KR100772353B1 - 접합기판의 기판절단 시스템 및 기판절단방법 - Google Patents

접합기판의 기판절단 시스템 및 기판절단방법 Download PDF

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Publication number
KR100772353B1
KR100772353B1 KR1020077003391A KR20077003391A KR100772353B1 KR 100772353 B1 KR100772353 B1 KR 100772353B1 KR 1020077003391 A KR1020077003391 A KR 1020077003391A KR 20077003391 A KR20077003391 A KR 20077003391A KR 100772353 B1 KR100772353 B1 KR 100772353B1
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South Korea
Prior art keywords
substrate
cutting
mother
cutting device
bonded substrate
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Expired - Fee Related
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KR1020077003391A
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English (en)
Korean (ko)
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KR20070024742A (ko
Inventor
야스토모 오카지마
요시타카 니시오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20070024742A publication Critical patent/KR20070024742A/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B21/00—Severing glass sheets, tubes or rods while still plastic
    • C03B21/02—Severing glass sheets, tubes or rods while still plastic by cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
KR1020077003391A 2002-07-02 2003-07-02 접합기판의 기판절단 시스템 및 기판절단방법 Expired - Fee Related KR100772353B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002194004 2002-07-02
JPJP-P-2002-00194004 2002-07-02
JP2002218938 2002-07-26
JPJP-P-2002-00218938 2002-07-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7021561A Division KR20050019815A (ko) 2002-07-02 2003-07-02 접합기판의 기판절단 시스템 및 기판절단방법

Publications (2)

Publication Number Publication Date
KR20070024742A KR20070024742A (ko) 2007-03-02
KR100772353B1 true KR100772353B1 (ko) 2007-11-01

Family

ID=30117377

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077003391A Expired - Fee Related KR100772353B1 (ko) 2002-07-02 2003-07-02 접합기판의 기판절단 시스템 및 기판절단방법

Country Status (9)

Country Link
US (1) US20050229755A1 (enExample)
EP (1) EP1541311B1 (enExample)
JP (1) JP4105160B2 (enExample)
KR (1) KR100772353B1 (enExample)
CN (1) CN1678439B (enExample)
AT (1) ATE535357T1 (enExample)
AU (1) AU2003246250A1 (enExample)
TW (1) TW200408061A (enExample)
WO (1) WO2004007164A1 (enExample)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20040974A1 (it) * 2004-05-14 2004-08-14 Bavelloni Z Spa Apparecchiatura per il taglio di lastre di vetro stratificate con mezzi di stacco delle lastre tagliate
EP1647534B1 (de) * 2004-10-15 2018-12-19 Bystronic Maschinen AG Vorrichtung und Verfahren zum Brechen von Glasscheiben
KR100960468B1 (ko) * 2005-12-29 2010-05-28 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
JP4768483B2 (ja) * 2006-03-22 2011-09-07 東芝モバイルディスプレイ株式会社 基板装置の製造方法
KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2010001160A (ja) * 2006-10-16 2010-01-07 Panasonic Corp ガラス切断方法およびその装置
JP5325388B2 (ja) * 2007-02-05 2013-10-23 株式会社日立ハイテクノロジーズ パネルホルダ装置
KR100894837B1 (ko) * 2007-10-26 2009-04-24 주식회사 에스에프에이 기판 절단시스템
CN102976599B (zh) * 2008-04-21 2015-06-24 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
KR101010310B1 (ko) * 2008-05-06 2011-01-25 세메스 주식회사 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법
CN102046346B (zh) * 2008-05-30 2014-04-09 三星钻石工业股份有限公司 脆性材料基板的倒角方法
CN102057313B (zh) * 2008-06-17 2013-06-05 三星钻石工业股份有限公司 母板的基板加工方法
JP5185380B2 (ja) * 2008-06-18 2013-04-17 三星ダイヤモンド工業株式会社 基板加工システム
KR100937965B1 (ko) * 2008-07-16 2010-01-21 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
KR101331813B1 (ko) * 2008-10-09 2013-11-26 엘지디스플레이 주식회사 액정표시소자의 절단장치 및 절단방법
CN101985388B (zh) * 2009-07-29 2013-03-27 北京京东方光电科技有限公司 切割对盒后的液晶玻璃基板的切割装置和切割方法
JP5448791B2 (ja) * 2009-12-24 2014-03-19 三菱重工業株式会社 接合方法および接合装置制御装置
ITTO20110370A1 (it) * 2011-04-28 2012-10-29 Biesse Spa Macchina e procedimento per il taglio di una lastra di vetro stratificato
JP5348430B2 (ja) * 2011-05-24 2013-11-20 三星ダイヤモンド工業株式会社 スクライブ装置
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
CN102515493B (zh) * 2011-11-28 2014-05-21 深圳市华星光电技术有限公司 液晶面板的切割装置及切割方法
US9067327B2 (en) 2011-11-30 2015-06-30 Shenzhen China Star Optoelectronics Technology Co., Ltd. Cutting device and cutting method of a liquid crystal panel
JP5826652B2 (ja) * 2012-01-31 2015-12-02 三星ダイヤモンド工業株式会社 ホルダユニット及びスクライブ装置
KR101449487B1 (ko) * 2012-06-01 2014-10-14 한국미쯔보시다이아몬드공업(주) 기판 절단 장치 및 기판 절단 장치에서의 기판 반송 방법
KR102048921B1 (ko) * 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
JP5639634B2 (ja) * 2012-12-11 2014-12-10 三星ダイヤモンド工業株式会社 基板分断システム
JP2014214055A (ja) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 基板加工システムおよび基板加工方法
JP2013189020A (ja) * 2013-06-17 2013-09-26 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置
JP6213134B2 (ja) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 弾性支持板、破断装置及び分断方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
CN104766821A (zh) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 一种裂片装置及裂片方法
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EP3042882A1 (de) * 2015-01-12 2016-07-13 Bystronic Maschinen AG Bearbeitungstisch und verfahren zum bearbeiten von glasscheiben
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CN105523380B (zh) * 2015-12-29 2018-05-08 芜湖东旭光电科技有限公司 玻璃基板自动推板装置
KR102471114B1 (ko) * 2016-01-07 2022-11-28 삼성디스플레이 주식회사 기판 절단 장치 및 기판 절단 방법
KR20180069173A (ko) * 2016-12-14 2018-06-25 주식회사 탑 엔지니어링 기판 파지 유닛 및 이를 구비하는 스크라이빙 장치
JP6808525B2 (ja) * 2017-02-13 2021-01-06 株式会社ディスコ ウエーハの加工方法
KR101991267B1 (ko) * 2017-11-23 2019-06-20 주식회사 탑 엔지니어링 기판 절단 장치
JP2019102540A (ja) * 2017-11-29 2019-06-24 三星ダイヤモンド工業株式会社 基板搬出装置
JP7171305B2 (ja) * 2018-08-10 2022-11-15 株式会社ジャパンディスプレイ ガラス基板切断方法
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JP2022115544A (ja) * 2021-01-28 2022-08-09 日本電気硝子株式会社 ガラスフィルムの製造方法
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09278473A (ja) * 1996-04-15 1997-10-28 Beldex:Kk ガラスのスクライブ方法および装置
KR0110679Y1 (en) * 1994-08-23 1997-12-02 Samsung Electronics Co Ltd Break roll having a groove which is using during cell cutting process of liquid crystal display apparatus
KR0117664Y1 (ko) * 1995-03-20 1998-05-15 김주용 액정표시소자절단장치
JPH10338534A (ja) * 1997-06-03 1998-12-22 Toshiba Corp スクライブ装置、ブレーク装置、ガラス切断装置およびスクライブ方法
JPH11116260A (ja) * 1997-10-08 1999-04-27 Mitsuboshi Diamond Kogyo Kk ガラス加工装置
KR100245452B1 (ko) * 1995-10-09 2000-02-15 이시다 아키라 기판 이송장치 및 방법
KR20000023191A (ko) * 1998-09-16 2000-04-25 야마나까 마모루 판유리 모재의 절단 방법 및 그 장치
KR20000027155A (ko) * 1998-10-27 2000-05-15 김영환 스크라이브 라인 음각 장치
JP2001261357A (ja) * 2000-03-21 2001-09-26 Asahi Glass Co Ltd ガラス板の加工方法及びその装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609049A (en) * 1947-11-08 1952-09-02 Western Electric Co Method of and apparatus for slitting articles
US3424357A (en) * 1966-07-28 1969-01-28 Ppg Industries Inc Automatically sizing and severing glass sheets
GB1323097A (en) * 1970-07-10 1973-07-11 Pilkington Brothers Ltd Apparatus for scoring sheet material
US4210052A (en) * 1977-05-09 1980-07-01 Libbey-Owens-Ford Company Scoring mechanism
US4213550A (en) * 1978-10-06 1980-07-22 Ppg Industries, Inc. Method of and apparatus for initiating a damage-free score in a refractory material
AT403688B (de) * 1992-11-02 1998-04-27 Lisec Peter Verfahren und vorrichtung zum schneiden von verbundglas
US5458025A (en) * 1994-03-17 1995-10-17 The Gillette Company Razor blade manufacture
JP3834099B2 (ja) 1996-04-05 2006-10-18 中村留精密工業株式会社 液晶ガラス板の切断装置
JPH10209086A (ja) 1997-01-28 1998-08-07 Matsushita Electric Ind Co Ltd 板状ワークの割断方法およびその装置
IT1299944B1 (it) * 1998-03-31 2000-04-04 Giben Impianti Spa Dispositivo per il taglio di pannelli.
US6408527B1 (en) * 1998-08-11 2002-06-25 Tapco International Corporation Scoring tool
WO2000041863A1 (fr) * 1999-01-11 2000-07-20 Beldex Corporation Dispositif de decoupe
WO2002057192A1 (en) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separator and separating system
KR100789454B1 (ko) * 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR100789455B1 (ko) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0110679Y1 (en) * 1994-08-23 1997-12-02 Samsung Electronics Co Ltd Break roll having a groove which is using during cell cutting process of liquid crystal display apparatus
KR0117664Y1 (ko) * 1995-03-20 1998-05-15 김주용 액정표시소자절단장치
KR100245452B1 (ko) * 1995-10-09 2000-02-15 이시다 아키라 기판 이송장치 및 방법
JPH09278473A (ja) * 1996-04-15 1997-10-28 Beldex:Kk ガラスのスクライブ方法および装置
JPH10338534A (ja) * 1997-06-03 1998-12-22 Toshiba Corp スクライブ装置、ブレーク装置、ガラス切断装置およびスクライブ方法
JPH11116260A (ja) * 1997-10-08 1999-04-27 Mitsuboshi Diamond Kogyo Kk ガラス加工装置
KR20000023191A (ko) * 1998-09-16 2000-04-25 야마나까 마모루 판유리 모재의 절단 방법 및 그 장치
KR20000027155A (ko) * 1998-10-27 2000-05-15 김영환 스크라이브 라인 음각 장치
JP2001261357A (ja) * 2000-03-21 2001-09-26 Asahi Glass Co Ltd ガラス板の加工方法及びその装置

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US20050229755A1 (en) 2005-10-20
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EP1541311A4 (en) 2010-05-05
JP4105160B2 (ja) 2008-06-25
ATE535357T1 (de) 2011-12-15
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