TW200718769A - Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device - Google Patents
Adhesive composition, adhesive composition for circuit connection, connected body semiconductor deviceInfo
- Publication number
- TW200718769A TW200718769A TW095147924A TW95147924A TW200718769A TW 200718769 A TW200718769 A TW 200718769A TW 095147924 A TW095147924 A TW 095147924A TW 95147924 A TW95147924 A TW 95147924A TW 200718769 A TW200718769 A TW 200718769A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- semiconductor device
- circuit connection
- connected body
- body semiconductor
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002348026 | 2002-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200718769A true TW200718769A (en) | 2007-05-16 |
TWI342327B TWI342327B (zh) | 2011-05-21 |
Family
ID=32462901
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095147924A TW200718769A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
TW096120755A TW200745301A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition for circuit connection |
TW092133727A TWI288170B (en) | 2002-11-29 | 2003-12-01 | Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices |
TW095147925A TW200718766A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
TW096120749A TW200801156A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition for circuit connection |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096120755A TW200745301A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition for circuit connection |
TW092133727A TWI288170B (en) | 2002-11-29 | 2003-12-01 | Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices |
TW095147925A TW200718766A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
TW096120749A TW200801156A (en) | 2002-11-29 | 2003-12-01 | Adhesive composition for circuit connection |
Country Status (7)
Country | Link |
---|---|
US (2) | US7576141B2 (zh) |
JP (1) | JP4304508B2 (zh) |
KR (3) | KR100780135B1 (zh) |
CN (2) | CN1288219C (zh) |
AU (1) | AU2003284508A1 (zh) |
TW (5) | TW200718769A (zh) |
WO (1) | WO2004050779A1 (zh) |
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DE102005029407B4 (de) * | 2005-06-24 | 2008-06-19 | Mühlbauer Ag | Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat |
KR101035810B1 (ko) * | 2005-10-18 | 2011-05-20 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치 |
CN102277091A (zh) * | 2005-10-18 | 2011-12-14 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 |
EP1958996B1 (en) * | 2005-12-09 | 2010-03-17 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive composition and adhesive using same |
KR100727741B1 (ko) * | 2005-12-30 | 2007-06-13 | 제일모직주식회사 | 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재 |
CN103360976B (zh) | 2006-04-26 | 2016-08-03 | 日立化成株式会社 | 粘接带及使用其的太阳能电池模块 |
WO2007125789A1 (ja) * | 2006-04-27 | 2007-11-08 | Panasonic Corporation | 接続構造体及びその製造方法 |
EP2053108A4 (en) | 2006-08-04 | 2012-12-12 | Hitachi Chemical Co Ltd | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME |
EP2257141A3 (en) * | 2006-08-22 | 2012-01-18 | Hitachi Chemical Co., Ltd. | Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
JP2008111091A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
JP2008159819A (ja) * | 2006-12-22 | 2008-07-10 | Tdk Corp | 電子部品の実装方法、電子部品内蔵基板の製造方法、及び電子部品内蔵基板 |
US20080275326A1 (en) * | 2007-05-01 | 2008-11-06 | Joachim Kasielke | Sensor for monitoring a condition of a patient |
KR20120085313A (ko) * | 2007-06-06 | 2012-07-31 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴의 형성방법, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법 |
KR20100020029A (ko) * | 2007-06-13 | 2010-02-19 | 히다치 가세고교 가부시끼가이샤 | 회로 접속용 필름상 접착제 |
CN104059547B (zh) * | 2008-09-30 | 2016-08-24 | 迪睿合电子材料有限公司 | 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法 |
JP4360446B1 (ja) * | 2008-10-16 | 2009-11-11 | 住友ベークライト株式会社 | 半導体装置の製造方法及び半導体装置 |
KR20100058359A (ko) * | 2008-11-24 | 2010-06-03 | 삼성전자주식회사 | 다층 반도체 패키지, 그것을 포함하는 반도체 모듈 및 전자신호 처리 시스템 및 다층 반도체 패키지의 제조 방법 |
KR101525649B1 (ko) * | 2009-02-20 | 2015-06-03 | 헨켈 아이피 앤드 홀딩 게엠베하 | 전극의 접속 방법 및 그것에 사용되는 접속 조성물 |
WO2010104125A1 (ja) * | 2009-03-10 | 2010-09-16 | 積水化学工業株式会社 | 半導体チップ積層体の製造方法及び半導体装置 |
JP4930623B2 (ja) * | 2009-04-28 | 2012-05-16 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法 |
CN102859797B (zh) * | 2010-04-22 | 2015-05-20 | 积水化学工业株式会社 | 各向异性导电材料及连接结构体 |
TWI430426B (zh) * | 2010-10-19 | 2014-03-11 | Univ Nat Chiao Tung | 使用共用傳導層傳送晶片間多重信號之系統 |
EP2484700B1 (de) * | 2011-02-04 | 2013-10-09 | LANXESS Deutschland GmbH | Funktionalisierte Nitrilkautschuke und ihre Herstellung |
JP5750937B2 (ja) | 2011-02-25 | 2015-07-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
KR101508761B1 (ko) | 2011-12-12 | 2015-04-06 | 제일모직주식회사 | 광학 필름용 조성물 및 이로부터 제조된 광학 필름 |
JP6454580B2 (ja) * | 2015-03-30 | 2019-01-16 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
CN108350105B (zh) * | 2015-11-26 | 2020-10-13 | 三键有限公司 | 热固化性组合物及使用其的导电性粘接剂 |
CN106842647A (zh) * | 2017-03-20 | 2017-06-13 | 武汉华星光电技术有限公司 | 一种显示装置、绑定结构及其制备方法 |
JP6718183B1 (ja) * | 2019-06-24 | 2020-07-08 | 株式会社アイ・メデックス | 電子回路基板を備えた生体電極 |
CN110600163B (zh) * | 2019-09-19 | 2021-04-20 | 云谷(固安)科技有限公司 | 导电薄膜及其制备方法、显示装置 |
US11510864B2 (en) * | 2019-11-11 | 2022-11-29 | Melissa Joy Crew | Removable hair coloring composition and methods of use thereof |
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JP2002012637A (ja) * | 2000-06-28 | 2002-01-15 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
JP4599666B2 (ja) * | 2000-06-29 | 2010-12-15 | 日立化成工業株式会社 | 導電性樹脂ペースト組成物及びこれを用いた半導体装置 |
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JP4590732B2 (ja) | 2000-12-28 | 2010-12-01 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路板の製造方法、回路板 |
JP2002363218A (ja) * | 2001-06-07 | 2002-12-18 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
JP2003321508A (ja) * | 2002-04-26 | 2003-11-14 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
JP2004018715A (ja) * | 2002-06-18 | 2004-01-22 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
CN1914666B (zh) * | 2004-01-27 | 2012-04-04 | 松下电器产业株式会社 | 声音合成装置 |
-
2003
- 2003-12-01 TW TW095147924A patent/TW200718769A/zh not_active IP Right Cessation
- 2003-12-01 JP JP2004556874A patent/JP4304508B2/ja not_active Expired - Fee Related
- 2003-12-01 TW TW096120755A patent/TW200745301A/zh unknown
- 2003-12-01 WO PCT/JP2003/015351 patent/WO2004050779A1/ja active Application Filing
- 2003-12-01 AU AU2003284508A patent/AU2003284508A1/en not_active Abandoned
- 2003-12-01 TW TW092133727A patent/TWI288170B/zh not_active IP Right Cessation
- 2003-12-01 KR KR1020067024722A patent/KR100780135B1/ko active IP Right Grant
- 2003-12-01 TW TW095147925A patent/TW200718766A/zh not_active IP Right Cessation
- 2003-12-01 CN CNB2003801005869A patent/CN1288219C/zh not_active Expired - Fee Related
- 2003-12-01 KR KR1020067024723A patent/KR100780136B1/ko active IP Right Grant
- 2003-12-01 TW TW096120749A patent/TW200801156A/zh unknown
- 2003-12-01 CN CN2006101371470A patent/CN1931947B/zh not_active Expired - Fee Related
- 2003-12-01 KR KR1020047019504A patent/KR100730629B1/ko active IP Right Grant
-
2005
- 2005-05-27 US US11/138,645 patent/US7576141B2/en not_active Expired - Fee Related
-
2009
- 2009-06-26 US US12/492,492 patent/US7795325B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2003284508A1 (en) | 2004-06-23 |
TWI342327B (zh) | 2011-05-21 |
JP4304508B2 (ja) | 2009-07-29 |
TW200801156A (en) | 2008-01-01 |
KR100780135B1 (ko) | 2007-11-28 |
KR100730629B1 (ko) | 2007-06-20 |
CN1288219C (zh) | 2006-12-06 |
CN1692149A (zh) | 2005-11-02 |
TWI288170B (en) | 2007-10-11 |
US20090261483A1 (en) | 2009-10-22 |
KR20060133112A (ko) | 2006-12-22 |
KR20060130268A (ko) | 2006-12-18 |
TW200422372A (en) | 2004-11-01 |
TW200718766A (en) | 2007-05-16 |
US7795325B2 (en) | 2010-09-14 |
TWI328602B (zh) | 2010-08-11 |
TW200745301A (en) | 2007-12-16 |
US7576141B2 (en) | 2009-08-18 |
CN1931947B (zh) | 2013-05-22 |
KR100780136B1 (ko) | 2007-11-28 |
CN1931947A (zh) | 2007-03-21 |
JPWO2004050779A1 (ja) | 2006-03-30 |
US20050282924A1 (en) | 2005-12-22 |
WO2004050779A1 (ja) | 2004-06-17 |
KR20050044767A (ko) | 2005-05-12 |
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