CN103360956B - Sticking agent for electrical property conduction between electronic components - Google Patents
Sticking agent for electrical property conduction between electronic components Download PDFInfo
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- CN103360956B CN103360956B CN201310240011.2A CN201310240011A CN103360956B CN 103360956 B CN103360956 B CN 103360956B CN 201310240011 A CN201310240011 A CN 201310240011A CN 103360956 B CN103360956 B CN 103360956B
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Abstract
The invention discloses a sticking agent for electrical property conduction between electronic components. The sticking agent comprises 25-46 parts by weight of chemigum, 25-45 parts by weight of acroleic acid oligomer, 16 to 32 parts by weight of thermoplastic resin, and two types of organic peroxides, wherein the mooney viscosity (ML 1+4@100 DEG C) of chemigum ranges from 50 to 75, the thermoplastic resin is a cohort which is constituted by freedom benzene epoxy, a polymethacrylate copolymer, a polystyrene copolymer and bakelite, and two types of the organic xperoxides have different one minute half-life temperatures and coupling agents. The sticking agent provided by the invention can generate internal-contractility mechanical features which can supply the adhesive force during direct bonding between two electronic components after being strengthened, so that electrical property conduction is realized between the two electronic components. Furthermore, the sticking agent has the characteristics of favorable chemical stability, and easy in preservation.
Description
Technical field
The present invention has about a kind of tackiness agent, and relates to a kind of tackiness agent for electrically conducting between electronic component especially.
Background technology
In recent years, along with the IC wafer height aggregation in electronic component, the narrow distanceization of bump pitch, projection area leptoprosopy long-pendingization, anisotropic conductive (the anisotropic conductive film be generally used between conducting two electronic component, ACF), because the pressing probability of the conducting particles in glue and amassing of leptoprosopy projection reduces, the conductance passband of vertical direction (Z-direction) is thus decreased.And because the narrow distanceization design of bump pitch, also make conducting particles be easier to horizontal direction (XY direction) conducting, therefore increase the probability that electronic component produces short circuit.
Taiwan Patent publication number TW201012890 discloses a kind of vinylformic acid insulativity tackiness agent, it utilizes the projection of IC wafer and the connection gasket of wiring substrate to do directly to engage to realize electrically conducting, thus overcomes the IC wafer of anisotropic conductive in high aggregation with wiring substrate in the difficulty electrically engaged.
Summary of the invention
In view of this, the present invention proposes a kind of tackiness agent of novelty, is a kind of insulating polymer.Tackiness agent of the present invention can produce the mechanical characteristics of interior convergent force after sclerosis, can maintain two electronic components and directly engage required clinging power to keep electrically conducting.And tackiness agent proposed by the invention possesses good peeling force and preserves stable advantage.Moreover tackiness agent of the present invention, because possessing rubber component, therefore has flexual advantage, the exploitation of soft electronic element can be applied to further.
Tackiness agent for electrically conducting between electronic component provided by the present invention, comprising: paracril, and mooney viscosity (Mooney viscosity, the ML 1+4@100 DEG C) scope of this nitrile rubber is 50 to 75; Acrylate oligomers; Thermoplastic resin, and this thermoplastic resin is selected from the group be made up of phenoxy resin, polymethacrylate copolymer, polystyrene copolymer and resol; Two kinds of organo-peroxides, these two kinds of organo-peroxides have different one minute half life temperature and coupler; Wherein, this paracril is 25 weight part to 46 weight parts, and this acrylate oligomers is 25 weight part to 45 weight parts, and this thermoplastic resin is 16 weight part to 32 weight parts.
According to one embodiment of the invention, the weight average molecular weight scope of above-mentioned paracril is 20 ten thousand to 60 ten thousand.
According to one embodiment of the invention, aforesaid propylene acid oligomer is selected from the group be made up of epoxy acrylic oligomer ester, urethane acrylate oligomer, polyester acrylic oligomer ester and acroleic acid esterification polyacrylic acid oligomer ester.
According to one embodiment of the invention, above-mentioned two kinds of organo-peroxides comprise high temperature organo-peroxide, one minute half life temperature scope of this high temperature organo-peroxide is 130 DEG C to 140 DEG C, and this high temperature organo-peroxide can be selected from benzoyl peroxide or peroxidation two (4-toluyl); And low temperature organic per-compounds, one minute half life temperature scope of this low temperature organo-peroxide is 110 DEG C to 120 DEG C, and this low temperature organic per-compounds can be selected from dilauroyl peroxide or bis(2，4-dichlorobenzoyl)peroxide.
According to one embodiment of the invention, relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, above-mentioned two kinds of organo-peroxides are about 0.5 weight part to 5 weight part.
According to one embodiment of the invention, above-mentioned coupler is selected from the group that phosphoric acid methacryloyl 2-ethoxyethyl acetate, vinyltriacetoxy silane, 3-glycidoxy-propyltrimethoxy silane and three (trimethoxy silicon propyl group) isocyanic ester form.
According to one embodiment of the invention, relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, above-mentioned coupler is about 0.5 weight part to 2.0 weight part.
According to one embodiment of the invention, above-mentioned tackiness agent can comprise reaction promotor, linking agent or its combination further.
According to one embodiment of the invention, above-mentioned reaction promotor is selected from the group be made up of xylidine, Diethyl Aniline, dimethyl-p-toluidine, and relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, this reaction promotor is about 0.5 weight part to 2.0 weight part.
According to one embodiment of the invention, above-mentioned linking agent has the oligomer of more than three unsaturated double-bonds, above-mentioned linking agent is selected from the group be made up of tricarbimide three hydroxyl second fat triacrylate, Viscoat 295 and pentaerythritol triacrylate, and relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, this linking agent is about 1 weight part to 4 weight part.
The tackiness agent of a kind of novelty provided by the invention, comprise paracril, acrylate oligomers, thermoplastic resin, two kinds of organo-peroxides and coupler, the mechanical characteristics of interior convergent force can be produced after sclerosis, thus can be used for providing the clinging power directly needed for bonding between two electronic components, and make to realize between two electronic components electrically conducting.Therefore, tackiness agent of the present invention can meet the electric connection problem between the electronic component of Gao Jihua.In addition, tackiness agent of the present invention also has good chemical stability, is easy to the advantage of preserving.
Accompanying drawing explanation
Without accompanying drawing
Embodiment
For making there is further understanding to object of the present invention, structure, feature and function thereof, embodiment is hereby coordinated to be described in detail as follows.
One embodiment of the present invention proposes a kind of tackiness agent of novelty, and two electronic components are directly engaged to produce to electrically conduct by convergent force in producing by sclerosis is rear.And tackiness agent proposed by the invention possesses good peeling force and preserves stable advantage.And the rubber component in tackiness agent has flexual advantage, the exploitation of soft electronic element can be applied to further.
Tackiness agent provided by the present invention, comprising: the paracril of 25 weight part to 46 weight parts, and its mooney viscosity (ML 1+4@100 DEG C) scope is 50 to 75; The acrylate oligomers of 25 weight part to 45 weight parts; The thermoplastic resin of 16 weight part to 32 weight parts, and thermoplastic resin is for being selected from the group be made up of phenoxy resin, polymethacrylate copolymer, polystyrene copolymer and resol; Two kinds of organo-peroxides, these organo-peroxides have different one minute half life temperature and coupler.Wherein, paracril mooney viscosity according to ASTM D-1646 specification measured by.
When the paracril content in tackiness agent is very few, then the film-forming properties of tackiness agent is not enough; When the content of paracril is too much, then cause the dimensional stability of tackiness agent after sclerosis not good.
Therefore, in one embodiment of this invention, relative to the acrylic resin of 25 weight part to 45 weight parts and the thermoplastic resin of 16 weight part to 32 weight parts, the content of paracril is preferably 25 weight part to 46 weight parts.In another preferred embodiment of the present invention, the content of paracril is preferably 35 weight part to 43 weight parts.
Again, when the molecular weight of paracril is too large or mooney viscosity is too high, then the mobility of tackiness agent can be made not good, thus cause the loose contact between two electronic components, electroconductibility declines.Otherwise, when the molecular weight of paracril is too little or mooney viscosity is too low, then the mobility of tackiness agent can be made too high, and produce glue phenomenon of overflowing, will the adhesion between two electronic components be affected.
Therefore, the weight average molecular weight scope of paracril is 20 ten thousand to 60 ten thousand, is preferably 25 ten thousand to 50 ten thousand, and the best is 30 ten thousand to 45 ten thousand.In one embodiment of this invention, mooney viscosity (the ML1+4@100 DEG C) scope of paracril is 50 to 75.In another preferred embodiment of the present invention, mooney viscosity (the ML 1+4@100 DEG C) scope of paracril is 60 to 75, and its weight average molecular weight is about 330,000.
Tackiness agent provided by the present invention, because of the composition of tool acrylate oligomers, therefore required stiffening temperature is lower, therefore can be applicable to the processing procedure needing low temperature to engage between electronic component, such as: can be in the processing procedures such as COG (Chip on Glass), TAB (Tape Automated Bonding), COF (Chip on Film) and use.
Above-mentioned acrylate oligomers can be acrylate oligomers general in the art, the group that such as optional free epoxy acrylate oligomer, urethane acrylate oligomer, polyester acrylic oligomer ester and acroleic acid esterification polyacrylic acid oligomer ester form, but not as limit.In one embodiment of the invention, acrylate oligomers is epoxy acrylic oligomer ester.
When the acrylate oligomers content in tackiness agent is very few, because the composition that can produce crosslinking reaction reduces, by causing, the dimensional stability of the tackiness agent after hardening is not good.Otherwise, when the acrylate oligomers content in tackiness agent is too much, the peeling force causing tackiness agent after sclerosis is declined.
Therefore, in one embodiment of the invention, relative to the paracril of 25 weight part to 46 weight parts and the thermoplastic resin of 16 weight part to 32 weight parts, acrylate oligomers is about 25 weight part to 45 weight parts.In another preferred embodiment of the present invention, acrylate oligomers is 34 weight part to 41 weight parts.
Moreover the thermoplastic resin in tackiness agent is the clinging power improved between tackiness agent and electronic component, if the usage quantity of thermoplastic resin is very few, then cause the clinging power of tackiness agent too low; If the usage quantity of thermoplastic resin is too much, then cause the film-forming properties of tackiness agent not good, the performance that electrically conducts after affecting this compacting journey between two electronic components.
Therefore, in one embodiment of the invention, relative to the paracril of 25 weight part to 46 weight parts and the acrylate oligomers of 25 weight part to 45 weight parts, thermoplastic resin is 16 weight part to 32 weight parts.In another preferred embodiment of the present invention, thermoplastic resin is phenoxy resin, is about 18 weight part to 26 weight parts.
Include two kinds of organo-peroxides in tackiness agent proposed by the invention, one is low temperature organo-peroxide, and another kind is high temperature organo-peroxide.These organo-peroxides have one minute different half life temperature, and its function is as polymerization initiators.
When only using low temperature organo-peroxide, though can reduce the temperature of sclerous reaction, the unstable of low temperature organo-peroxide own is high.And under pyroreaction condition, low temperature organo-peroxide complete reaction, but in tackiness agent, still have the non-complete reaction of unsaturated double-bond.Therefore, the present invention proposes the polymerization initiators system of two kinds of superoxide, the temperature of sclerous reaction is reduced by low temperature organic per-compounds, and high temperature organo-peroxide, the unsaturated double-bond complete reaction in tackiness agent can be impelled, thus, the dimensional stability of the rear tackiness agent of reaction can just be improved.
Above-mentioned high temperature organo-peroxide, an one minute half life temperature scope is 130 DEG C to 140 DEG C, such as: can be benzoyl peroxide (half life temperature was 132 DEG C in a minute) or two (4-toluyl) (half life temperature was 130 DEG C in one minute) of peroxidation.Above-mentioned low temperature organic per-compounds, an one minute half life temperature scope is 110 DEG C to 120 DEG C, such as: can be dilauroyl peroxide (half life temperature was 117 DEG C in a minute) or bis(2，4-dichlorobenzoyl)peroxide (half life temperature was 112 DEG C in a minute).
In a preferred embodiment of the present invention, low temperature organo-peroxide is dilauroyl peroxide, and high temperature organo-peroxide is benzoyl peroxide.
In another embodiment of the present invention, relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, two kinds of organo-peroxides are about 0.5 weight part to 5 weight part.It should be noted that, because tackiness agent of the present invention can also comprise except paracril, acrylate oligomers, thermoplastic resin, other component outside two kinds of organo-peroxides and coupler, thus for quantizing or weigh the content of two kinds of organo-peroxides of the present invention better, with paracril in present embodiment, total 100 weight part of acrylate oligomers and thermoplastic resin as a reference or comparison standard, but also this cannot limit paracril in tackiness agent of the present invention, the total weight parts of acrylate oligomers and thermoplastic resin, that is for the present invention, paracril in tackiness agent, the total of acrylate oligomers and thermoplastic resin is in fact to be not equal to 100 weight parts.
Tackiness agent provided by the present invention, the coupler in its composition improves clinging power.Coupler can be coupler general in the art, such as can be selected from the group that phosphoric acid methacryloyl 2-ethoxyethyl acetate, vinyltriacetoxy silane, 3-glycidoxy-propyltrimethoxy silane and three (trimethoxy silicon propyl group) isocyanic ester form, but not as limit.In one embodiment of the invention, relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, coupler is about 0.5 weight part to 2.0 weight part.
In a preferred embodiment of the present invention, coupler is phosphoric acid methacryloyl 2-ethoxyethyl acetate, and tackiness agent can be made to possess the characteristic of high-temp resisting high-humidity resisting.
Except above-mentioned composition, tackiness agent provided by the present invention can comprise reaction promotor, linking agent or its combination further.
Above-mentioned linking agent can be selected from the oligomer with more than three unsaturated double-bonds, the group that such as optional free tricarbimide three hydroxyl second fat triacrylate, Viscoat 295 and pentaerythritol triacrylate form, but not as limit.And relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, linking agent is about 1 weight part to 4 weight part.
In a preferred embodiment of the present invention, the group that the optional free xylidine of reaction promotor, Diethyl Aniline and dimethyl-p-toluidine form.And relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, reaction promotor is about 0.5 weight part to 2.0 weight part.
In a preferred embodiment of the present invention, linking agent is tricarbimide three hydroxyl second fat triacrylate, and reaction promotor is xylidine.
The preparation method of tackiness agent
Embodiment 1
Get 20g paracril (trade(brand)name NBR1051, molecular weight is about 330,000, mooney viscosity (ML1+4@100 DEG C) is 60 to 75, purchased from southern chemical limited-liability company) be dissolved in 80g ethyl methyl ketone (as solvent), take obtained solid content as first solution of 20%.Then get 37g thermoplastic resin phenoxy resin (trade(brand)name PKHH, molecular weight is about 52000, purchased from InChem Corp.), be dissolved in 63g ethyl methyl ketone, to prepare the second solution of solid content 37%.
First step, get first solution of 13g, second solution of 4.39g, acrylate oligomers (the trade(brand)name 3002A of 2.275g, for epoxy acrylic oligomer, purchased from common prosperity society), phosphoric acid methacryloyl 2-ethoxyethyl acetate (the trade(brand)name P-A (N) of 0.07g, purchased from common prosperity society) with the ethyl methyl ketone Homogeneous phase mixing of 3.5g, and under room temperature high-speed stirring 300 seconds with forming reactions solution.
Then, second step, benzoyl peroxide (the Dibenzoyl peroxide of 0.035g is added in above-mentioned reaction soln (obtained in first step), and the dilauroyl peroxide of 0.07g (Dilauroyl peroxide BPO), LPO), under room temperature, high-speed stirring 300 seconds, can obtain tackiness agent 1.
Above-mentioned tackiness agent 1 is coated on release film, dries to remove solvent.Wherein drying condition is: temperature 80 DEG C, 5 minutes time, and finally obtained thickness is the adhesive-film of 35 μm.
Embodiment 2 to embodiment 5
The making method of embodiment 2 to embodiment 5 is with embodiment 1, and difference place is only that paracril, thermoplastic resin, acrylate oligomers are different from the weight part of solvent, and detailed composition please refer to table one.
Embodiment 6
The making method of embodiment 6 is with embodiment 1, and difference is in and in first step in the addition of xylidine (Dimethylaniline, DMA), as reaction promotor in embodiment 6 more.
Embodiment 7
The making method of embodiment 7 is with embodiment 6, difference is in and in first step, with the addition of tricarbimide three hydroxyl second fat triacrylate (Tris (2-hydroxy ethyl) isocyanurate Triacrylate in embodiment 7, THEICTA) as linking agent, and embodiment 7 is from respectively to form the weight part used in embodiment 6 different.
The making of electronic component connecting structure body
By adhesive-film obtained for above-described embodiment 1 ~ 7 and by printed circuit board (PCB) (model: PCB Test Kit, projection area 3.4mm × 130 μm, number of slugs is 91, and spacing is 250 μm, be highly 40 μm, purchased from Taiwan will superfamily skill) carry out pre-pressing.Wherein, pre-pressing condition is: temperature 200 DEG C, 5 seconds time.
Then, after removing the release film on adhesive-film, by printed circuit board (PCB) and flexible circuit board (model: BMC-1010419, live width is 120 μm, spacing is 250 μm, is highly 8 μm, purchased from Taiwan Xin Bao electronics limited-liability company) carry out contraposition and pre-pressing.Wherein, pre-pressing condition is: temperature 50 C, 5 seconds time.
The printed circuit board (PCB), adhesive-film and the flexible circuit board that to connect, carry out this compacting journey and polyreaction again, to complete the making of electronic component connecting structure body.Wherein, the condition of this compacting journey is: temperature 175 DEG C, 5 seconds time.
The testing electrical property of electronic component connecting structure body
Testing electrical property is the conductance general character utilizing four-point probe formula ohmer to measure electronics connecting structure body, and utilizes two-point ohmer to measure the electrical insulating property of electronics connecting structure body.Electrical test results please refer to table two.
Electronic component connecting structure body made by adhesive-film, flexible circuit board and printed circuit board (PCB) obtained by embodiment 1 ~ 7 is carried out the measurement of the conductance general character, initial turn-on resistance is 0.044 Ω ~ 0.088 Ω, through hot and humid reliability-test condition (temperature 85 DEG C, relative humidity 85%, 500 hours test durations (hrs)), the conducting resistance of above-mentioned electronic component connecting structure body is all less than 0.2 Ω.
Electronic component connecting structure body made by adhesive-film, flexible circuit board and printed circuit board (PCB) obtained by embodiment 1 ~ 7 is carried out electrical insulating property measurement, and initial insulation resistance is 5.12 × 10
9Ω ~ 1.28 × 10
10Ω, through hot and humid reliability-test condition (temperature 85 DEG C, relative humidity 85%, 500 hours test durations (hrs)), the insulation resistance of above-mentioned electronic component connecting structure body is 9.98 × 10
9Ω ~ 2.09 × 10
10Ω.
The peel test force of electronic component connecting structure body
Printed circuit board (PCB) in electronic component connecting structure body is fixed with tool, clamps flexible circuit board with fixture simultaneously.Then, use puller system to be moved up with the direction of 90 degree of vertical printed circuit plates by fixture, the speed wherein moved up is 50mm/min, until adhesive-film is peeled off completely from printed circuit board (PCB), namely completes peel test force.
Carry out peeling force measurement from above-mentioned made electronic component connecting structure body, initial peeling force is 1.54Kgf/in to 2.45Kgf/in.Through hot and humid reliability-test condition (temperature 85 DEG C, relative humidity 85%, 500 hours test durations (hrs)), the peeling force of electronic component connecting structure body is 1.97Kgf/in to 3.48Kgf/in.
The storage stability test of adhesive-film
After prepared by adhesive-film, not necessarily immediately use, therefore needed to possess good storage stability.Can learn from table two, the adhesive-film obtained by embodiment 1 ~ 7, its initial peeling force, with under temperature 40 DEG C of preservation conditions, is placed the peeling force after 72 hours and is compared change not quite.It can thus be appreciated that the adhesive-film obtained by embodiment 1 ~ 7 has good storage stability.
Table one: the detailed composition of embodiment 1 to embodiment 7
Table two: the characteristic test result of embodiment 1 to embodiment 7
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, change done without departing from the spirit and scope of the present invention and retouching, all belong to scope of patent protection of the present invention.
Claims (10)
1. the tackiness agent for electrically conducting between electronic component, is characterized in that comprising:
Paracril, the mooney viscosity scope of this paracril is 50 to 75, and wherein, the test condition of mooney viscosity is ML 1+4@100 DEG C;
Acrylate oligomers;
Thermoplastic resin, and this thermoplastic resin is selected from the group be made up of phenoxy resin, polymethacrylate copolymer, polystyrene copolymer and resol;
Two kinds of organo-peroxides, these two kinds of organo-peroxides have one minute different half life temperature; And
Coupler;
Wherein, this paracril is 25 weight part to 46 weight parts, and this acrylate oligomers is 25 weight part to 45 weight parts, and this thermoplastic resin is 16 weight part to 32 weight parts.
2. tackiness agent as claimed in claim 1, is characterized in that the weight average molecular weight scope of this paracril is 20 ten thousand to 60 ten thousand.
3. tackiness agent as claimed in claim 1, is characterized in that this acryllic acid oligomer is selected from the group be made up of epoxy acrylic oligomer ester, urethane acrylate oligomer, polyester acrylic oligomer ester and acroleic acid esterification polyacrylic acid oligomer ester.
4. tackiness agent as claimed in claim 1, it is characterized in that these two kinds of organo-peroxides comprise high temperature organo-peroxide, one minute half life temperature scope of this high temperature organo-peroxide is 130 DEG C to 140 DEG C, and this high temperature organo-peroxide is benzoyl peroxide or peroxidation two (4-toluyl); And
Low temperature organic per-compounds, one minute half life temperature scope of this low temperature organic per-compounds is 110 DEG C to 120 DEG C, and this low temperature organic per-compounds is dilauroyl peroxide or bis(2，4-dichlorobenzoyl)peroxide.
5. tackiness agent as claimed in claim 1, it is characterized in that total 100 weight part relative to this paracril, this acrylate oligomers and this thermoplastic resin, these two kinds of organo-peroxides are 0.5 weight part to 5.0 weight part.
6. tackiness agent as claimed in claim 1, is characterized in that the group that this coupler is selected from phosphoric acid methacryloyl 2-ethoxyethyl acetate, vinyltriacetoxy silane, 3-glycidoxy-propyltrimethoxy silane and three (trimethoxy silicon propyl group) isocyanic ester and forms.
7. tackiness agent as claimed in claim 1, it is characterized in that total 100 weight part relative to paracril, acrylate oligomers and thermoplastic resin, this coupler is 0.5 weight part to 2.0 weight part.
8. tackiness agent as claimed in claim 1, is characterized in that the combination comprising reaction promotor, linking agent or above-mentioned materials further.
9. tackiness agent as claimed in claim 8, it is characterized in that this reaction promotor is selected from the group be made up of xylidine, Diethyl Aniline and dimethyl-p-toluidine, and relative to total 100 weight part of this paracril, this acrylate oligomers and this thermoplastic resin, this reaction promotor is 0.5 weight part to 2.0 weight part.
10. tackiness agent as claimed in claim 8, it is characterized in that this linking agent is selected from the group be made up of three (2-acrylyl oxy-ethyl) chlorinated isocyanurates, Viscoat 295 and pentaerythritol triacrylate, and relative to total 100 weight part of paracril, acrylate oligomers and thermoplastic resin, this linking agent is 1 weight part to 4 weight part.
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| CN201310240011.2A CN103360956B (en) | 2013-06-18 | 2013-06-18 | Sticking agent for electrical property conduction between electronic components |
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| CN103694924B (en) * | 2013-10-24 | 2016-09-07 | 明基材料有限公司 | A kind of methacrylate copolymer having Fourth Ring ether and anisotropic conductive |
| JP6915544B2 (en) * | 2015-11-04 | 2021-08-04 | 昭和電工マテリアルズ株式会社 | Adhesive composition and structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970673A (en) * | 2004-05-10 | 2007-05-30 | 日立化成工业株式会社 | Material for connecting circuit |
| CN101178948A (en) * | 2006-10-31 | 2008-05-14 | 第一毛织株式会社 | Anisotropic conductive film composition |
| TW201012890A (en) * | 2008-09-30 | 2010-04-01 | Sony Chem & Inf Device Corp | Acrylic dielectric adhesive |
| CN102533144A (en) * | 2010-12-29 | 2012-07-04 | 第一毛织株式会社 | Anisotropic conductive film |
| CN102640277A (en) * | 2009-11-30 | 2012-08-15 | 电气化学工业株式会社 | Adhesive sheet and electronic component |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970673A (en) * | 2004-05-10 | 2007-05-30 | 日立化成工业株式会社 | Material for connecting circuit |
| CN101178948A (en) * | 2006-10-31 | 2008-05-14 | 第一毛织株式会社 | Anisotropic conductive film composition |
| TW201012890A (en) * | 2008-09-30 | 2010-04-01 | Sony Chem & Inf Device Corp | Acrylic dielectric adhesive |
| CN102640277A (en) * | 2009-11-30 | 2012-08-15 | 电气化学工业株式会社 | Adhesive sheet and electronic component |
| CN102533144A (en) * | 2010-12-29 | 2012-07-04 | 第一毛织株式会社 | Anisotropic conductive film |
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