JP3727069B2 - 錫被覆電気コネクタ - Google Patents
錫被覆電気コネクタ Download PDFInfo
- Publication number
- JP3727069B2 JP3727069B2 JP52290197A JP52290197A JP3727069B2 JP 3727069 B2 JP3727069 B2 JP 3727069B2 JP 52290197 A JP52290197 A JP 52290197A JP 52290197 A JP52290197 A JP 52290197A JP 3727069 B2 JP3727069 B2 JP 3727069B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tin
- barrier layer
- substrate
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 80
- 239000010410 layer Substances 0.000 claims description 135
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 107
- 230000004888 barrier function Effects 0.000 claims description 98
- 239000011135 tin Substances 0.000 claims description 82
- 229910052718 tin Inorganic materials 0.000 claims description 79
- 239000010949 copper Substances 0.000 claims description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 67
- 229910052802 copper Inorganic materials 0.000 claims description 65
- 229910052759 nickel Inorganic materials 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 45
- 229910000765 intermetallic Inorganic materials 0.000 claims description 43
- 229910045601 alloy Inorganic materials 0.000 claims description 27
- 239000000956 alloy Substances 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 20
- 239000011247 coating layer Substances 0.000 claims description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 238000004070 electrodeposition Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 16
- 238000000576 coating method Methods 0.000 description 12
- 230000032683 aging Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000151 deposition Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007670 refining Methods 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229960000999 sodium citrate dihydrate Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57368695A | 1995-12-18 | 1995-12-18 | |
| US08/573,686 | 1995-12-18 | ||
| US08/657,211 | 1996-06-03 | ||
| US08/657,211 US5780172A (en) | 1995-12-18 | 1996-06-03 | Tin coated electrical connector |
| US08/769,912 US5916695A (en) | 1995-12-18 | 1996-12-09 | Tin coated electrical connector |
| US08/769,912 | 1996-12-09 | ||
| PCT/US1996/019768 WO1997022472A1 (en) | 1995-12-18 | 1996-12-10 | Tin coated electrical connector |
| CA002240239A CA2240239C (en) | 1995-12-18 | 1998-06-10 | Tin coated electrical connector |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005143106A Division JP4427487B2 (ja) | 1995-12-18 | 2005-05-16 | 錫被覆電気コネクタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001526734A JP2001526734A (ja) | 2001-12-18 |
| JP2001526734A5 JP2001526734A5 (enExample) | 2004-11-04 |
| JP3727069B2 true JP3727069B2 (ja) | 2005-12-14 |
Family
ID=31499384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52290197A Expired - Lifetime JP3727069B2 (ja) | 1995-12-18 | 1996-12-10 | 錫被覆電気コネクタ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5916695A (enExample) |
| EP (2) | EP0869867B1 (enExample) |
| JP (1) | JP3727069B2 (enExample) |
| CA (1) | CA2240239C (enExample) |
| DE (1) | DE69622192T2 (enExample) |
| WO (1) | WO1997022472A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6861159B2 (en) | 1992-03-27 | 2005-03-01 | The Louis Berkman Company | Corrosion-resistant coated copper and method for making the same |
| US6652990B2 (en) | 1992-03-27 | 2003-11-25 | The Louis Berkman Company | Corrosion-resistant coated metal and method for making the same |
| US6080497A (en) * | 1992-03-27 | 2000-06-27 | The Louis Berkman Company | Corrosion-resistant coated copper metal and method for making the same |
| US6794060B2 (en) | 1992-03-27 | 2004-09-21 | The Louis Berkman Company | Corrosion-resistant coated metal and method for making the same |
| KR100232506B1 (ko) * | 1995-06-27 | 1999-12-01 | 포만 제프리 엘. | 전기적 접속을 제공하는 배선 구조 및 도체와 그 도체형성방법 |
| JPH10134869A (ja) * | 1996-10-30 | 1998-05-22 | Yazaki Corp | 端子材料および端子 |
| JP3286560B2 (ja) * | 1997-04-28 | 2002-05-27 | 株式会社オートネットワーク技術研究所 | 嵌合型接続端子 |
| DE19751841A1 (de) * | 1997-11-22 | 1999-05-27 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder daraus |
| JP4489232B2 (ja) * | 1999-06-14 | 2010-06-23 | 日鉱金属株式会社 | コネクタ用めっき材料 |
| US6274254B1 (en) * | 1999-08-23 | 2001-08-14 | Lucent Technologies Inc. | Electrodeposited precious metal finishes having wear resistant particles therein |
| JP4459360B2 (ja) * | 2000-02-08 | 2010-04-28 | マスプロ電工株式会社 | 回路基板およびその製造方法 |
| JP3621365B2 (ja) * | 2000-09-18 | 2005-02-16 | 第一電子工業株式会社 | 電気コネクタ |
| EP1202390B1 (en) * | 2000-10-25 | 2008-05-21 | Japan Aviation Electronics Industry, Limited | An electronic component and a method of manufacturing the same |
| US6368167B1 (en) * | 2000-12-22 | 2002-04-09 | Hon Hai Precision Ind. Co., Ltd. | Method of making an electrical connector |
| EP1352993B1 (en) * | 2001-01-19 | 2011-05-11 | The Furukawa Electric Co., Ltd. | A method for preparation of metal-plated material |
| US20050037229A1 (en) * | 2001-01-19 | 2005-02-17 | Hitoshi Tanaka | Plated material, method of producing same, and electrical / electronic part using same |
| JP2002226982A (ja) * | 2001-01-31 | 2002-08-14 | Dowa Mining Co Ltd | 耐熱性皮膜、その製造方法および電気電子部品 |
| US6759142B2 (en) | 2001-07-31 | 2004-07-06 | Kobe Steel Ltd. | Plated copper alloy material and process for production thereof |
| US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
| DE10146274A1 (de) * | 2001-09-19 | 2003-04-10 | Bosch Gmbh Robert | Metallische Oberfläche eines Körpers, Verfahren zur Herstellung einer strukturierten metallischen Oberfläche eines Körpers und dessen Verwendung |
| DE10251507A1 (de) * | 2001-11-13 | 2003-06-05 | Yazaki Corp | Anschlußklemme |
| DE10208618A1 (de) * | 2002-02-27 | 2003-09-04 | Bosch Gmbh Robert | Digitale Verzögerungsleitung |
| AU2003222669A1 (en) * | 2002-04-22 | 2003-11-03 | Yazaki Corporation | Electrical connectors incorporating low friction coatings and methods for making them |
| DE10224693A1 (de) * | 2002-06-04 | 2003-12-18 | Bosch Gmbh Robert | Verbundwerkstoff zur Herstellung einer elektrischen Kontaktfläche sowie Verfahren zur Erzeugung einer gleitfähigen und korrosionsarmen elektrischen Kontaktoberfläche |
| DE10245343A1 (de) * | 2002-09-27 | 2004-04-08 | Robert Bosch Gmbh | Elektrischer Kontakt |
| DE10326788B4 (de) * | 2003-06-13 | 2005-05-25 | Robert Bosch Gmbh | Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung |
| DE10346206A1 (de) * | 2003-10-06 | 2005-04-28 | Bosch Gmbh Robert | Kontaktoberflächen für elektrische Kontakte |
| US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
| ATE461037T1 (de) * | 2003-11-28 | 2010-04-15 | Wieland Werke Ag | Schichtenfolge zur herstellung eines verbundmaterials für elektromechanische bauelemente |
| JP4739734B2 (ja) * | 2003-11-28 | 2011-08-03 | ヴィーラント ウェルケ アクチーエン ゲゼルシャフト | 電子機械的構成要素用の複合材を製造するための連続層、その複合材及び使用方法 |
| JP4302545B2 (ja) * | 2004-02-10 | 2009-07-29 | 株式会社オートネットワーク技術研究所 | プレスフィット端子 |
| US20050268991A1 (en) * | 2004-06-03 | 2005-12-08 | Enthone Inc. | Corrosion resistance enhancement of tin surfaces |
| JP4813785B2 (ja) * | 2004-09-29 | 2011-11-09 | Dowaメタルテック株式会社 | 錫めっき材 |
| WO2006059578A1 (ja) * | 2004-12-03 | 2006-06-08 | Murata Manufacturing Co., Ltd. | 電気接点部品、同軸コネクタおよびそれらを用いた電気回路装置 |
| JP2006161127A (ja) * | 2004-12-09 | 2006-06-22 | Takamatsu Mekki:Kk | 嵌合型接続端子に適した電子材料とその製造方法 |
| JP4749746B2 (ja) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | 錫めっき材およびその製造方法 |
| JP4855032B2 (ja) * | 2005-09-29 | 2012-01-18 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
| JP4817095B2 (ja) * | 2005-10-03 | 2011-11-16 | 上村工業株式会社 | ウィスカ抑制表面処理方法 |
| JP4934456B2 (ja) * | 2006-02-20 | 2012-05-16 | 古河電気工業株式会社 | めっき材料および前記めっき材料が用いられた電気電子部品 |
| US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
| DE102007047007A1 (de) * | 2007-10-01 | 2009-04-09 | Tyco Electronics Amp Gmbh | Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben |
| JP2009097053A (ja) * | 2007-10-19 | 2009-05-07 | Hitachi Ltd | 金属条、コネクタ、および金属条の製造方法 |
| US20090145764A1 (en) * | 2007-12-11 | 2009-06-11 | Enthone Inc. | Composite coatings for whisker reduction |
| US8226807B2 (en) * | 2007-12-11 | 2012-07-24 | Enthone Inc. | Composite coatings for whisker reduction |
| WO2009157456A1 (ja) * | 2008-06-24 | 2009-12-30 | 古河電気工業株式会社 | 電気電子部品用複合材料およびそれを用いた電気電子部品 |
| JP5079605B2 (ja) * | 2008-06-30 | 2012-11-21 | 株式会社オートネットワーク技術研究所 | 圧着端子及び端子付電線並びにこれらの製造方法 |
| JP2010126801A (ja) * | 2008-12-01 | 2010-06-10 | Hitachi Cable Ltd | 錫被覆アルミニウム材料 |
| JP5621570B2 (ja) * | 2010-03-30 | 2014-11-12 | 三菱マテリアル株式会社 | Snめっき付き導電材及びその製造方法 |
| WO2011132797A1 (ja) * | 2010-04-23 | 2011-10-27 | Jfeスチール株式会社 | 固体高分子形燃料電池セパレータ用金属板 |
| JP2013033656A (ja) * | 2011-08-02 | 2013-02-14 | Yazaki Corp | 端子 |
| JP2013037791A (ja) * | 2011-08-04 | 2013-02-21 | Sumitomo Wiring Syst Ltd | 回路基板と端子金具の接続構造 |
| US9260789B2 (en) * | 2012-05-14 | 2016-02-16 | United Technologies Corporation | Underpotential depositon of metal monolayers from ionic liquids |
| FR2993579B1 (fr) * | 2012-07-20 | 2015-09-25 | Tyco Electronics France Sas | Procede de revetement et revetement pour contact a insertion a force |
| US20150333424A1 (en) * | 2012-12-20 | 2015-11-19 | 3M Innovative Properties Company | Electrical connectors and methods of making same |
| EP2799595A1 (de) * | 2013-05-03 | 2014-11-05 | Delphi Technologies, Inc. | Elektrisches Kontaktelement |
| US20150093923A1 (en) * | 2013-09-27 | 2015-04-02 | Lotes Co., Ltd | Terminal |
| JP2015149218A (ja) * | 2014-02-07 | 2015-08-20 | 矢崎総業株式会社 | 固定接点 |
| KR102408021B1 (ko) * | 2014-11-11 | 2022-06-13 | 삼성디스플레이 주식회사 | 금속배선 및 이를 포함하는 표시 장치 |
| JP6543138B2 (ja) * | 2015-08-28 | 2019-07-10 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
| DE102016102319A1 (de) * | 2016-02-10 | 2017-08-10 | Harting Ag & Co. Kg | Verfahren zur Beschichtung eines Kontaktelements mit einer Kupfer-Nickel-Legierung |
| JP6750545B2 (ja) * | 2016-05-19 | 2020-09-02 | 株式会社オートネットワーク技術研究所 | プレスフィット端子接続構造 |
| JP7309469B2 (ja) * | 2019-06-12 | 2023-07-18 | 新光電気工業株式会社 | リードピン及びリードピン付き配線基板 |
| JP7352851B2 (ja) * | 2019-08-05 | 2023-09-29 | 株式会社オートネットワーク技術研究所 | 電気接点材料、端子金具、コネクタ、及びワイヤーハーネス |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
| US3247082A (en) * | 1962-08-07 | 1966-04-19 | Harshaw Chem Corp | Electrodeposition of a corrosion resistant coating |
| US3635702A (en) * | 1968-07-01 | 1972-01-18 | Int Nickel Co | Copper-nickel alloys of high-yield strength |
| US3892637A (en) * | 1969-03-10 | 1975-07-01 | Polti Jean Loup | Method of treatment of metal surfaces |
| US3833481A (en) * | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
| US3954420A (en) * | 1975-06-24 | 1976-05-04 | Whyco Chromium Co., Inc. | Non-ferrous corrosion resistant undercoating |
| US4131517A (en) * | 1977-06-03 | 1978-12-26 | Nippon Mining Co., Ltd. | Surface treating process for copper foil for use in printed circuit |
| US4311768A (en) * | 1977-12-22 | 1982-01-19 | Gould Inc. | Printed circuit board having mutually etchable copper and nickel layers |
| US4190474A (en) * | 1977-12-22 | 1980-02-26 | Gould Inc. | Method of making a printed circuit board having mutually etchable copper and nickel layers |
| US4167459A (en) * | 1979-01-08 | 1979-09-11 | The United States Of America As Represented By The Secretary Of The Interior | Electroplating with Ni-Cu alloy |
| DE2940772C2 (de) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
| DE3027304C2 (de) * | 1980-07-18 | 1982-09-30 | Sds-Elektro Gmbh, 8024 Deisenhofen | Elektrischer Mehrlagenkontakt |
| US4394419A (en) * | 1981-06-12 | 1983-07-19 | Oak Industries Inc. | Printed circuit material |
| US4411961A (en) * | 1981-09-28 | 1983-10-25 | Occidental Chemical Corporation | Composite electroplated article and process |
| JPS5976453A (ja) * | 1982-10-19 | 1984-05-01 | Mitsubishi Metal Corp | 半導体装置のリ−ド材用Cu合金クラツド材 |
| US4498121A (en) * | 1983-01-13 | 1985-02-05 | Olin Corporation | Copper alloys for suppressing growth of Cu-Al intermetallic compounds |
| US4441118A (en) * | 1983-01-13 | 1984-04-03 | Olin Corporation | Composite copper nickel alloys with improved solderability shelf life |
| GB2134136B (en) * | 1983-01-19 | 1986-03-26 | Shell Int Research | An electronic conduit and a method of manufacturing it |
| US5001546A (en) * | 1983-07-27 | 1991-03-19 | Olin Corporation | Clad metal lead frame substrates |
| US4736236A (en) * | 1984-03-08 | 1988-04-05 | Olin Corporation | Tape bonding material and structure for electronic circuit fabrication |
| JPH0612796B2 (ja) * | 1984-06-04 | 1994-02-16 | 株式会社日立製作所 | 半導体装置 |
| JPS62112787A (ja) * | 1985-11-13 | 1987-05-23 | Toyota Central Res & Dev Lab Inc | 金属積層体 |
| US4882236A (en) * | 1988-02-10 | 1989-11-21 | Olin Corporation | Rigid magnetic recording disks and method of producing same |
| US5268235A (en) * | 1988-09-26 | 1993-12-07 | The United States Of America As Represented By The Secretary Of Commerce | Predetermined concentration graded alloys |
| US5158653A (en) * | 1988-09-26 | 1992-10-27 | Lashmore David S | Method for production of predetermined concentration graded alloys |
| JPH02285091A (ja) * | 1989-04-26 | 1990-11-22 | Kobe Steel Ltd | ニッケル―銅合金めっき浴 |
| US5019222A (en) * | 1989-05-02 | 1991-05-28 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
| JPH0818401B2 (ja) * | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | 複合箔とその製法 |
| US5021300A (en) * | 1989-09-05 | 1991-06-04 | Raytheon Company | Solder back contact |
| US5028492A (en) * | 1990-03-13 | 1991-07-02 | Olin Corporation | Composite coating for electrical connectors |
| TW208110B (enExample) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
| EP0468787A3 (en) * | 1990-07-27 | 1993-08-04 | Shinko Electric Industries Co. Ltd. | Tape automated bonding in semiconductor technique |
| JPH05183017A (ja) * | 1991-12-26 | 1993-07-23 | Hitachi Cable Ltd | Tab用テープキャリア |
-
1996
- 1996-12-09 US US08/769,912 patent/US5916695A/en not_active Expired - Lifetime
- 1996-12-10 EP EP96944322A patent/EP0869867B1/en not_active Expired - Lifetime
- 1996-12-10 WO PCT/US1996/019768 patent/WO1997022472A1/en not_active Ceased
- 1996-12-10 DE DE69622192T patent/DE69622192T2/de not_active Expired - Lifetime
- 1996-12-10 JP JP52290197A patent/JP3727069B2/ja not_active Expired - Lifetime
- 1996-12-10 EP EP01129444A patent/EP1203654A3/en not_active Withdrawn
-
1998
- 1998-06-10 CA CA002240239A patent/CA2240239C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0869867A4 (en) | 1998-12-09 |
| EP0869867B1 (en) | 2002-07-03 |
| EP0869867A1 (en) | 1998-10-14 |
| US5916695A (en) | 1999-06-29 |
| JP2001526734A (ja) | 2001-12-18 |
| DE69622192D1 (de) | 2002-08-08 |
| CA2240239C (en) | 2009-12-01 |
| CA2240239A1 (en) | 1999-12-10 |
| EP1203654A2 (en) | 2002-05-08 |
| EP1203654A3 (en) | 2006-03-08 |
| DE69622192T2 (de) | 2003-02-27 |
| WO1997022472A1 (en) | 1997-06-26 |
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