CN102277091A - 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 - Google Patents

粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 Download PDF

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Publication number
CN102277091A
CN102277091A CN2011101995600A CN201110199560A CN102277091A CN 102277091 A CN102277091 A CN 102277091A CN 2011101995600 A CN2011101995600 A CN 2011101995600A CN 201110199560 A CN201110199560 A CN 201110199560A CN 102277091 A CN102277091 A CN 102277091A
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circuit
connection material
mass parts
adhesive composite
semiconductor element
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CN2011101995600A
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Chinese (zh)
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白坂敏明
加藤木茂树
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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CN2011101995600A 2005-10-18 2006-08-24 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 Pending CN102277091A (zh)

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Application Number Priority Date Filing Date Title
JP2005-302944 2005-10-18
JP2005302944 2005-10-18
JP2006-182388 2006-06-30
JP2006182388 2006-06-30

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CN 200680038502 Division CN101292006A (zh) 2005-10-18 2006-08-24 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置

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CN102277091A true CN102277091A (zh) 2011-12-14

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KR20080068865A (ko) 2008-07-24
KR101010108B1 (ko) 2011-01-24
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