FR2993579B1 - Procede de revetement et revetement pour contact a insertion a force - Google Patents

Procede de revetement et revetement pour contact a insertion a force

Info

Publication number
FR2993579B1
FR2993579B1 FR1257093A FR1257093A FR2993579B1 FR 2993579 B1 FR2993579 B1 FR 2993579B1 FR 1257093 A FR1257093 A FR 1257093A FR 1257093 A FR1257093 A FR 1257093A FR 2993579 B1 FR2993579 B1 FR 2993579B1
Authority
FR
France
Prior art keywords
coating
force
insert contact
coating process
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1257093A
Other languages
English (en)
Other versions
FR2993579A1 (fr
Inventor
Alain Bednarek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyco Electronics France SAS
Original Assignee
Tyco Electronics France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics France SAS filed Critical Tyco Electronics France SAS
Priority to FR1257093A priority Critical patent/FR2993579B1/fr
Priority to JP2015522112A priority patent/JP6174698B2/ja
Priority to PCT/EP2013/065286 priority patent/WO2014013055A1/fr
Priority to EP13739690.9A priority patent/EP2875170B1/fr
Priority to CN201380037563.1A priority patent/CN104471112B/zh
Publication of FR2993579A1 publication Critical patent/FR2993579A1/fr
Priority to US14/600,584 priority patent/US10348017B2/en
Application granted granted Critical
Publication of FR2993579B1 publication Critical patent/FR2993579B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/343—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y10T428/12792—Zn-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
FR1257093A 2012-07-20 2012-07-20 Procede de revetement et revetement pour contact a insertion a force Expired - Fee Related FR2993579B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1257093A FR2993579B1 (fr) 2012-07-20 2012-07-20 Procede de revetement et revetement pour contact a insertion a force
JP2015522112A JP6174698B2 (ja) 2012-07-20 2013-07-19 プレスフィットコンタクトのためのコーティング方法およびコーティング
PCT/EP2013/065286 WO2014013055A1 (fr) 2012-07-20 2013-07-19 Procédé de revêtement et revêtement pour contact ajusté par pression
EP13739690.9A EP2875170B1 (fr) 2012-07-20 2013-07-19 Procédé de revêtement pour contact ajusté par pression
CN201380037563.1A CN104471112B (zh) 2012-07-20 2013-07-19 涂覆处理和用于压配合触头的涂层
US14/600,584 US10348017B2 (en) 2012-07-20 2015-01-20 Coating process and coating for press-fit contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1257093A FR2993579B1 (fr) 2012-07-20 2012-07-20 Procede de revetement et revetement pour contact a insertion a force

Publications (2)

Publication Number Publication Date
FR2993579A1 FR2993579A1 (fr) 2014-01-24
FR2993579B1 true FR2993579B1 (fr) 2015-09-25

Family

ID=47191894

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1257093A Expired - Fee Related FR2993579B1 (fr) 2012-07-20 2012-07-20 Procede de revetement et revetement pour contact a insertion a force

Country Status (6)

Country Link
US (1) US10348017B2 (fr)
EP (1) EP2875170B1 (fr)
JP (1) JP6174698B2 (fr)
CN (1) CN104471112B (fr)
FR (1) FR2993579B1 (fr)
WO (1) WO2014013055A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014117410B4 (de) * 2014-11-27 2019-01-03 Heraeus Deutschland GmbH & Co. KG Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
US11183779B2 (en) * 2017-07-12 2021-11-23 ept Holding GmbH & Co. KG Press-in pin and method for producing same
DE102018203800B4 (de) * 2018-03-13 2019-11-21 Te Connectivity Germany Gmbh Kontaktstift und Anordnung zur Verbindung von elektrischen Leitern aus Kupfer und Aluminium
US11296436B2 (en) * 2019-06-10 2022-04-05 Rohm And Haas Electronic Materials Llc Press-fit terminal with improved whisker inhibition
JP7352851B2 (ja) * 2019-08-05 2023-09-29 株式会社オートネットワーク技術研究所 電気接点材料、端子金具、コネクタ、及びワイヤーハーネス

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6183886B1 (en) * 1998-04-03 2001-02-06 Olin Corporation Tin coatings incorporating selected elemental additions to reduce discoloration
US6596621B1 (en) * 2002-05-17 2003-07-22 International Business Machines Corporation Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate
JP4111522B2 (ja) * 2004-11-30 2008-07-02 日鉱金属株式会社 Ｓｎ被覆銅系材料及び端子
CN101203627B (zh) 2005-06-17 2010-09-08 富士通株式会社 形成有以锡作为主成分的被膜的构件、被膜形成方法以及锡焊处理方法
JP4919481B2 (ja) * 2006-08-25 2012-04-18 日本圧着端子製造株式会社 プレスフィット端子及びこれを有するコネクタ
DE102007047007A1 (de) 2007-10-01 2009-04-09 Tyco Electronics Amp Gmbh Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
JP4632380B2 (ja) * 2009-06-04 2011-02-16 協和電線株式会社 めっき被膜接続端子部材、これを用いた接続端子、これに用いられるめっき被膜材及び多層めっき材料、並びにめっき被膜接続端子部材の製造方法
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010040469B3 (de) 2010-09-09 2012-01-12 Federal-Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitelemente, Verfahren zu dessen Herstellung und Verwendung
DE102010042526A1 (de) * 2010-10-15 2012-04-19 Continental Automotive Gmbh Kontaktelement
EP2538761B1 (fr) * 2011-06-20 2014-01-29 STMicroelectronics Srl Module d'alimentation intelligente et procédé d'assemblage associé

Also Published As

Publication number Publication date
CN104471112A (zh) 2015-03-25
EP2875170B1 (fr) 2018-10-31
JP2015525833A (ja) 2015-09-07
WO2014013055A1 (fr) 2014-01-23
CN104471112B (zh) 2017-03-29
US10348017B2 (en) 2019-07-09
JP6174698B2 (ja) 2017-08-02
EP2875170A1 (fr) 2015-05-27
FR2993579A1 (fr) 2014-01-24
US20150136456A1 (en) 2015-05-21

Similar Documents

Publication Publication Date Title
EP2867189A4 (fr) Procédé de production d'acrylate
SG11201405930WA (en) Method for manufacturing a set of embossing rollers
EP2880482A4 (fr) Contact opto-électronique et procédé associé
EP2897596A4 (fr) Procédé de revêtement de substrats pharmaceutiques
EP2724251A4 (fr) Procédés permettant à des applications web ajax d'être mises en signets et d'être parcourues, et dispositifs associés
BR112014000311A2 (pt) aparelho de fabricação de artigo de folha
EP2813300A4 (fr) Dispositif de production de boîte
HK1185051A1 (en) Non-contact transfer apparatus
SG11201503318PA (en) Method for microcontact embossing
FR2965491B1 (fr) Procede de revetement et machine de revetement correspondante
FR2996558B1 (fr) Composition et procede de polissage mecano-chimique
FR3000603B1 (fr) Procede de gravure anisotrope
PL2633914T5 (pl) Urządzenie do pipetowania i sposób jego wytwarzania
SG11201501742TA (en) Polymers for contact lenses
FR2993579B1 (fr) Procede de revetement et revetement pour contact a insertion a force
EP2819496A4 (fr) Méthode de détermination de plan de production et dispositif de détermination
BR112014000308A2 (pt) aparelho de fabricação de artigo de folha
FR2998290B1 (fr) Procede de potabilisation
EP2889892A4 (fr) Dispositif de contact
PT2722143T (pt) Processo para fabrico de uma folha inorgânica
BR112014000307A2 (pt) aparelho de fabricação de artigo de folha
FR2995231B1 (fr) Procede de trefilage
EP2894659A4 (fr) Procédé de fabrication d'un dispositif
BR112014018038A2 (pt) processo para fabricação de cateteres urinários
ZA201501312B (en) A transfer apparatus

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

ST Notification of lapse

Effective date: 20240305