MY112350A - Tin coated electrical connector - Google Patents

Tin coated electrical connector

Info

Publication number
MY112350A
MY112350A MYPI96005297A MYPI19965297A MY112350A MY 112350 A MY112350 A MY 112350A MY PI96005297 A MYPI96005297 A MY PI96005297A MY PI19965297 A MYPI19965297 A MY PI19965297A MY 112350 A MY112350 A MY 112350A
Authority
MY
Malaysia
Prior art keywords
copper
coating layer
layer
tin
electrical connector
Prior art date
Application number
MYPI96005297A
Inventor
C Fister Julius
A Khan Abid
L Bender Dale
Chen Szuchain
Original Assignee
Gbc Metals Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/657,211 external-priority patent/US5780172A/en
Priority claimed from US08/769,912 external-priority patent/US5916695A/en
Application filed by Gbc Metals Llc filed Critical Gbc Metals Llc
Publication of MY112350A publication Critical patent/MY112350A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

AN ELECTRICAL CONDUCTOR (10) HAS A COPPER BASE SUBSTRATE (12) COATED WITH A TIN BASE COATING LAYER (14). TO INHIBIT THE DIFFUSION OF COPPER FROM THE SUBSTRATE (12) INTO THE COATING LAYER (14) AND THE CONSEQUENTIAL FORMATION OF A BRITTLE TIN/COPPER INTERMETALLIC, A BARRIER LAYER (16) IS INTERPOSED BETWEEN THE SUBSTRATE (12) AND THE COATING LAYER (14). THIS BARRIER LAYER (16) CONTAINS FROM 20TO 40, BY WEIGHT, OF NICKEL AND IS PREFERABLY PREDO~INANTLY COMPRISED OF COPPER. IN ONE EMBODIMENT, AN INTERMETALLIC LAYER (38) SELECTED FROM THE GROUP (CU-NI))SN, (CU-NI)6SNS, CU)SN, CU6SNS IS DISPOSED BETWEEN THE BARRIER LAYER (16) AND THE TIN BASE COATING LAYER (14).(FIG. 1)
MYPI96005297A 1995-12-18 1996-12-17 Tin coated electrical connector MY112350A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57368695A 1995-12-18 1995-12-18
US08/657,211 US5780172A (en) 1995-12-18 1996-06-03 Tin coated electrical connector
US08/769,912 US5916695A (en) 1995-12-18 1996-12-09 Tin coated electrical connector

Publications (1)

Publication Number Publication Date
MY112350A true MY112350A (en) 2001-05-31

Family

ID=35031996

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96005297A MY112350A (en) 1995-12-18 1996-12-17 Tin coated electrical connector

Country Status (4)

Country Link
JP (1) JP4427487B2 (en)
KR (1) KR100467896B1 (en)
HK (1) HK1042869A1 (en)
MY (1) MY112350A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361760B1 (en) * 2000-12-26 2002-11-22 주식회사 포스코 Female.male connector of slag detector for ladle
JP5325734B2 (en) * 2009-08-18 2013-10-23 三菱伸銅株式会社 Conductive member and manufacturing method thereof
JP5956240B2 (en) * 2012-05-01 2016-07-27 Ｄｏｗａメタルテック株式会社 Plating material and method for producing the same
WO2013172155A1 (en) * 2012-05-17 2013-11-21 株式会社村田製作所 Metal coating film and electronic component provided with metal coating film
JP5874827B2 (en) * 2012-06-19 2016-03-02 株式会社村田製作所 Joining material
KR20190136470A (en) 2018-05-31 2019-12-10 한국생산기술연구원 Method of manufacturing preform for bonding and method of joining semiconductor chip using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2940772C2 (en) * 1979-10-08 1982-09-09 W.C. Heraeus Gmbh, 6450 Hanau Low-voltage electrical contact
JPS61166994A (en) * 1985-01-16 1986-07-28 Kobe Steel Ltd Copper or copper alloy wire or rod having bright tin plating or bright tin alloy plating layer
JPS63249361A (en) * 1987-04-06 1988-10-17 Nippon Mining Co Ltd Semiconductor lead frame
JP2833026B2 (en) * 1989-07-05 1998-12-09 上村工業株式会社 Electroless tin plating method
JPH04165096A (en) * 1990-10-26 1992-06-10 Kyowa Densen Kk Lead wire for electronic parts
JPH05183017A (en) * 1991-12-26 1993-07-23 Hitachi Cable Ltd Tab tape carrier

Also Published As

Publication number Publication date
HK1042869A1 (en) 2002-08-30
JP4427487B2 (en) 2010-03-10
JP2005251762A (en) 2005-09-15
KR20000064451A (en) 2000-11-06
KR100467896B1 (en) 2005-05-13

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