CN102786060B (zh) * | 2012-08-15 | 2016-08-17 | 大连理工大学 | 一种增强合金化分凝提纯多晶硅的方法 |
| CN104635805B (zh) * | 2014-12-24 | 2017-05-17 | 湖南顶立科技有限公司 | 一种温度控制系统 |
| JP6451333B2 (ja) * | 2015-01-14 | 2019-01-16 | 株式会社Sumco | シリコン単結晶の製造方法 |
| FR3052773B1 (fr) * | 2016-06-15 | 2020-10-30 | Snecma | Procede de fabrication d'une piece de turbomachine |
| CN108018602A (zh) * | 2016-11-03 | 2018-05-11 | 上海新昇半导体科技有限公司 | 自动进料系统及进料方法 |
| CN108706590A (zh) * | 2018-07-07 | 2018-10-26 | 孟静 | 太阳能级多晶硅制备方法 |
| CN108796606B (zh) * | 2018-07-07 | 2020-11-03 | 玉环市几偶孵化器有限公司 | 太阳能级多晶硅制备装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950629B2 (ja) * | 1982-04-20 | 1984-12-10 | 東芝セラミツクス株式会社 | 単結晶シリコン引上げ用窒化珪素製治具の製造方法 |
| JPH0633235B2 (ja) * | 1989-04-05 | 1994-05-02 | 新日本製鐵株式会社 | 酸化膜耐圧特性の優れたシリコン単結晶及びその製造方法 |
| JP2795030B2 (ja) * | 1992-01-29 | 1998-09-10 | 信越半導体株式会社 | 単結晶シリコン棒の製造方法 |
| JP3085568B2 (ja) * | 1993-11-01 | 2000-09-11 | コマツ電子金属株式会社 | シリコン単結晶の製造装置および製造方法 |
| JP3000923B2 (ja) * | 1996-03-28 | 2000-01-17 | 住友金属工業株式会社 | 単結晶引き上げ方法 |
| JP3325900B2 (ja) | 1996-10-14 | 2002-09-17 | 川崎製鉄株式会社 | 多結晶シリコンの製造方法及び装置、並びに太陽電池用シリコン基板の製造方法 |
| JPH10273313A (ja) | 1997-03-28 | 1998-10-13 | Kawasaki Steel Corp | 多結晶シリコン鋳塊の製造方法 |
| JP4383639B2 (ja) | 2000-07-31 | 2009-12-16 | 信越半導体株式会社 | Gaドープシリコン単結晶の製造方法およびGaドープシリコン単結晶、並びにこれから作製されたシリコン単結晶太陽電池 |
| JP2003277040A (ja) | 2002-03-19 | 2003-10-02 | Sharp Corp | シリコンの精製方法および該方法により精製したシリコンを用いて製造する太陽電池 |
| JP4060106B2 (ja) | 2002-03-27 | 2008-03-12 | 三菱マテリアル株式会社 | 一方向凝固シリコンインゴット及びこの製造方法並びにシリコン板及び太陽電池用基板及びスパッタリング用ターゲット素材 |
| JP2004067452A (ja) * | 2002-08-07 | 2004-03-04 | Shin Etsu Handotai Co Ltd | 単結晶の引き上げ条件の設計方法 |
| JP4380204B2 (ja) * | 2003-04-10 | 2009-12-09 | 株式会社Sumco | シリコン単結晶及び単結晶育成方法 |
| JP2008069055A (ja) * | 2006-09-15 | 2008-03-27 | Covalent Materials Corp | シリコン単結晶の製造方法 |
-
2008
- 2008-03-19 CN CN200880015497A patent/CN101680111A/zh active Pending
- 2008-03-19 WO PCT/JP2008/055098 patent/WO2008114822A1/ja not_active Ceased
- 2008-03-19 KR KR1020097021676A patent/KR20100015652A/ko not_active Withdrawn
- 2008-03-19 CA CA002681353A patent/CA2681353A1/en not_active Abandoned
- 2008-03-19 EP EP08722473A patent/EP2138610A1/en not_active Withdrawn
- 2008-03-19 US US12/532,019 patent/US20100143231A1/en not_active Abandoned
- 2008-03-19 JP JP2009505240A patent/JP4337954B2/ja not_active Expired - Fee Related
-
2009
- 2009-05-07 JP JP2009112633A patent/JP4358300B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009167101A (ja) | 2009-07-30 |
| EP2138610A1 (en) | 2009-12-30 |
| CA2681353A1 (en) | 2008-09-25 |
| CN101680111A (zh) | 2010-03-24 |
| JP4358300B2 (ja) | 2009-11-04 |
| KR20100015652A (ko) | 2010-02-12 |
| JPWO2008114822A1 (ja) | 2010-07-08 |
| US20100143231A1 (en) | 2010-06-10 |
| WO2008114822A1 (ja) | 2008-09-25 |
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