TW200619342A - Semiconductor device containing adhesive composition - Google Patents

Semiconductor device containing adhesive composition

Info

Publication number
TW200619342A
TW200619342A TW095100333A TW95100333A TW200619342A TW 200619342 A TW200619342 A TW 200619342A TW 095100333 A TW095100333 A TW 095100333A TW 95100333 A TW95100333 A TW 95100333A TW 200619342 A TW200619342 A TW 200619342A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
present
semiconductor device
device containing
containing adhesive
Prior art date
Application number
TW095100333A
Other languages
Chinese (zh)
Other versions
TWI277642B (en
Inventor
Shigeki Katogi
Hoko Suto
Hiroyuki Izawa
Masami Yusa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200619342A publication Critical patent/TW200619342A/en
Application granted granted Critical
Publication of TWI277642B publication Critical patent/TWI277642B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H3/00—Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion
    • F16H3/44—Toothed gearings for conveying rotary motion with variable gear ratio or for reversing rotary motion using gears having orbital motion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02—Toothed members; Worms
    • F16H55/08—Profiling
    • F16H55/0806—Involute profile
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
    • F16H55/02—Toothed members; Worms
    • F16H55/08—Profiling
    • F16H2055/0866—Profiles for improving radial engagement of gears, e.g. chamfers on the tips of the teeth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention is to provide a semiconductor device containing adhesive composition. The adhesive composition of the present invention comprises a thermoplastic resin, a radically polymerizable compound, a first radical polymerization initiator having 90-145 DEG C half-life temperature for 1 min and a second radical polymerization initiator having 150-175 DEG C half-life temperature for 1 min. According to the content of present invention, a hardening process having a wide process margin which can be rapidly carried out at a low temperature can be obtained. The adhesive composition and the semiconductor of the present invention have very stable adhesive strength or connects circuits
TW095100333A 2004-05-10 2005-03-03 Semiconductor devices containing adhesive composition TWI277642B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004140181A JP2005320455A (en) 2004-05-10 2004-05-10 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device

Publications (2)

Publication Number Publication Date
TW200619342A true TW200619342A (en) 2006-06-16
TWI277642B TWI277642B (en) 2007-04-01

Family

ID=35349130

Family Applications (3)

Application Number Title Priority Date Filing Date
TW095100333A TWI277642B (en) 2004-05-10 2005-03-03 Semiconductor devices containing adhesive composition
TW094106487A TWI265191B (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
TW095141736A TW200718765A (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW094106487A TWI265191B (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
TW095141736A TW200718765A (en) 2004-05-10 2005-03-03 Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device

Country Status (4)

Country Link
JP (1) JP2005320455A (en)
KR (2) KR100698916B1 (en)
CN (2) CN1304517C (en)
TW (3) TWI277642B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727741B1 (en) 2005-12-30 2007-06-13 제일모직주식회사 Anisotropic conductive adhesive for hyper speed hardening, and anisotropic conductive film using the same
KR20110011755A (en) 2006-04-26 2011-02-08 히다치 가세고교 가부시끼가이샤 Adhesive for electrically connecting solar battery cell and metal foil
KR101081263B1 (en) * 2006-05-09 2011-11-08 히다치 가세고교 가부시끼가이샤 Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
JP5137347B2 (en) * 2006-07-12 2013-02-06 旭化成イーマテリアルズ株式会社 Thermosetting coating composition
US20100243303A1 (en) * 2006-08-22 2010-09-30 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member
CN101617267B (en) * 2007-02-20 2012-08-15 三井化学株式会社 Curable resin composition for sealing liquid crystal, and method for production of liquid crystal display panel using the same
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5292838B2 (en) * 2007-08-30 2013-09-18 日立化成株式会社 Adhesive and circuit member connection structure
CN101836266B (en) * 2007-10-22 2012-02-15 日本化学工业株式会社 Coated conductive powder and conductive adhesive using the same
KR20110036733A (en) * 2008-07-11 2011-04-08 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 Anisotropic conductive film
TWI382225B (en) * 2008-08-06 2013-01-11 Au Optronics Corp Liquid crystal display and packaging method thereof
CN104059547B (en) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 Anisotropic conductive adhesive and use the preparation method of connection structural bodies of this binding agent
WO2010125965A1 (en) * 2009-04-28 2010-11-04 日立化成工業株式会社 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
JP5621320B2 (en) * 2010-05-19 2014-11-12 デクセリアルズ株式会社 Method for manufacturing connection structure
JP5293779B2 (en) * 2010-07-20 2013-09-18 日立化成株式会社 Adhesive composition, circuit connection structure, semiconductor device and solar cell module
KR20120068751A (en) * 2010-07-26 2012-06-27 히다치 가세고교 가부시끼가이샤 Adhesive composition, connection structure, method for producing connection structure, and use of adhesive composition
KR101293788B1 (en) * 2010-11-24 2013-08-06 제일모직주식회사 Composition For Anisotropic Conductive Film And Anisotropic Conductive Film Using the Same
KR20120076187A (en) * 2010-12-29 2012-07-09 제일모직주식회사 Anisotropic conductive film
WO2013035164A1 (en) * 2011-09-06 2013-03-14 日立化成株式会社 Adhesive composition and connection body
JP5844588B2 (en) * 2011-09-21 2016-01-20 デクセリアルズ株式会社 Circuit connection material, connection method using the same, and connection structure
TWI591151B (en) 2013-05-24 2017-07-11 明基材料股份有限公司 Adhesive composition for conduction between electrical elements
CN103360956B (en) * 2013-06-18 2015-06-03 明基材料有限公司 Sticking agent for electrical property conduction between electronic components
JP6398570B2 (en) * 2013-10-09 2018-10-03 日立化成株式会社 Circuit connection material, circuit member connection structure, and method of manufacturing circuit member connection structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3749032B2 (en) * 1999-01-14 2006-02-22 株式会社フジクラ Method of switching connection between waveguide type optical device and optical fiber
WO2000046315A1 (en) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
JP2001323246A (en) * 2000-03-07 2001-11-22 Sony Chem Corp Adhesive for connecting electrode and bonding method using the adhesive
JP2001262078A (en) * 2000-03-17 2001-09-26 Sony Chem Corp Connecting material
WO2001082363A1 (en) * 2000-04-25 2001-11-01 Hitachi Chemical Co., Ltd. Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
JP4599666B2 (en) * 2000-06-29 2010-12-15 日立化成工業株式会社 Conductive resin paste composition and semiconductor device using the same
JP2002184487A (en) * 2000-12-15 2002-06-28 Sony Chem Corp Anisotropic conductive adhesive
JP4590732B2 (en) * 2000-12-28 2010-12-01 日立化成工業株式会社 Circuit connection material, circuit board manufacturing method using the same, and circuit board
KR100484383B1 (en) * 2000-12-28 2005-04-20 히다치 가세고교 가부시끼가이샤 Anisotropic conductive adhesives for connecting circuit, and connecting method of circuit board and circuit connected structure material using the same
JP2002201456A (en) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd Adhesive composition, connecting method of circuit terminal using the same, and connected structure of circuit terminal
JP3858740B2 (en) * 2002-03-27 2006-12-20 日立化成工業株式会社 Adhesive composition for circuit connection and circuit connection structure using the same
JP2004067908A (en) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd Anisotropically electroconductive adhesive

Also Published As

Publication number Publication date
KR100698916B1 (en) 2007-03-23
KR20070001854A (en) 2007-01-04
CN1696234A (en) 2005-11-16
TW200536921A (en) 2005-11-16
TW200718765A (en) 2007-05-16
CN1970673A (en) 2007-05-30
TWI265191B (en) 2006-11-01
JP2005320455A (en) 2005-11-17
KR100832625B1 (en) 2008-05-27
TWI343408B (en) 2011-06-11
CN1304517C (en) 2007-03-14
TWI277642B (en) 2007-04-01
KR20060044832A (en) 2006-05-16
CN1970673B (en) 2012-03-28

Similar Documents

Publication Publication Date Title
TW200619342A (en) Semiconductor device containing adhesive composition
TW200615355A (en) Adhesive composition and circuit connecting material and circuit component connecting structure and semiconductor apparatus
DE60323702D1 (en) A pressure-sensitive acrylate adhesive composition and pressure-sensitive adhesive tape
EP0969065A3 (en) Die attach adhesives for use in microelectronic
TW200704654A (en) Compositions for brightness enhancing films
DE602005015766D1 (en) ORGANOSILICIUM FUNCTIONAL BORAMINATE CATALYST COMPLEXES AND CURABLE COMPOSITIONS MADE THEREFROM
TW200617086A (en) Curable resin composition, curable film and cured film
TW200504170A (en) Pressure-sensitive adhesive composition and pressure-sensitive adhesive product
WO2005000983A3 (en) Curable silicone compositions having improved adhesion to polymeric films
TW200420575A (en) Michael addition compositions
WO2007139596A3 (en) Borane catalyst complexes with amide functional polymers and curable compositions made therefrom
EP0969060A3 (en) Underfill encapsulant compositions for use in electronic devices
MX2008002127A (en) Amino group-terminal viscosifiers, resultant products and uses thereof.
WO2009031472A1 (en) Adhesive and connecting structure using the same
ATE300589T1 (en) POLYMERIZATION INITIATOR SYSTEMS AND ADHESIVE COMPOSITIONS CONTAINING VINYL AROMATIC COMPOUNDS
EP1666535A4 (en) Resin compositions, composites made by using the same, and process for production thereof
ATE380853T1 (en) METAL SALT MODIFICATORS FOR ADHESIVES
ATE500283T1 (en) TELECHELES AZLACTONE POLYMER
SG145726A1 (en) Method for joining substrates and objects
ATE365176T1 (en) INITIATOR SYSTEMS CONTAINING BETA-KETONE COMPOUNDS AND COMPOSITIONS PRODUCED THEREFROM
ATE464875T1 (en) RADICAL POLYMERIZABLE MACROCYCLIC RESIN COMPOSITIONS WITH LOW POLYMERIZATION VOLTAGE
ATE437895T1 (en) POLYBUTADIENE COMPOSITIONS, METHODS AND ITEMS
ATE547433T1 (en) AQUEOUS ADHESIVE DISPERSIONS
WO2003082901A3 (en) Template-driven processes for synthesizing polymers and components related to such processes
TW200720394A (en) Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees