ATE535357T1 - System zum schneiden von geklebten grundplatten und grundplattenschneidverfahren - Google Patents
System zum schneiden von geklebten grundplatten und grundplattenschneidverfahrenInfo
- Publication number
- ATE535357T1 ATE535357T1 AT03738652T AT03738652T ATE535357T1 AT E535357 T1 ATE535357 T1 AT E535357T1 AT 03738652 T AT03738652 T AT 03738652T AT 03738652 T AT03738652 T AT 03738652T AT E535357 T1 ATE535357 T1 AT E535357T1
- Authority
- AT
- Austria
- Prior art keywords
- cutting
- substrate
- cutting device
- base
- roller
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B21/00—Severing glass sheets, tubes or rods while still plastic
- C03B21/02—Severing glass sheets, tubes or rods while still plastic by cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9372—Rotatable type
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002194004 | 2002-07-02 | ||
JP2002218938 | 2002-07-26 | ||
PCT/JP2003/008449 WO2004007164A1 (ja) | 2002-07-02 | 2003-07-02 | 貼り合わせ基板の基板分断システムおよび基板分断方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE535357T1 true ATE535357T1 (de) | 2011-12-15 |
Family
ID=30117377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03738652T ATE535357T1 (de) | 2002-07-02 | 2003-07-02 | System zum schneiden von geklebten grundplatten und grundplattenschneidverfahren |
Country Status (9)
Country | Link |
---|---|
US (1) | US20050229755A1 (de) |
EP (1) | EP1541311B1 (de) |
JP (1) | JP4105160B2 (de) |
KR (1) | KR100772353B1 (de) |
CN (1) | CN1678439B (de) |
AT (1) | ATE535357T1 (de) |
AU (1) | AU2003246250A1 (de) |
TW (1) | TW200408061A (de) |
WO (1) | WO2004007164A1 (de) |
Families Citing this family (57)
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---|---|---|---|---|
ITMI20040974A1 (it) * | 2004-05-14 | 2004-08-14 | Bavelloni Z Spa | Apparecchiatura per il taglio di lastre di vetro stratificate con mezzi di stacco delle lastre tagliate |
EP1647534B1 (de) * | 2004-10-15 | 2018-12-19 | Bystronic Maschinen AG | Vorrichtung und Verfahren zum Brechen von Glasscheiben |
KR100960468B1 (ko) * | 2005-12-29 | 2010-05-28 | 엘지디스플레이 주식회사 | 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법 |
JP4768483B2 (ja) * | 2006-03-22 | 2011-09-07 | 東芝モバイルディスプレイ株式会社 | 基板装置の製造方法 |
KR20070103188A (ko) * | 2006-04-18 | 2007-10-23 | 주식회사 탑 엔지니어링 | 기판 스크라이브 장치 |
JPWO2007142264A1 (ja) * | 2006-06-08 | 2009-10-29 | 東レエンジニアリング株式会社 | 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板 |
JP4251203B2 (ja) * | 2006-08-29 | 2009-04-08 | セイコーエプソン株式会社 | 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法 |
JP2010001160A (ja) * | 2006-10-16 | 2010-01-07 | Panasonic Corp | ガラス切断方法およびその装置 |
JP5325388B2 (ja) * | 2007-02-05 | 2013-10-23 | 株式会社日立ハイテクノロジーズ | パネルホルダ装置 |
KR100894837B1 (ko) * | 2007-10-26 | 2009-04-24 | 주식회사 에스에프에이 | 기판 절단시스템 |
CN101565270A (zh) * | 2008-04-21 | 2009-10-28 | 塔工程有限公司 | 对结合基板进行台阶式划线的方法及其控制系统 |
KR101010310B1 (ko) * | 2008-05-06 | 2011-01-25 | 세메스 주식회사 | 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법 |
US20110107894A1 (en) * | 2008-05-30 | 2011-05-12 | Mitsuboshi Diamond Industrial Co., Ltd | Brittle Material Substrate Chamfering Method |
KR101175105B1 (ko) | 2008-06-17 | 2012-08-21 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 마더 기판의 기판 가공 방법 |
JP5185380B2 (ja) * | 2008-06-18 | 2013-04-17 | 三星ダイヤモンド工業株式会社 | 基板加工システム |
KR100937965B1 (ko) * | 2008-07-16 | 2010-01-21 | 삼성모바일디스플레이주식회사 | 평판 디스플레이 패널 절단 장치 |
KR101331813B1 (ko) * | 2008-10-09 | 2013-11-26 | 엘지디스플레이 주식회사 | 액정표시소자의 절단장치 및 절단방법 |
CN101985388B (zh) * | 2009-07-29 | 2013-03-27 | 北京京东方光电科技有限公司 | 切割对盒后的液晶玻璃基板的切割装置和切割方法 |
JP5448791B2 (ja) * | 2009-12-24 | 2014-03-19 | 三菱重工業株式会社 | 接合方法および接合装置制御装置 |
ITTO20110370A1 (it) * | 2011-04-28 | 2012-10-29 | Biesse Spa | Macchina e procedimento per il taglio di una lastra di vetro stratificato |
JP5348430B2 (ja) * | 2011-05-24 | 2013-11-20 | 三星ダイヤモンド工業株式会社 | スクライブ装置 |
CN102390923A (zh) * | 2011-08-05 | 2012-03-28 | 深圳市华星光电技术有限公司 | 面板基板切割方法及基板切割装置 |
CN102515493B (zh) * | 2011-11-28 | 2014-05-21 | 深圳市华星光电技术有限公司 | 液晶面板的切割装置及切割方法 |
US9067327B2 (en) | 2011-11-30 | 2015-06-30 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Cutting device and cutting method of a liquid crystal panel |
JP5826652B2 (ja) * | 2012-01-31 | 2015-12-02 | 三星ダイヤモンド工業株式会社 | ホルダユニット及びスクライブ装置 |
KR101449487B1 (ko) * | 2012-06-01 | 2014-10-14 | 한국미쯔보시다이아몬드공업(주) | 기판 절단 장치 및 기판 절단 장치에서의 기판 반송 방법 |
KR102048921B1 (ko) | 2012-06-20 | 2019-11-27 | 삼성디스플레이 주식회사 | 셀 절단 장치 및 셀 절단 방법 |
JP5639634B2 (ja) * | 2012-12-11 | 2014-12-10 | 三星ダイヤモンド工業株式会社 | 基板分断システム |
JP2014214055A (ja) * | 2013-04-25 | 2014-11-17 | 三星ダイヤモンド工業株式会社 | 基板加工システムおよび基板加工方法 |
JP2013189020A (ja) * | 2013-06-17 | 2013-09-26 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ装置 |
JP6213134B2 (ja) * | 2013-10-16 | 2017-10-18 | 三星ダイヤモンド工業株式会社 | 弾性支持板、破断装置及び分断方法 |
JP6243699B2 (ja) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
CN104766821A (zh) * | 2014-01-02 | 2015-07-08 | 大族激光科技产业集团股份有限公司 | 一种裂片装置及裂片方法 |
JP6251061B2 (ja) * | 2014-01-29 | 2017-12-20 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ装置 |
CN103896483B (zh) * | 2014-03-27 | 2016-08-17 | 深圳市华星光电技术有限公司 | 一种玻璃基板切割设备及切割方法 |
JP6439313B2 (ja) * | 2014-08-07 | 2018-12-19 | 三星ダイヤモンド工業株式会社 | スクライブ方法およびスクライブ装置 |
CN104386906B (zh) * | 2014-09-26 | 2017-10-10 | 南京中电熊猫平板显示科技有限公司 | 基板裂片装置和方法 |
JP6384264B2 (ja) * | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | スクライブ方法およびスクライブ装置 |
JP6384265B2 (ja) * | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | スクライブ方法およびスクライブ装置 |
EP3042882A1 (de) * | 2015-01-12 | 2016-07-13 | Bystronic Maschinen AG | Bearbeitungstisch und verfahren zum bearbeiten von glasscheiben |
JP6524803B2 (ja) * | 2015-06-02 | 2019-06-05 | 三星ダイヤモンド工業株式会社 | ブレイクシステム |
BR112017015962A2 (pt) * | 2015-06-10 | 2018-03-20 | Bando Kiko Co., Ltd. | método para recortar placa de vidro e posicionar placa de vidro recortada e aparelho do mesmo |
CN105523380B (zh) * | 2015-12-29 | 2018-05-08 | 芜湖东旭光电科技有限公司 | 玻璃基板自动推板装置 |
KR102471114B1 (ko) * | 2016-01-07 | 2022-11-28 | 삼성디스플레이 주식회사 | 기판 절단 장치 및 기판 절단 방법 |
KR20180069173A (ko) * | 2016-12-14 | 2018-06-25 | 주식회사 탑 엔지니어링 | 기판 파지 유닛 및 이를 구비하는 스크라이빙 장치 |
JP6808525B2 (ja) * | 2017-02-13 | 2021-01-06 | 株式会社ディスコ | ウエーハの加工方法 |
KR101991267B1 (ko) * | 2017-11-23 | 2019-06-20 | 주식회사 탑 엔지니어링 | 기판 절단 장치 |
JP2019102540A (ja) * | 2017-11-29 | 2019-06-24 | 三星ダイヤモンド工業株式会社 | 基板搬出装置 |
JP7171305B2 (ja) * | 2018-08-10 | 2022-11-15 | 株式会社ジャパンディスプレイ | ガラス基板切断方法 |
CN109437536B (zh) * | 2018-11-30 | 2021-01-15 | 武汉华星光电技术有限公司 | 切割裂片装置及切割裂片方法 |
CN109760144B (zh) * | 2019-01-31 | 2023-07-04 | 东莞市九思自动化科技有限公司 | 一种折板机构及具有该折板机构的自动化分板机 |
CN111908780A (zh) * | 2019-05-10 | 2020-11-10 | 塔工程有限公司 | 划线装置及其控制方法 |
KR102267730B1 (ko) * | 2019-05-14 | 2021-06-23 | 주식회사 탑 엔지니어링 | 스크라이브 장치의 제어 방법 |
CN111499173B (zh) * | 2020-04-29 | 2020-12-01 | 深圳市弗塔信息技术有限公司 | 一种液晶屏尺寸更改方法及装置 |
CN112873393B (zh) * | 2021-01-10 | 2022-05-13 | 贵港市明弘木业有限公司 | 一种胶合板的切割机构 |
CN112894896B (zh) * | 2021-01-21 | 2022-12-27 | 四川世茂新材料有限公司 | 一种保温夹芯板生产成品切割晾板系统 |
JP2022115544A (ja) * | 2021-01-28 | 2022-08-09 | 日本電気硝子株式会社 | ガラスフィルムの製造方法 |
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US2609049A (en) * | 1947-11-08 | 1952-09-02 | Western Electric Co | Method of and apparatus for slitting articles |
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GB1323097A (en) * | 1970-07-10 | 1973-07-11 | Pilkington Brothers Ltd | Apparatus for scoring sheet material |
US4210052A (en) * | 1977-05-09 | 1980-07-01 | Libbey-Owens-Ford Company | Scoring mechanism |
US4213550A (en) * | 1978-10-06 | 1980-07-22 | Ppg Industries, Inc. | Method of and apparatus for initiating a damage-free score in a refractory material |
AT403688B (de) * | 1992-11-02 | 1998-04-27 | Lisec Peter | Verfahren und vorrichtung zum schneiden von verbundglas |
US5458025A (en) * | 1994-03-17 | 1995-10-17 | The Gillette Company | Razor blade manufacture |
KR0110679Y1 (en) * | 1994-08-23 | 1997-12-02 | Samsung Electronics Co Ltd | Break roll having a groove which is using during cell cutting process of liquid crystal display apparatus |
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JPH09107013A (ja) * | 1995-10-09 | 1997-04-22 | Dainippon Screen Mfg Co Ltd | 基板受け渡し装置 |
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JPH11116260A (ja) * | 1997-10-08 | 1999-04-27 | Mitsuboshi Diamond Kogyo Kk | ガラス加工装置 |
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US6408527B1 (en) * | 1998-08-11 | 2002-06-25 | Tapco International Corporation | Scoring tool |
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KR100542321B1 (ko) * | 1998-10-27 | 2006-04-17 | 현대엘씨디주식회사 | 스크라이브 라인 음각 장치 |
DE69918114T2 (de) * | 1999-01-11 | 2005-07-07 | Beldex Corp. | Ritzwerkzeug |
JP2001261357A (ja) * | 2000-03-21 | 2001-09-26 | Asahi Glass Co Ltd | ガラス板の加工方法及びその装置 |
CN1486285B (zh) * | 2001-01-17 | 2013-01-16 | 三星宝石工业株式会社 | 划线分断设备及其系统 |
KR100789454B1 (ko) * | 2002-02-09 | 2007-12-31 | 엘지.필립스 엘시디 주식회사 | 액정 패널의 절단 장치 및 그 방법 |
KR100789455B1 (ko) * | 2002-02-20 | 2007-12-31 | 엘지.필립스 엘시디 주식회사 | 액정 패널의 절단 방법 |
JP2003313036A (ja) * | 2002-04-17 | 2003-11-06 | Sharp Corp | ガラス分断方法とその装置 |
-
2003
- 2003-07-01 TW TW92117938A patent/TW200408061A/zh not_active IP Right Cessation
- 2003-07-02 KR KR1020077003391A patent/KR100772353B1/ko not_active IP Right Cessation
- 2003-07-02 JP JP2004521145A patent/JP4105160B2/ja not_active Expired - Lifetime
- 2003-07-02 US US10/519,754 patent/US20050229755A1/en not_active Abandoned
- 2003-07-02 EP EP20030738652 patent/EP1541311B1/de not_active Expired - Lifetime
- 2003-07-02 AT AT03738652T patent/ATE535357T1/de active
- 2003-07-02 WO PCT/JP2003/008449 patent/WO2004007164A1/ja active Application Filing
- 2003-07-02 CN CN038208237A patent/CN1678439B/zh not_active Expired - Fee Related
- 2003-07-02 AU AU2003246250A patent/AU2003246250A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004007164A1 (ja) | 2004-01-22 |
CN1678439B (zh) | 2012-06-13 |
US20050229755A1 (en) | 2005-10-20 |
EP1541311A4 (de) | 2010-05-05 |
TWI299544B (de) | 2008-08-01 |
JP4105160B2 (ja) | 2008-06-25 |
AU2003246250A1 (en) | 2004-02-02 |
WO2004007164A8 (ja) | 2005-01-20 |
TW200408061A (en) | 2004-05-16 |
CN1678439A (zh) | 2005-10-05 |
EP1541311B1 (de) | 2011-11-30 |
EP1541311A1 (de) | 2005-06-15 |
JPWO2004007164A1 (ja) | 2005-11-10 |
KR20070024742A (ko) | 2007-03-02 |
KR100772353B1 (ko) | 2007-11-01 |
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