JP4197103B2 - ポリッシング装置 - Google Patents

ポリッシング装置 Download PDF

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Publication number
JP4197103B2
JP4197103B2 JP2002112752A JP2002112752A JP4197103B2 JP 4197103 B2 JP4197103 B2 JP 4197103B2 JP 2002112752 A JP2002112752 A JP 2002112752A JP 2002112752 A JP2002112752 A JP 2002112752A JP 4197103 B2 JP4197103 B2 JP 4197103B2
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JP
Japan
Prior art keywords
wafer
polishing
transfer
unit
top ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002112752A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003309089A (ja
Inventor
聡 若林
哲二 戸川
隆一 小菅
浩司 阿藤
宏 外崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002112752A priority Critical patent/JP4197103B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to AU2003236011A priority patent/AU2003236011A1/en
Priority to KR1020037016610A priority patent/KR100964007B1/ko
Priority to EP03746438A priority patent/EP1496543B1/en
Priority to US10/481,001 priority patent/US7850817B2/en
Priority to CNB038012200A priority patent/CN100380599C/zh
Priority to PCT/JP2003/004493 priority patent/WO2003088335A1/ja
Priority to DE60336386T priority patent/DE60336386D1/de
Priority to TW092108618A priority patent/TWI290749B/zh
Publication of JP2003309089A publication Critical patent/JP2003309089A/ja
Priority to JP2008134239A priority patent/JP4763755B2/ja
Application granted granted Critical
Publication of JP4197103B2 publication Critical patent/JP4197103B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002112752A 2002-04-15 2002-04-15 ポリッシング装置 Expired - Lifetime JP4197103B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2002112752A JP4197103B2 (ja) 2002-04-15 2002-04-15 ポリッシング装置
DE60336386T DE60336386D1 (de) 2002-04-15 2003-04-09 Poliereinrichtung
EP03746438A EP1496543B1 (en) 2002-04-15 2003-04-09 Polishing device
US10/481,001 US7850817B2 (en) 2002-04-15 2003-04-09 Polishing device and substrate processing device
CNB038012200A CN100380599C (zh) 2002-04-15 2003-04-09 抛光装置及基片处理装置
PCT/JP2003/004493 WO2003088335A1 (en) 2002-04-15 2003-04-09 Polishing device and substrate processing device
AU2003236011A AU2003236011A1 (en) 2002-04-15 2003-04-09 Polishing device and substrate processing device
KR1020037016610A KR100964007B1 (ko) 2002-04-15 2003-04-09 폴리싱장치
TW092108618A TWI290749B (en) 2002-04-15 2003-04-15 Polishing apparatus and substrate treating apparatus
JP2008134239A JP4763755B2 (ja) 2002-04-15 2008-05-22 ポリッシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002112752A JP4197103B2 (ja) 2002-04-15 2002-04-15 ポリッシング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008134239A Division JP4763755B2 (ja) 2002-04-15 2008-05-22 ポリッシング装置

Publications (2)

Publication Number Publication Date
JP2003309089A JP2003309089A (ja) 2003-10-31
JP4197103B2 true JP4197103B2 (ja) 2008-12-17

Family

ID=29243330

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002112752A Expired - Lifetime JP4197103B2 (ja) 2002-04-15 2002-04-15 ポリッシング装置
JP2008134239A Expired - Lifetime JP4763755B2 (ja) 2002-04-15 2008-05-22 ポリッシング装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008134239A Expired - Lifetime JP4763755B2 (ja) 2002-04-15 2008-05-22 ポリッシング装置

Country Status (9)

Country Link
US (1) US7850817B2 (https=)
EP (1) EP1496543B1 (https=)
JP (2) JP4197103B2 (https=)
KR (1) KR100964007B1 (https=)
CN (1) CN100380599C (https=)
AU (1) AU2003236011A1 (https=)
DE (1) DE60336386D1 (https=)
TW (1) TWI290749B (https=)
WO (1) WO2003088335A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665393B1 (ko) 2011-07-22 2016-10-12 한화테크윈 주식회사 반도체 제조 장치

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US7850817B2 (en) 2010-12-14
JP2008194823A (ja) 2008-08-28
KR100964007B1 (ko) 2010-06-15
WO2003088335A1 (en) 2003-10-23
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JP2003309089A (ja) 2003-10-31
EP1496543A4 (en) 2010-01-13
AU2003236011A1 (en) 2003-10-27
JP4763755B2 (ja) 2011-08-31
CN1565049A (zh) 2005-01-12
US20040261944A1 (en) 2004-12-30
KR20040099104A (ko) 2004-11-26
CN100380599C (zh) 2008-04-09
TWI290749B (en) 2007-12-01

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