TW200720394A - Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices - Google Patents

Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices

Info

Publication number
TW200720394A
TW200720394A TW095137602A TW95137602A TW200720394A TW 200720394 A TW200720394 A TW 200720394A TW 095137602 A TW095137602 A TW 095137602A TW 95137602 A TW95137602 A TW 95137602A TW 200720394 A TW200720394 A TW 200720394A
Authority
TW
Taiwan
Prior art keywords
circuit
adhesive composition
connenctor
semiconductor devices
connection structure
Prior art date
Application number
TW095137602A
Other languages
Chinese (zh)
Other versions
TWI338031B (en
Inventor
Toshiaki Shirasaka
Shigeki Katogi
Hiroyuki Izawa
Keiko Tomizawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200720394A publication Critical patent/TW200720394A/en
Application granted granted Critical
Publication of TWI338031B publication Critical patent/TWI338031B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)

Abstract

An adhesive composition comprising a thermoplastic resin, a radical-polymerizable compound, a radical polymerization initiator, a nitroxide, and a basic compound.
TW095137602A 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices TW200720394A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302943 2005-10-18
JP2006182156 2006-06-30

Publications (2)

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TW200720394A true TW200720394A (en) 2007-06-01
TWI338031B TWI338031B (en) 2011-03-01

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KR (1) KR101035810B1 (en)
TW (1) TW200720394A (en)
WO (1) WO2007046189A1 (en)

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EP4092059A1 (en) * 2021-05-21 2022-11-23 3M Innovative Properties Company Curable precursor of an adhesive composition
JP2024042257A (en) * 2022-09-15 2024-03-28 株式会社レゾナック Adhesive composition, adhesive film, connection structure, and method for manufacturing the same

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JPWO2007046189A1 (en) 2009-04-23
JP6045918B2 (en) 2016-12-14
KR20080068866A (en) 2008-07-24
JP2013076089A (en) 2013-04-25
TWI338031B (en) 2011-03-01
KR101035810B1 (en) 2011-05-20
WO2007046189A1 (en) 2007-04-26

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