JPWO2007046190A1 - 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 - Google Patents
接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 Download PDFInfo
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- JPWO2007046190A1 JPWO2007046190A1 JP2007540896A JP2007540896A JPWO2007046190A1 JP WO2007046190 A1 JPWO2007046190 A1 JP WO2007046190A1 JP 2007540896 A JP2007540896 A JP 2007540896A JP 2007540896 A JP2007540896 A JP 2007540896A JP WO2007046190 A1 JPWO2007046190 A1 JP WO2007046190A1
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Abstract
Description
本発明の接着剤組成物は、熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含む接着剤成分を含有し、この接着剤成分が25℃でのESR測定においてシグナルを有するものである。
(GPC条件)
使用機器:日立L−6000型((株)日立製作所製、商品名)
検出器:L−3300RI((株)日立製作所製、商品名)
カラム:ゲルパックGL−R420+ゲルパックGL−R430+ゲルパックGL−R440(計3本)(日立化成工業(株)製、商品名)
溶離液:テトラヒドロフラン
測定温度:40℃
流量:1.75ml/min
使用機器:ESP350(BRUKER社製、商品名)
マイクロ波周波数カウンター:HP5351B(HEWLETT PACKARD社製、商品名)
ガウスメータ:ER035M(BRUKER社製、商品名)
中心磁場:3490G付近
磁場掃引範囲:200G
変調:100kHz、1G
マイクロ波:9.8GHz、1 mW
掃引時間:83.886s×4times
時定数:327.68ms
キャビティ:TM100、円筒型
g=hν/βH (A)
次に、本発明の回路部材の接続構造の好適な実施形態について説明する。図1は、本発明の回路部材の接続構造の一実施形態を示す概略断面図である。図1に示すように、本実施形態の回路部材の接続構造1は、相互に対向する第1の回路部材20及び第2の回路部材30を備えており、第1の回路部材20と第2の回路部材30との間には、これらを電気的に接続する回路接続部材10が設けられている。第1の回路部材20は、第1の回路基板21と、回路基板21の主面21a上に形成される第1の回路電極22とを備えている。なお、回路基板21の主面21a上には、場合により絶縁層(図示せず)が形成されていてもよい。
次に、上述した回路部材の接続構造の製造方法について、その工程図である図2を参照にしつつ、説明する。
次に、本発明の半導体装置の実施形態について説明する。図3は、本発明の半導体装置の一実施形態を示す概略断面図である。図3に示すように、本実施形態の半導体装置2は、半導体素子50と、半導体の支持部材となる基板60とを備えており、半導体素子50及び基板60の間には、これらを電気的に接続する半導体素子接続部材80が設けられている。また、半導体素子接続部材80は基板60の主面60a上に積層され、半導体素子50は更にその半導体素子接続部材80上に積層されている。
次に、上述した半導体装置の製造方法について説明する。
フェノキシ樹脂(ユニオンカーバイド社製、商品名:PKHC、重量平均分子量45000)40質量部を、ガラス製の容器に収容したメチルエチルケトン(和光純薬工業社製、商品名:2−ブタノン、純度99%)60質量部に溶解して、固形分40質量%のフェノキシ樹脂溶液を調整した。
ポリブチレンアジペートジオール(Aldrich社製、重量平均分子量2000)450質量部、ポリオキシテトラメチレングリコール(Aldrich社製、重量平均分子量2000)450質量部及び1,4−ブチレングリコール(Aldrich社製)100質量部を、メチルエチルケトン(和光純薬工業(株)製、商品名:2−ブタノン、純度99%)4000質量部中に溶解した。そこにジフェニルメタンジイソシアネート(Aldrich社製)390質量部を加えて反応液を得た。次に、その反応液を70℃で60分間反応させて、ウレタン樹脂を得た。なお、このときの温度制御はオイルバス(アズワン(株)製、商品名:HOB−50D)を用いて行った。得られたウレタン樹脂の重量平均分子量をGPCによって測定したところ、35万であった。
イソシアヌル酸EO変性ジアクリレート(東亞合成(株)製、商品名:M−215)、ウレタンアクリレート(共栄社化学(株)製、商品名:AT−600)及び2−(メタ)アクリロイロキシエチルホスフェート(共栄社化学(株)製、商品名:P−2M)を準備した。
t−ヘキシルパーオキシ−2−エチルヘキサノエート(日本油脂(株)製、商品名:パーヘキシルO)を準備した。
4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン−1−オキシル(TEMPOL、旭電化工業(株)製、商品名:LA7−RD)、4−アセトアミド−2,2,6,6−テトラメチルピペリジン−1−オキシル(TEMPOL−NHAc、東京化成工業(株)製)、2,2,6,6−テトラメチルピペリジン−1−オキシル(TEMPO、和光純薬工業(株)製)を準備した。
ポリスチレン粒子の表面上に、厚さ0.2μmになるようにニッケルからなる層を設け、更にこのニッケルからなる層の表面上に、厚さ0.02μmになるよう金からなる層を設けた。こうして平均粒径4μm及び比重2.5の導電性粒子を作製した。
上記フェノキシ樹脂溶液62.5質量部(フェノキシ樹脂を25質量部含有)に、上記ウレタン樹脂を固形分で25質量部、ラジカル重合性化合物として、M−215を25質量部、AT−600を25質量部及びP−2Mを5質量部、ラジカル重合開始剤としてパーヘキシルOを3質量部、並びに安定ラジカル化合物としてTEMPOLを0.2質量部配合した。得られた溶液に上述の導電性粒子を配合分散させて、接着剤組成物を得た。導電性粒子の配合割合は、接着剤組成物の全量に対して1.5体積%であった。
安定ラジカル化合物として、TEMPOL0.2質量部に代えてTEMPOL−NHAc0.2質量部を配合した以外は実施例1と同様にして、フィルム状回路接続材を得た。
安定ラジカル化合物として、TEMPOL0.2質量部に代えてTEMPO0.2質量部を配合した以外は実施例1と同様にして、フィルム状回路接続材を得た。
安定ラジカル化合物であるTEMPOLを0.2質量部に代えて0.05質量部配合した以外は実施例1と同様にして、フィルム状回路接続材を得た。
安定ラジカル化合物であるTEMPOLを配合しない以外は実施例1と同様にして、フィルム状回路接続材を得た。
得られたフィルム状回路接続材を電子天秤(METLLER社製、商品名:UMX2)で70mg摂取し、クロロホルム(和光純薬工業(株)製、特級試薬、純度98%)1mLが収容されているガラス製の容器内に添加して撹拌した。こうして、フィルム状回路接続材をクロロホルムに溶解した溶液を得た。次いで、この溶液をろ紙(定量濾紙No.5C、アドバンテック東洋(株)製)を用いてろ過し、接着剤成分を含有するろ液を得た。
まず、ライン幅25μm、ピッチ50μm及び厚み18μmの銅回路配線を500本有するフレキシブル回路板(FPC基板)と、0.2μmの酸化インジウム(ITO)の薄層を全面に形成したガラス基板(ITO基板、厚み1.1mm、表面抵抗20Ω/□)とを準備した。次に、それらFPC基板とITO基板との間に、上述のようにして得られたフィルム状回路接続材を配置した。そして、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用いて、所定の温度、3MPaの条件下、それらの積層方向に10秒間の加熱加圧を行った。こうして、幅2mmにわたりFPC基板とITO基板とを回路接続材料の硬化物により電気的に接続した回路部材の接続構造を作製した。なお、上記所定温度は、160℃、180℃及び200℃の3パターンを採用した。
得られた回路部材の接続構造における回路間の接続抵抗を、(1)接着直後、並びに、(2)接着後80℃、95%RHの高温高湿槽中で120時間耐湿試験を行った後、マルチメータ(アドバンテスト社製、商品名:TR6848)で測定した。なお、抵抗値は、隣接する回路間の抵抗150点の平均(x+3σ)で示した。結果を表3に示す。
得られた回路部材の接続構造における回路間の接着強度を、(1)接着直後、並びに、(2)接着後80℃、95%RHの高温高湿槽中で120時間耐湿試験を行った後、JIS−Z0237に準じて90度剥離法で測定し評価した。ここで、接着強度の測定装置はテンシロンUTM−4(剥離速度50mm/min、25℃、東洋ボールドウィン社製)を使用した。結果を表3に示す。
Claims (12)
- 熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含む接着剤成分を含有する接着剤組成物であって、前記接着剤成分が25℃でのESR測定においてシグナルを有する接着剤組成物。
- 前記接着剤成分の前記ESR測定におけるg値が2.0000〜2.0100である、請求項1記載の接着剤組成物。
- 前記接着剤成分は、安定ラジカル化合物を更に含む、請求項1又は2記載の接着剤組成物。
- 前記安定ラジカル化合物がニトロキシド化合物である、請求項3記載の接着剤組成物。
- 前記熱可塑性樹脂100質量部に対して、前記ラジカル重合性化合物50〜250質量部、前記ラジカル重合開始剤0.05〜30質量部及び前記安定ラジカル化合物0.01〜10質量部を含有する、請求項3又は4記載の接着剤組成物。
- 導電性粒子を更に含有する、請求項1〜5のいずれか一項に記載の接着剤組成物。
- 前記熱可塑性樹脂100質量部に対して、前記導電性粒子を0.5〜30質量部含有する、請求項6記載の接着剤組成物。
- 対向する回路電極同士を電気的に接続するための回路接続材料であって、請求項1〜7のいずれか一項に記載の接着剤組成物を含有する回路接続材料。
- 請求項1〜7のいずれか一項に記載の接着剤組成物をフィルム状に形成してなるフィルム状接着剤。
- 請求項8記載の回路接続材料をフィルム状に形成してなるフィルム状回路接続材。
- 第1の回路基板の主面上に第1の回路電極が形成された第1の回路部材と、
第2の回路基板の主面上に第2の回路電極が形成された第2の回路部材と、
前記第1の回路基板の主面と前記第2の回路基板の主面との間に設けられ、前記第1の回路電極と前記第2の回路電極とを対向配置させた状態で電気的に接続する回路接続部材と、
を備え、
前記回路接続部材は、請求項8記載の回路接続材料の硬化物である、回路部材の接続構造。 - 半導体素子と、
前記半導体素子を搭載する基板と、
前記半導体素子及び前記基板間に設けられ、前記半導体素子及び前記基板を電気的に接続する半導体素子接続部材と、
を備え、
前記半導体素子接続部材は、請求項1〜7のいずれか一項に記載の接着剤組成物の硬化物である、半導体装置。
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