JP4105160B2 - 貼り合わせ基板の基板分断システムおよび基板分断方法 - Google Patents

貼り合わせ基板の基板分断システムおよび基板分断方法 Download PDF

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Publication number
JP4105160B2
JP4105160B2 JP2004521145A JP2004521145A JP4105160B2 JP 4105160 B2 JP4105160 B2 JP 4105160B2 JP 2004521145 A JP2004521145 A JP 2004521145A JP 2004521145 A JP2004521145 A JP 2004521145A JP 4105160 B2 JP4105160 B2 JP 4105160B2
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Japan
Prior art keywords
substrate
cutting
divided
bonded
cutting device
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Expired - Lifetime
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JP2004521145A
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English (en)
Japanese (ja)
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JPWO2004007164A1 (ja
Inventor
康智 岡島
仁孝 西尾
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of JPWO2004007164A1 publication Critical patent/JPWO2004007164A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B21/00—Severing glass sheets, tubes or rods while still plastic
    • C03B21/02—Severing glass sheets, tubes or rods while still plastic by cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
JP2004521145A 2002-07-02 2003-07-02 貼り合わせ基板の基板分断システムおよび基板分断方法 Expired - Lifetime JP4105160B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002194004 2002-07-02
JP2002194004 2002-07-02
JP2002218938 2002-07-26
JP2002218938 2002-07-26
PCT/JP2003/008449 WO2004007164A1 (ja) 2002-07-02 2003-07-02 貼り合わせ基板の基板分断システムおよび基板分断方法

Publications (2)

Publication Number Publication Date
JPWO2004007164A1 JPWO2004007164A1 (ja) 2005-11-10
JP4105160B2 true JP4105160B2 (ja) 2008-06-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004521145A Expired - Lifetime JP4105160B2 (ja) 2002-07-02 2003-07-02 貼り合わせ基板の基板分断システムおよび基板分断方法

Country Status (9)

Country Link
US (1) US20050229755A1 (enExample)
EP (1) EP1541311B1 (enExample)
JP (1) JP4105160B2 (enExample)
KR (1) KR100772353B1 (enExample)
CN (1) CN1678439B (enExample)
AT (1) ATE535357T1 (enExample)
AU (1) AU2003246250A1 (enExample)
TW (1) TW200408061A (enExample)
WO (1) WO2004007164A1 (enExample)

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KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2010001160A (ja) * 2006-10-16 2010-01-07 Panasonic Corp ガラス切断方法およびその装置
JP5325388B2 (ja) * 2007-02-05 2013-10-23 株式会社日立ハイテクノロジーズ パネルホルダ装置
KR100894837B1 (ko) * 2007-10-26 2009-04-24 주식회사 에스에프에이 기판 절단시스템
CN102976599B (zh) * 2008-04-21 2015-06-24 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
KR101010310B1 (ko) * 2008-05-06 2011-01-25 세메스 주식회사 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
CN102057313B (zh) * 2008-06-17 2013-06-05 三星钻石工业股份有限公司 母板的基板加工方法
JP5185380B2 (ja) * 2008-06-18 2013-04-17 三星ダイヤモンド工業株式会社 基板加工システム
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KR102471114B1 (ko) * 2016-01-07 2022-11-28 삼성디스플레이 주식회사 기판 절단 장치 및 기판 절단 방법
KR20180069173A (ko) * 2016-12-14 2018-06-25 주식회사 탑 엔지니어링 기판 파지 유닛 및 이를 구비하는 스크라이빙 장치
JP6808525B2 (ja) * 2017-02-13 2021-01-06 株式会社ディスコ ウエーハの加工方法
KR101991267B1 (ko) * 2017-11-23 2019-06-20 주식회사 탑 엔지니어링 기판 절단 장치
JP2019102540A (ja) * 2017-11-29 2019-06-24 三星ダイヤモンド工業株式会社 基板搬出装置
JP7171305B2 (ja) * 2018-08-10 2022-11-15 株式会社ジャパンディスプレイ ガラス基板切断方法
CN109437536B (zh) * 2018-11-30 2021-01-15 武汉华星光电技术有限公司 切割裂片装置及切割裂片方法
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CN111908780A (zh) * 2019-05-10 2020-11-10 塔工程有限公司 划线装置及其控制方法
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CN111499173B (zh) * 2020-04-29 2020-12-01 深圳市弗塔信息技术有限公司 一种液晶屏尺寸更改方法及装置
CN112873393B (zh) * 2021-01-10 2022-05-13 贵港市明弘木业有限公司 一种胶合板的切割机构
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Publication number Publication date
WO2004007164A8 (ja) 2005-01-20
KR20070024742A (ko) 2007-03-02
WO2004007164A1 (ja) 2004-01-22
CN1678439A (zh) 2005-10-05
US20050229755A1 (en) 2005-10-20
EP1541311A1 (en) 2005-06-15
TW200408061A (en) 2004-05-16
KR100772353B1 (ko) 2007-11-01
EP1541311A4 (en) 2010-05-05
ATE535357T1 (de) 2011-12-15
TWI299544B (enExample) 2008-08-01
AU2003246250A1 (en) 2004-02-02
EP1541311B1 (en) 2011-11-30
CN1678439B (zh) 2012-06-13
JPWO2004007164A1 (ja) 2005-11-10

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