JP4427487B2 - 錫被覆電気コネクタ - Google Patents
錫被覆電気コネクタ Download PDFInfo
- Publication number
- JP4427487B2 JP4427487B2 JP2005143106A JP2005143106A JP4427487B2 JP 4427487 B2 JP4427487 B2 JP 4427487B2 JP 2005143106 A JP2005143106 A JP 2005143106A JP 2005143106 A JP2005143106 A JP 2005143106A JP 4427487 B2 JP4427487 B2 JP 4427487B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tin
- barrier layer
- alloy
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Description
本発明のバリヤ層の利点は次の実施例から更に明らかになるであろう。
Cu−20%Ni
Fe
Ni
Cu
の群から選ばれた特定のバリヤ層の30マイクロインチ(0.75μ)によって被覆された銅合金C194クーポン、及びバリヤ層無しの銅合金C194及びC710(6.5%IACSの公称電気伝導率もつ、重量で80%の銅と20%のニッケルの公称組成) の対照クーポンを、電着によって40マイクロインチ(1μ)の艶消錫で被覆した。
銅合金C194クーポンを1μ(40マイクロインチ)の銅−30重量%ニッケル合金のバリヤ層で被覆し、それから1.25μ(50マイクロインチ)の艶消錫で被覆した。艶消錫は後で再フローされた。バリヤ層及び艶消錫はどちらも電解的に付着させられた。バリヤ層の銅とニッケルは同時付着された。
対照は後で再フローされた艶消錫によって電解的に被覆された銅合金C194クーポンであった。対照はバリヤ層を欠いていた。
図8は銅合金C194基質/銅−30%ニッケル/錫のプレートシステムにおいて基質/バリヤ層が熱的又は機械的加工を受けない場合に発現する銅/錫の金属間化合物を例証する2000Xの倍率の顕微鏡写真である。金属間化合物は残留錫を選択的に化学的に除去することによって裸出された。金属間化合物は急速に成長するスフェロイド(spheroid)からなる。
Claims (3)
- 銅又は銅ベース合金の基質(12);
前記基質(12)の部分を覆う錫又は錫ベース合金からなる被覆層(14);及び
前記基質(12)と前記被覆層(14)の間に介在するバリヤ(16)にして、少なくとも第一、第三及び異なる第二の金属又は金属合金成分層(26、28、30)から形成された合金である前記バリヤ(16)であって、前記第二成分層(28)が主として銅であり且つ前記被覆層(14)と接触しており、前記第三成分層がニッケルであり、しかして0.2μ〜5μの厚さを有する前記バリヤ(16);
を特徴とする複合材料(10)。 - ニッケル又はニッケル合金である前記第三合金成分層(30)が前記第二合金成分層(28)に隣接しており且つ前記第二合金成分層(28)と前記第一合金層(26)の間に配置されていること、及び銅又は銅合金である第四合金成分層(32)が前記第三合金成分層(30)に隣接して配置され且つ前記第三合金成分層(30)と前記第一合金層(26)の間に配置されていることを特徴とする、請求項1の複合材料(10)。
- 銀、珪素、アルミニウム、亜鉛、鉄、クロム、マンガン、コバルト、バナジウム、インジウム及びそれらの合金からなる群から選ばれた別の金属または合金成分層(34)が前記第二合金成分層(28)に隣接しており且つ前記第二合金成分層(28)と前記被覆層(14)の間に配置されていることを特徴とする、請求項1の複合材料(10)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57368695A | 1995-12-18 | 1995-12-18 | |
US08/657,211 US5780172A (en) | 1995-12-18 | 1996-06-03 | Tin coated electrical connector |
US08/769,912 US5916695A (en) | 1995-12-18 | 1996-12-09 | Tin coated electrical connector |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52290197A Division JP3727069B2 (ja) | 1995-12-18 | 1996-12-10 | 錫被覆電気コネクタ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008329137A Division JP5155139B2 (ja) | 1995-12-18 | 2008-12-25 | 錫被覆電気コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005251762A JP2005251762A (ja) | 2005-09-15 |
JP4427487B2 true JP4427487B2 (ja) | 2010-03-10 |
Family
ID=35031996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005143106A Expired - Lifetime JP4427487B2 (ja) | 1995-12-18 | 2005-05-16 | 錫被覆電気コネクタ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4427487B2 (ja) |
KR (1) | KR100467896B1 (ja) |
HK (1) | HK1042869A1 (ja) |
MY (1) | MY112350A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100361760B1 (ko) * | 2000-12-26 | 2002-11-22 | 주식회사 포스코 | 레들용 슬래그 검출장치의 암,수콘넥터 |
JP5325734B2 (ja) * | 2009-08-18 | 2013-10-23 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
JP5956240B2 (ja) * | 2012-05-01 | 2016-07-27 | Dowaメタルテック株式会社 | めっき材およびその製造方法 |
WO2013172155A1 (ja) * | 2012-05-17 | 2013-11-21 | 株式会社村田製作所 | 金属皮膜およびこの金属皮膜を備えた電子部品 |
JP5874827B2 (ja) * | 2012-06-19 | 2016-03-02 | 株式会社村田製作所 | 接合用部材 |
KR20190136470A (ko) | 2018-05-31 | 2019-12-10 | 한국생산기술연구원 | 접합용 프리폼 제조방법 및 이를 이용한 반도체 칩 접합방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2940772C2 (de) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
JPS61166994A (ja) * | 1985-01-16 | 1986-07-28 | Kobe Steel Ltd | 光沢錫めつき層或いは光沢錫合金めつき層を有する銅または銅合金線条体 |
JPS63249361A (ja) * | 1987-04-06 | 1988-10-17 | Nippon Mining Co Ltd | 半導体リ−ドフレ−ム |
JP2833026B2 (ja) * | 1989-07-05 | 1998-12-09 | 上村工業株式会社 | 無電解錫めっき方法 |
JPH04165096A (ja) * | 1990-10-26 | 1992-06-10 | Kyowa Densen Kk | 電子部品用リード線 |
JPH05183017A (ja) * | 1991-12-26 | 1993-07-23 | Hitachi Cable Ltd | Tab用テープキャリア |
-
1996
- 1996-12-10 KR KR10-1998-0704602A patent/KR100467896B1/ko not_active IP Right Cessation
- 1996-12-17 MY MYPI96005297A patent/MY112350A/en unknown
-
2002
- 2002-06-22 HK HK02104661.8A patent/HK1042869A1/zh unknown
-
2005
- 2005-05-16 JP JP2005143106A patent/JP4427487B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
MY112350A (en) | 2001-05-31 |
HK1042869A1 (zh) | 2002-08-30 |
JP2005251762A (ja) | 2005-09-15 |
KR20000064451A (ko) | 2000-11-06 |
KR100467896B1 (ko) | 2005-05-13 |
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