KR100964007B1 - 폴리싱장치 - Google Patents

폴리싱장치 Download PDF

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Publication number
KR100964007B1
KR100964007B1 KR1020037016610A KR20037016610A KR100964007B1 KR 100964007 B1 KR100964007 B1 KR 100964007B1 KR 1020037016610 A KR1020037016610 A KR 1020037016610A KR 20037016610 A KR20037016610 A KR 20037016610A KR 100964007 B1 KR100964007 B1 KR 100964007B1
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KR
South Korea
Prior art keywords
polishing
wafer
conveyance
stage
top ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020037016610A
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English (en)
Korean (ko)
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KR20040099104A (ko
Inventor
와카바야시사토시
도가와데츠지
고스게류이치
아토고지
소토자키히로시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20040099104A publication Critical patent/KR20040099104A/ko
Application granted granted Critical
Publication of KR100964007B1 publication Critical patent/KR100964007B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020037016610A 2002-04-15 2003-04-09 폴리싱장치 Expired - Lifetime KR100964007B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002112752A JP4197103B2 (ja) 2002-04-15 2002-04-15 ポリッシング装置
JPJP-P-2002-00112752 2002-04-15
PCT/JP2003/004493 WO2003088335A1 (en) 2002-04-15 2003-04-09 Polishing device and substrate processing device

Publications (2)

Publication Number Publication Date
KR20040099104A KR20040099104A (ko) 2004-11-26
KR100964007B1 true KR100964007B1 (ko) 2010-06-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037016610A Expired - Lifetime KR100964007B1 (ko) 2002-04-15 2003-04-09 폴리싱장치

Country Status (9)

Country Link
US (1) US7850817B2 (https=)
EP (1) EP1496543B1 (https=)
JP (2) JP4197103B2 (https=)
KR (1) KR100964007B1 (https=)
CN (1) CN100380599C (https=)
AU (1) AU2003236011A1 (https=)
DE (1) DE60336386D1 (https=)
TW (1) TWI290749B (https=)
WO (1) WO2003088335A1 (https=)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200500171A (en) 2003-01-27 2005-01-01 In-Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20050223837A1 (en) * 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
KR100545822B1 (ko) * 2003-12-10 2006-01-24 주식회사 실트론 웨이퍼 단면 연마 방법 및 웨이퍼 크램프
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
KR100820560B1 (ko) 2004-12-03 2008-04-07 동부일렉트로닉스 주식회사 씨엠피 장비 및 그 안정화 방법
US20060154388A1 (en) 2005-01-08 2006-07-13 Richard Lewington Integrated metrology chamber for transparent substrates
US7601272B2 (en) * 2005-01-08 2009-10-13 Applied Materials, Inc. Method and apparatus for integrating metrology with etch processing
WO2006112532A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
US7674154B2 (en) * 2005-09-09 2010-03-09 Komico Technology, Inc. Apparatus and method for polishing objects using object cleaners
EP1988568A4 (en) * 2006-02-22 2011-10-26 Ebara Corp SUBSTRATE TREATMENT DEVICE, SUBSTRATE PROTECTION DEVICE, SUBSTRATE TREATMENT DEVICE AND DEVICE FOR TREATMENT WITH A CHEMICAL SOLUTION
KR101277614B1 (ko) * 2006-03-22 2013-06-21 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치 및 기판처리방법
KR100899973B1 (ko) * 2006-06-14 2009-05-28 이노플라 아엔씨 반도체 웨이퍼 연마 장치
US20080035181A1 (en) * 2006-08-09 2008-02-14 Tokyo Seimitsu Co., Ltd. Cleaning apparatus
KR100853147B1 (ko) * 2006-12-27 2008-08-20 주식회사 케이씨텍 습식세정장비의 웨이퍼 정렬장치 및 웨이퍼 정렬방법
CN101855811B (zh) 2007-06-27 2013-11-20 布鲁克斯自动化公司 具有提升能力和减少的齿槽特性的电机定子
JP5416104B2 (ja) 2007-06-27 2014-02-12 ブルックス オートメーション インコーポレイテッド セルフベアリングモータ用位置フィードバック
US8283813B2 (en) 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
KR101659931B1 (ko) 2007-06-27 2016-09-26 브룩스 오토메이션 인코퍼레이티드 다차원 위치 센서
WO2009012396A2 (en) 2007-07-17 2009-01-22 Brooks Automation, Inc. Substrate processing apparatus with motors integral to chamber walls
US10719070B2 (en) * 2007-09-25 2020-07-21 Siemens Aktiengesellschaft System and method for modeling signal flows in automation technology equipment
US8734661B2 (en) * 2007-10-15 2014-05-27 Ebara Corporation Flattening method and flattening apparatus
KR100929817B1 (ko) * 2007-10-23 2009-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 장치의 제조 방법
JP5274993B2 (ja) * 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP5260124B2 (ja) * 2008-04-10 2013-08-14 株式会社ディスコ 加工装置
JP5129002B2 (ja) * 2008-04-10 2013-01-23 株式会社ディスコ 加工装置
TWI550705B (zh) * 2008-06-04 2016-09-21 荏原製作所股份有限公司 硏磨裝置及硏磨方法
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP2010010267A (ja) * 2008-06-25 2010-01-14 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP5167010B2 (ja) * 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
JP2010275059A (ja) * 2009-05-27 2010-12-09 Taesung Engineering Corp 板ガラス用搬送方向転換装置
EP2339611B1 (en) * 2009-12-23 2015-11-11 ISMECA Semiconductor Holding SA Wafer handler comprising a vision system
JP5123329B2 (ja) * 2010-01-07 2013-01-23 株式会社岡本工作機械製作所 半導体基板の平坦化加工装置および平坦化加工方法
JP5638406B2 (ja) * 2011-01-26 2014-12-10 株式会社ディスコ 研削装置
JP5920864B2 (ja) 2011-07-22 2016-05-18 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． 半導体製造装置及び半導体製造方法
US9105760B2 (en) * 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
TWI456685B (zh) * 2012-05-02 2014-10-11 Advanced Wireless Semiconductor Company 應用於聚光型太陽能電池之蝕刻設備之晶圓傳輸裝置
JP5904875B2 (ja) 2012-05-29 2016-04-20 株式会社荏原製作所 ワークを搬送する装置のための可動範囲調整機構
CN103586772B (zh) * 2012-08-16 2016-01-06 鸿富锦精密工业（深圳）有限公司 压力检测装置
US9390903B2 (en) * 2012-09-07 2016-07-12 Axus Technology, Llc Method and apparatus for wafer backgrinding and edge trimming on one machine
JP5927129B2 (ja) * 2013-01-31 2016-05-25 株式会社荏原製作所 研磨装置
KR101884640B1 (ko) * 2013-08-23 2018-08-02 주식회사 케이씨텍 화학 기계적 연마 시스템
CN111584354B (zh) * 2014-04-18 2021-09-03 株式会社荏原制作所 蚀刻方法
CN106541329B (zh) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 集成设备
JP6539199B2 (ja) * 2015-12-18 2019-07-03 株式会社荏原製作所 基板搬送用移載機及び基板移載方法
JP2017120805A (ja) * 2015-12-28 2017-07-06 株式会社荏原製作所 ウエハ処理装置及び搬送ロボット
US10312128B2 (en) * 2015-12-31 2019-06-04 Taiwan Semiconductor Manufacturing Company Ltd. Chemical-mechanical polish (CMP) devices, tools, and methods
JP6604890B2 (ja) 2016-04-04 2019-11-13 株式会社荏原製作所 基板搬送装置および基板処理装置ならびに結露抑制方法
US10276426B2 (en) 2016-05-31 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for performing spin dry etching
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
JP6987184B2 (ja) * 2016-06-30 2021-12-22 株式会社荏原製作所 基板処理装置
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method
CN106514438A (zh) * 2016-11-11 2017-03-22 武汉新芯集成电路制造有限公司 化学机械研磨装置及其研磨方法
JP6727117B2 (ja) * 2016-12-22 2020-07-22 株式会社荏原製作所 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
CN108857858A (zh) * 2017-05-15 2018-11-23 株式会社荏原制作所 清洗基板的背面的装置和方法、背面清洗装置和基板处理装置
JP6895341B2 (ja) * 2017-08-10 2021-06-30 株式会社荏原製作所 基板処理装置
CN107671691B (zh) * 2017-10-26 2023-08-08 广东科达洁能股份有限公司 一种瓷砖抛光装置及其方法
TWI758595B (zh) 2018-03-31 2022-03-21 日商平田機工股份有限公司 腔室構造
KR102533567B1 (ko) * 2018-09-07 2023-05-17 항저우 중구이 일렉트로닉 테크놀로지 컴퍼니 리미티드 화학, 기계적 평탄화 장비와 웨이퍼 이송방법, 웨이퍼 평탄화 유닛
TWI685058B (zh) * 2018-10-22 2020-02-11 辛耘企業股份有限公司 基板處理系統
TWI717119B (zh) * 2019-06-04 2021-01-21 大陸商杭州眾硅電子科技有限公司 化學機械平坦化晶圓傳輸設備及其使用方法
JP7394821B2 (ja) * 2020-06-30 2023-12-08 株式会社荏原製作所 基板処理装置
CN111604810B (zh) * 2020-07-24 2020-11-03 杭州众硅电子科技有限公司 一种晶圆传输设备、化学机械平坦化装置及晶圆传输方法
JP7543062B2 (ja) * 2020-10-02 2024-09-02 ニデックインスツルメンツ株式会社 産業用ロボットのハンド、産業用ロボット
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12285837B2 (en) 2021-11-18 2025-04-29 SanDisk Technologies, Inc. Wafer surface chemical distribution sensing system and methods for operating the same
TWI834448B (zh) * 2021-12-31 2024-03-01 大陸商杭州眾硅電子科技有限公司 一種晶圓拋光系統及晶圓傳輸方法
KR102817440B1 (ko) * 2022-10-26 2025-06-10 세메스 주식회사 기판 이송 시스템 및 방법
CN116442099A (zh) * 2023-04-19 2023-07-18 北京中电科电子装备有限公司 一种碲锌镉晶片表面抛光设备
CN117885033B (zh) * 2023-12-26 2026-04-03 北京晶亦精微科技股份有限公司 一种取放片装置、双面加工的化学机械抛光系统及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092781A (ja) 1996-06-04 1998-04-10 Ebara Corp 基板の搬送方法及び装置
JP2000091292A (ja) * 1999-09-22 2000-03-31 Tokyo Electron Ltd 基板の洗浄装置及び洗浄方法
JP2001274121A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710493Y2 (ja) * 1991-02-05 1995-03-08 株式会社エンヤシステム ウエーハ貼付板
EP0604061A1 (en) 1992-12-24 1994-06-29 AT&T Corp. Semiconductor fabrication
US5605487A (en) 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
DE19544328B4 (de) * 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
US5830045A (en) 1995-08-21 1998-11-03 Ebara Corporation Polishing apparatus
US6221171B1 (en) * 1996-06-04 2001-04-24 Ebara Corporation Method and apparatus for conveying a workpiece
JP3437730B2 (ja) * 1996-12-09 2003-08-18 大日本スクリーン製造株式会社 基板処理装置
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
JP2882482B1 (ja) 1997-12-15 1999-04-12 株式会社東京精密 インゴットのオリフラ・ノッチ検出方法及び位置決め方法
KR100552009B1 (ko) * 1998-03-09 2006-02-20 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
JP3133032B2 (ja) 1998-10-16 2001-02-05 株式会社東京精密 ウェーハ研磨装置
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP4127926B2 (ja) * 1999-04-08 2008-07-30 株式会社荏原製作所 ポリッシング方法
JP2001038614A (ja) 1999-07-26 2001-02-13 Ebara Corp 研磨装置
US6625556B1 (en) * 2000-03-08 2003-09-23 Advanced Micro Devices, Inc. Wafer rotation randomization for process defect detection in semiconductor fabrication
JP2001274217A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US6358126B1 (en) * 2000-05-23 2002-03-19 Ebara Corporation Polishing apparatus
JP2002016028A (ja) * 2000-06-27 2002-01-18 Ebara Corp 基板処理装置
KR20010034990A (ko) * 2000-06-29 2001-05-07 박용석 반도체 및 평판디스플레이용 멀티기능을 갖춘 집적제조장치
JP3768399B2 (ja) * 2000-11-17 2006-04-19 株式会社荏原製作所 ドレッシング装置及びポリッシング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092781A (ja) 1996-06-04 1998-04-10 Ebara Corp 基板の搬送方法及び装置
JP2000091292A (ja) * 1999-09-22 2000-03-31 Tokyo Electron Ltd 基板の洗浄装置及び洗浄方法
JP2001274121A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置

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US7850817B2 (en) 2010-12-14
JP2008194823A (ja) 2008-08-28
WO2003088335A1 (en) 2003-10-23
DE60336386D1 (de) 2011-04-28
JP2003309089A (ja) 2003-10-31
EP1496543A4 (en) 2010-01-13
AU2003236011A1 (en) 2003-10-27
JP4763755B2 (ja) 2011-08-31
CN1565049A (zh) 2005-01-12
US20040261944A1 (en) 2004-12-30
KR20040099104A (ko) 2004-11-26
CN100380599C (zh) 2008-04-09
TWI290749B (en) 2007-12-01

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