TW200408061A - Substrate slicing system for sealed substrates and the substrate slicing method - Google Patents

Substrate slicing system for sealed substrates and the substrate slicing method Download PDF

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Publication number
TW200408061A
TW200408061A TW92117938A TW92117938A TW200408061A TW 200408061 A TW200408061 A TW 200408061A TW 92117938 A TW92117938 A TW 92117938A TW 92117938 A TW92117938 A TW 92117938A TW 200408061 A TW200408061 A TW 200408061A
Authority
TW
Taiwan
Prior art keywords
substrate
division
divided
mother
dividing
Prior art date
Application number
TW92117938A
Other languages
English (en)
Chinese (zh)
Other versions
TWI299544B (enExample
Inventor
Yoshitaka Nishio
Yasutomo Okajima
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200408061A publication Critical patent/TW200408061A/zh
Application granted granted Critical
Publication of TWI299544B publication Critical patent/TWI299544B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B21/00—Severing glass sheets, tubes or rods while still plastic
    • C03B21/02—Severing glass sheets, tubes or rods while still plastic by cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
TW92117938A 2002-07-02 2003-07-01 Substrate slicing system for sealed substrates and the substrate slicing method TW200408061A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002194004 2002-07-02
JP2002218938 2002-07-26

Publications (2)

Publication Number Publication Date
TW200408061A true TW200408061A (en) 2004-05-16
TWI299544B TWI299544B (enExample) 2008-08-01

Family

ID=30117377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92117938A TW200408061A (en) 2002-07-02 2003-07-01 Substrate slicing system for sealed substrates and the substrate slicing method

Country Status (9)

Country Link
US (1) US20050229755A1 (enExample)
EP (1) EP1541311B1 (enExample)
JP (1) JP4105160B2 (enExample)
KR (1) KR100772353B1 (enExample)
CN (1) CN1678439B (enExample)
AT (1) ATE535357T1 (enExample)
AU (1) AU2003246250A1 (enExample)
TW (1) TW200408061A (enExample)
WO (1) WO2004007164A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497579B (zh) * 2011-05-24 2015-08-21 Mitsuboshi Diamond Ind Co Ltd Scribing device

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ITMI20040974A1 (it) * 2004-05-14 2004-08-14 Bavelloni Z Spa Apparecchiatura per il taglio di lastre di vetro stratificate con mezzi di stacco delle lastre tagliate
EP1647534B1 (de) * 2004-10-15 2018-12-19 Bystronic Maschinen AG Vorrichtung und Verfahren zum Brechen von Glasscheiben
KR100960468B1 (ko) * 2005-12-29 2010-05-28 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
JP4768483B2 (ja) * 2006-03-22 2011-09-07 東芝モバイルディスプレイ株式会社 基板装置の製造方法
KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2010001160A (ja) * 2006-10-16 2010-01-07 Panasonic Corp ガラス切断方法およびその装置
JP5325388B2 (ja) * 2007-02-05 2013-10-23 株式会社日立ハイテクノロジーズ パネルホルダ装置
KR100894837B1 (ko) * 2007-10-26 2009-04-24 주식회사 에스에프에이 기판 절단시스템
CN102976599B (zh) * 2008-04-21 2015-06-24 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
KR101010310B1 (ko) * 2008-05-06 2011-01-25 세메스 주식회사 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
CN102057313B (zh) * 2008-06-17 2013-06-05 三星钻石工业股份有限公司 母板的基板加工方法
JP5185380B2 (ja) * 2008-06-18 2013-04-17 三星ダイヤモンド工業株式会社 基板加工システム
KR100937965B1 (ko) * 2008-07-16 2010-01-21 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
KR101331813B1 (ko) * 2008-10-09 2013-11-26 엘지디스플레이 주식회사 액정표시소자의 절단장치 및 절단방법
CN101985388B (zh) * 2009-07-29 2013-03-27 北京京东方光电科技有限公司 切割对盒后的液晶玻璃基板的切割装置和切割方法
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KR101449487B1 (ko) * 2012-06-01 2014-10-14 한국미쯔보시다이아몬드공업(주) 기판 절단 장치 및 기판 절단 장치에서의 기판 반송 방법
KR102048921B1 (ko) * 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
JP5639634B2 (ja) * 2012-12-11 2014-12-10 三星ダイヤモンド工業株式会社 基板分断システム
JP2014214055A (ja) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 基板加工システムおよび基板加工方法
JP2013189020A (ja) * 2013-06-17 2013-09-26 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置
JP6213134B2 (ja) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
CN104766821A (zh) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 一种裂片装置及裂片方法
JP6251061B2 (ja) * 2014-01-29 2017-12-20 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ装置
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
JP6439313B2 (ja) * 2014-08-07 2018-12-19 三星ダイヤモンド工業株式会社 スクライブ方法およびスクライブ装置
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KR102471114B1 (ko) * 2016-01-07 2022-11-28 삼성디스플레이 주식회사 기판 절단 장치 및 기판 절단 방법
KR20180069173A (ko) * 2016-12-14 2018-06-25 주식회사 탑 엔지니어링 기판 파지 유닛 및 이를 구비하는 스크라이빙 장치
JP6808525B2 (ja) * 2017-02-13 2021-01-06 株式会社ディスコ ウエーハの加工方法
KR101991267B1 (ko) * 2017-11-23 2019-06-20 주식회사 탑 엔지니어링 기판 절단 장치
JP2019102540A (ja) * 2017-11-29 2019-06-24 三星ダイヤモンド工業株式会社 基板搬出装置
JP7171305B2 (ja) * 2018-08-10 2022-11-15 株式会社ジャパンディスプレイ ガラス基板切断方法
CN109437536B (zh) * 2018-11-30 2021-01-15 武汉华星光电技术有限公司 切割裂片装置及切割裂片方法
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CN111908780A (zh) * 2019-05-10 2020-11-10 塔工程有限公司 划线装置及其控制方法
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CN112873393B (zh) * 2021-01-10 2022-05-13 贵港市明弘木业有限公司 一种胶合板的切割机构
CN112894896B (zh) * 2021-01-21 2022-12-27 四川世茂新材料有限公司 一种保温夹芯板生产成品切割晾板系统
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497579B (zh) * 2011-05-24 2015-08-21 Mitsuboshi Diamond Ind Co Ltd Scribing device

Also Published As

Publication number Publication date
WO2004007164A8 (ja) 2005-01-20
KR20070024742A (ko) 2007-03-02
WO2004007164A1 (ja) 2004-01-22
CN1678439A (zh) 2005-10-05
US20050229755A1 (en) 2005-10-20
EP1541311A1 (en) 2005-06-15
KR100772353B1 (ko) 2007-11-01
EP1541311A4 (en) 2010-05-05
JP4105160B2 (ja) 2008-06-25
ATE535357T1 (de) 2011-12-15
TWI299544B (enExample) 2008-08-01
AU2003246250A1 (en) 2004-02-02
EP1541311B1 (en) 2011-11-30
CN1678439B (zh) 2012-06-13
JPWO2004007164A1 (ja) 2005-11-10

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