TW200718764A - Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices - Google Patents

Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices

Info

Publication number
TW200718764A
TW200718764A TW095137605A TW95137605A TW200718764A TW 200718764 A TW200718764 A TW 200718764A TW 095137605 A TW095137605 A TW 095137605A TW 95137605 A TW95137605 A TW 95137605A TW 200718764 A TW200718764 A TW 200718764A
Authority
TW
Taiwan
Prior art keywords
circuit
adhesive composition
semiconductor devices
connection structure
connecting material
Prior art date
Application number
TW095137605A
Other languages
English (en)
Chinese (zh)
Other versions
TWI336724B (ja
Inventor
Toshiaki Shirasaka
Shigeki Katogi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200718764A publication Critical patent/TW200718764A/zh
Application granted granted Critical
Publication of TWI336724B publication Critical patent/TWI336724B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
TW095137605A 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices TW200718764A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302944 2005-10-18
JP2006182388 2006-06-30

Publications (2)

Publication Number Publication Date
TW200718764A true TW200718764A (en) 2007-05-16
TWI336724B TWI336724B (ja) 2011-02-01

Family

ID=37962289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137605A TW200718764A (en) 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices

Country Status (5)

Country Link
JP (1) JPWO2007046190A1 (ja)
KR (1) KR101010108B1 (ja)
CN (2) CN102277091A (ja)
TW (1) TW200718764A (ja)
WO (1) WO2007046190A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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JP5018779B2 (ja) * 2006-08-22 2012-09-05 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
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