JP4304508B2 - 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 - Google Patents

接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 Download PDF

Info

Publication number
JP4304508B2
JP4304508B2 JP2004556874A JP2004556874A JP4304508B2 JP 4304508 B2 JP4304508 B2 JP 4304508B2 JP 2004556874 A JP2004556874 A JP 2004556874A JP 2004556874 A JP2004556874 A JP 2004556874A JP 4304508 B2 JP4304508 B2 JP 4304508B2
Authority
JP
Japan
Prior art keywords
circuit
adhesive composition
electrode
connection
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004556874A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2004050779A1 (ja
Inventor
茂樹 加藤木
朋子 須藤
正己 湯佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2004050779A1 publication Critical patent/JPWO2004050779A1/ja
Application granted granted Critical
Publication of JP4304508B2 publication Critical patent/JP4304508B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2004556874A 2002-11-29 2003-12-01 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 Expired - Fee Related JP4304508B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002348026 2002-11-29
JP2002348026 2002-11-29
PCT/JP2003/015351 WO2004050779A1 (ja) 2002-11-29 2003-12-01 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2004050779A1 JPWO2004050779A1 (ja) 2006-03-30
JP4304508B2 true JP4304508B2 (ja) 2009-07-29

Family

ID=32462901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004556874A Expired - Fee Related JP4304508B2 (ja) 2002-11-29 2003-12-01 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置

Country Status (7)

Country Link
US (2) US7576141B2 (enExample)
JP (1) JP4304508B2 (enExample)
KR (3) KR100730629B1 (enExample)
CN (2) CN1288219C (enExample)
AU (1) AU2003284508A1 (enExample)
TW (5) TW200718769A (enExample)
WO (1) WO2004050779A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005029407B4 (de) * 2005-06-24 2008-06-19 Mühlbauer Ag Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
KR101035810B1 (ko) * 2005-10-18 2011-05-20 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치
CN102277091A (zh) * 2005-10-18 2011-12-14 日立化成工业株式会社 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置
JP5066451B2 (ja) * 2005-12-09 2012-11-07 電気化学工業株式会社 接着性組成物およびこれを用いた接着剤
KR100727741B1 (ko) * 2005-12-30 2007-06-13 제일모직주식회사 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재
CN102176482B (zh) * 2006-04-26 2013-06-05 日立化成株式会社 粘接带及使用其的太阳能电池模块
JP4294722B2 (ja) * 2006-04-27 2009-07-15 パナソニック株式会社 接続構造体及びその製造方法
WO2008015759A1 (fr) 2006-08-04 2008-02-07 Hitachi Chemical Co., Ltd. Adhésif en film, feuille adhésive et dispositif à semi-conducteurs les utilisant
EP2257141A3 (en) * 2006-08-22 2012-01-18 Hitachi Chemical Co., Ltd. Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
JP2008111091A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd 接着剤フィルム及び回路接続材料
JP2008159819A (ja) * 2006-12-22 2008-07-10 Tdk Corp 電子部品の実装方法、電子部品内蔵基板の製造方法、及び電子部品内蔵基板
US20080275326A1 (en) 2007-05-01 2008-11-06 Joachim Kasielke Sensor for monitoring a condition of a patient
US20100295190A1 (en) * 2007-06-06 2010-11-25 Kazuyuki Mitsukura Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
WO2008152711A1 (ja) * 2007-06-13 2008-12-18 Hitachi Chemical Company, Ltd. 回路接続用フィルム状接着剤
KR101683312B1 (ko) * 2008-09-30 2016-12-06 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법
JP4360446B1 (ja) * 2008-10-16 2009-11-11 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
KR20100058359A (ko) * 2008-11-24 2010-06-03 삼성전자주식회사 다층 반도체 패키지, 그것을 포함하는 반도체 모듈 및 전자신호 처리 시스템 및 다층 반도체 패키지의 제조 방법
CN102439705B (zh) * 2009-02-20 2015-04-01 汉高知识产权及控股有限公司 电极的连接方法和其中使用的连接组合物
TWI489565B (zh) * 2009-03-10 2015-06-21 積水化學工業股份有限公司 Semiconductor wafer laminated body manufacturing method and semiconductor device
EP2426787A4 (en) * 2009-04-28 2013-11-20 Hitachi Chemical Co Ltd CIRCUIT CONNECTION MATERIAL, FILM-RELATED CIRCUIT CONNECTING MATERIAL THEREWITH, STRUCTURE FOR CONNECTING CIRCUIT ELEMENTS AND METHOD FOR CONNECTING CIRCUIT ELEMENTS
KR20180024029A (ko) * 2010-04-22 2018-03-07 세키스이가가쿠 고교가부시키가이샤 이방성 도전 재료 및 접속 구조체
TWI430426B (zh) * 2010-10-19 2014-03-11 國立交通大學 使用共用傳導層傳送晶片間多重信號之系統
EP2484700B1 (de) * 2011-02-04 2013-10-09 LANXESS Deutschland GmbH Funktionalisierte Nitrilkautschuke und ihre Herstellung
JP5750937B2 (ja) 2011-02-25 2015-07-22 富士通株式会社 半導体装置及びその製造方法
KR101508761B1 (ko) * 2011-12-12 2015-04-06 제일모직주식회사 광학 필름용 조성물 및 이로부터 제조된 광학 필름
JP6454580B2 (ja) * 2015-03-30 2019-01-16 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
WO2017090759A1 (ja) * 2015-11-26 2017-06-01 株式会社スリーボンド 熱硬化性組成物およびそれを用いた導電性接着剤
CN106842647A (zh) * 2017-03-20 2017-06-13 武汉华星光电技术有限公司 一种显示装置、绑定结构及其制备方法
JP6718183B1 (ja) * 2019-06-24 2020-07-08 株式会社アイ・メデックス 電子回路基板を備えた生体電極
CN110600163B (zh) * 2019-09-19 2021-04-20 云谷（固安）科技有限公司 导电薄膜及其制备方法、显示装置
US11510864B2 (en) * 2019-11-11 2022-11-29 Melissa Joy Crew Removable hair coloring composition and methods of use thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JPH09125011A (ja) 1995-11-06 1997-05-13 Okura Ind Co Ltd 耐熱性アクリル系接着剤組成物
JP3934701B2 (ja) * 1996-03-07 2007-06-20 大倉工業株式会社 耐熱性アクリル系接着剤組成物
JP2970609B2 (ja) 1997-07-02 1999-11-02 サンケン電気株式会社 樹脂封止型電子回路装置
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JPH11140387A (ja) * 1997-11-11 1999-05-25 Shigeru Koshibe 半導体用接着剤成形体
JP2000072851A (ja) 1998-08-31 2000-03-07 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2000239616A (ja) * 1999-02-24 2000-09-05 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2001011135A (ja) * 1999-06-30 2001-01-16 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002012637A (ja) * 2000-06-28 2002-01-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002012738A (ja) 2000-06-28 2002-01-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP4599666B2 (ja) * 2000-06-29 2010-12-15 日立化成工業株式会社 導電性樹脂ペースト組成物及びこれを用いた半導体装置
JP4852785B2 (ja) 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4590732B2 (ja) 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002363218A (ja) * 2001-06-07 2002-12-18 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2003321508A (ja) * 2002-04-26 2003-11-14 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2004018715A (ja) * 2002-06-18 2004-01-22 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置。
CN1914666B (zh) 2004-01-27 2012-04-04 松下电器产业株式会社 声音合成装置

Also Published As

Publication number Publication date
KR20060130268A (ko) 2006-12-18
KR100780135B1 (ko) 2007-11-28
CN1931947A (zh) 2007-03-21
TW200422372A (en) 2004-11-01
CN1931947B (zh) 2013-05-22
TW200801156A (en) 2008-01-01
JPWO2004050779A1 (ja) 2006-03-30
CN1692149A (zh) 2005-11-02
US7576141B2 (en) 2009-08-18
US7795325B2 (en) 2010-09-14
TW200745301A (en) 2007-12-16
US20050282924A1 (en) 2005-12-22
KR20050044767A (ko) 2005-05-12
TW200718766A (en) 2007-05-16
AU2003284508A1 (en) 2004-06-23
US20090261483A1 (en) 2009-10-22
TWI288170B (en) 2007-10-11
KR20060133112A (ko) 2006-12-22
KR100730629B1 (ko) 2007-06-20
TWI328602B (enExample) 2010-08-11
KR100780136B1 (ko) 2007-11-28
TWI342327B (enExample) 2011-05-21
TW200718769A (en) 2007-05-16
WO2004050779A1 (ja) 2004-06-17
CN1288219C (zh) 2006-12-06

Similar Documents

Publication Publication Date Title
JPWO2004050779A1 (ja) 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP4998468B2 (ja) 接着剤組成物及び回路部材の接続構造
JP5223679B2 (ja) 接着剤及びこれを用いた接続構造体
JP5251393B2 (ja) 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP6173928B2 (ja) 接着剤組成物、回路接続用接着剤及び接続体
JP2001049228A (ja) 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム
JP5292838B2 (ja) 接着剤、及び回路部材の接続構造体
JP2006257208A (ja) 接着剤、回路接続用接着剤、接続体及び半導体装置
JP2013076089A (ja) 回路接続材料、回路接続部材の接続構造及び半導体装置
JP4720073B2 (ja) 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP5560544B2 (ja) 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置
JP2009256581A (ja) 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP5236144B2 (ja) 接着剤組成物、回路接続構造体及び半導体装置
JP3858740B2 (ja) 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP5111711B2 (ja) 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
JP4649815B2 (ja) 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP5002876B2 (ja) 異方導電フィルム、接続体及び半導体装置
JP5034494B2 (ja) 接着剤組成物、回路接続用接着剤、接続体及び半導体装置
JP2012126915A (ja) 異方導電フィルム、接続体及び半導体装置

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080825

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090401

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090414

R151 Written notification of patent or utility model registration

Ref document number: 4304508

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120515

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130515

Year of fee payment: 4

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130515

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130515

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees