JP2001526734A - 錫被覆電気コネクタ - Google Patents
錫被覆電気コネクタInfo
- Publication number
- JP2001526734A JP2001526734A JP52290197A JP52290197A JP2001526734A JP 2001526734 A JP2001526734 A JP 2001526734A JP 52290197 A JP52290197 A JP 52290197A JP 52290197 A JP52290197 A JP 52290197A JP 2001526734 A JP2001526734 A JP 2001526734A
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- JP
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- Prior art keywords
- layer
- copper
- alloy
- tin
- substrate
- Prior art date
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- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 銅又は銅ベース合金の基質(12); 前記基質(12)の部分を覆う錫又は錫ベース合金からなる被覆層(14); 及び 前記基質(12)と前記被覆層(14)の間に介在する電着バリヤ層(16) であって、主に銅であり且つ重量で25%〜40%のニッケルを含有し、そして 0.2〜2.5μの厚さを有する前記バリヤ層(16); を特徴とする複合材料(10)。 2. 前記バリヤ層(16)がさらに、錫、コバルト、鉄及びそれらの混合物 からなる群から選ばれた少なくとも一つの元素を含有することを特徴とする、請 求項1の複合材料(10)。 3. 前記基質(12)と前記バリヤ層(16)の間に金属フラッシュが配置 されており、前記金属フラッシュが0.05μ〜1.25μの厚さを有する、こ とを特徴とする、請求項1又は2の複合材料(10)。 4. 前記金属フラッシュが銅及びニッケルからなる群から選ばれることを特 徴とする、請求項3の複合材料(10)。 5. 前記被覆層(14)が炭化珪素、酸化アルミニウム、炭化タングステン 、二硫化モリブデン、シリカ、カーボンブラック、グラファイト及びポリテトラ フルオロエチレンからなる群から選ばれた微粒子を包含することを特徴とする、 請求項1、2、3又は4のいずれか一項の複合材料(10)。 6. 銅又は銅ベース合金の基質(12); 前記基質(12)の部分を覆う錫又は錫ベース合金からなる被覆層(14); 前記基質(12)と前記被覆層(14)の間に介在する電着バリヤ層(16) であって、主に銅であり且つ重量で10%〜40%のニッケルを含有し、そして 0.2〜5μの厚さを有する前記バリヤ層(16);及び 前記被覆層(14)の中に分散された銅‐錫金属間化合物(38)であって、 偏平化したオベリスク形状を有する前記金属間化合物; を特徴とする複合材料(10)。 7. 前記金属間化合物(38)が5/1より大きい長さ/幅のアスペクト比 を有することを特徴とする、請求項6の複合材料(10)。 8. 自動車のソケットの形になった請求項1又は6の複合材料(10)。 9. 自動車のプラグの形になった請求項1又は6の複合材料(10)。 10. a)銅又は銅合金の基質(12)を提供し; b)前記基質(12)を0.2〜5μのバリヤ層(16)によって被覆し、そ れによって複合中間体を形成し; c)前記複合中間体を300℃〜500℃の温度に30分〜120分の間加熱 し;そして d)前記複合中間体を錫又は錫ベース合金(14)によって被覆する; 諸工程を特徴とする、複合材料(10)の製造方法。 11. 工程(c)の後で、しかし工程(d)の前に、前記複合中間体が機械 的に厚さを減少させられることを特徴とする、請求項10の方法。 12. 前記複合中間体の厚さの減少が約10%〜約20%であることを特徴 とする、請求項11の方法。 13. a)銅又は銅合金の基質(12)を第一成分の第一層(26)によっ て被覆し; b)前記第一層(26)を第二成分の第二層(29)によって被覆し、それに よってバリヤ層(26)を形成し、前記バリヤ層(26)が重量で10%〜50 %のニッケルを含有し;そして c)前記バリヤ層(26)を錫(14)によって被覆する; 諸工程を特徴とする、電気コンダクタの製造方法。 14. 工程(a)と(b)が工程(c)に先立って繰り返されることを特徴 とする、請求項13の方法。 15. 工程(b)の後で、しかし工程(c)に先立って、工程(d)として 、第一成分が第二成分の中に拡散されることを特徴とする、請求項13又は14 の方法。 16. 工程(c)に先立つ工程(e)として、前記第二層(16)が第三成 分の第三層(30)によって被覆されることを特徴とする、請求項13又は14 の方法。 17. 前記第一、第二又は第三の成分の一つがニッケルであることを選択さ れ、一つが銅であることを選択され、そして一つが錫であることを選択されるこ とを特徴とする、請求項16の方法。 18. 工程(d)の後で且つ工程(c)の前に前記バリヤ層(16)の上に 、(Cu−Ni)3Sn、(Cu−Ni)6Sn5、Cu3Sn、Cu6Sn5及びそ れらの混合物からなる群から選ばれた金属間化合物層(38)が付着させられる ことを特徴とする、請求項15の方法。 19. 工程(c)の前に前記バリヤ層(16)の上に、(Cu−Ni)3S n、(Cu−Ni)6Sn5、Cu3Sn、Cu6Sn5及びそれらの混合物からな る群から選ばれた金属間化合物層(38)が付着させられることを特徴とする、 請求項13の方法。 20. 銅又は銅ベース合金の基質(12); 前記基質(12)の部分を覆う錫又は錫ベース合金からなる被覆層(14); 及び 前記基質と前記被覆層の間に介在するバリヤ層(16)にして、少なくとも第 一及び異なる第二の金属又は金属合金成分層(26、28)から形成された合金 である前記バリヤ層であって、前記第二の合金成分層(28)が主として銅であ り且つ前記被覆層(14)と直接接触しており、しかして0.2μ〜5μの厚さ を有する前記バリヤ層(16); を特徴とする複合材料(10)。 21. 前記第一合金成分層(26)がニッケル、コバルト、ニッケルベース 合金及びコバルトベース合金からなる群から選ばれ且つ前記基質(12)に隣接 していることを特徴とする、請求項20の複合材料(10)。 22. 銅又は銅ベース合金の基質(12); 前記基質(12)の部分を覆う錫又は錫ベース合金からなる被覆層(14); 及び 前記基質と前記被覆層の間に介在するバリヤ層(16)にして、少なくとも第 一、第三及び異なる第二の金属又は金属合金成分層(26、28、30)から形 成された合金である前記バリヤ層(16)であって、前記第二の合金成分層(2 8)が主として銅であり且つ前記被覆層(14)と直接接触しており、しかして 0.2μ〜5μの厚さを有する前記バリヤ層(16); を特徴とする複合材料(10)。 23. ニッケル又はニッケル合金である前記第三合金成分層(30)が前記 第二合金成分層(28)に隣接しており且つ前記第二合金成分層(28)と前記 第一合金層(26)の間に配置されていること、及び銅又は銅合金である第四合 金成分層(32)が前記第三合金成分層(30)に隣接して配置され且つ前記第 三合金成分層(30)と前記第一合金層(26)の間に配置されていることを特 徴とする、請求項22の複合材料(10)。 24. 銀、珪素、アルミニウム、亜鉛、鉄、クロム、マンガン、コバルト、 バナジウム、インジウム及びそれらの合金からなる群から選ばれた別の合金成分 層(32)が前記第三合金成分層(30)に隣接しており且つ前記第三合金成分 層(30)と前記被覆層(16)の間に配置されていることを特徴とする、請求 項23の複合材料。 25. 前記第一の金属又は合金成分層(26)が前記基質に直接接触してお り、そして前記第二の金属又は合金成分層(28)が前記第一の金属又は合金成 分層(26)及び前記被覆(16)の両方に直接接触していることを特徴とする 、請求項20の複合材料。 26. 前記第一の金属又は合金成分層(26)が前記基質(12)に直接接 触しており、前記第二合金成分層(28)が前記第一合金成分層(26)及び前 記第三合金成分層(30)の両方に直接接触しており、そして前記第四合金成分 層(32)が前記第三の金属又は合金成分層(30)及び前記被覆層(16)の 両方に直接接触していることを特徴とする、請求項22の複合材料。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57368695A | 1995-12-18 | 1995-12-18 | |
US08/573,686 | 1995-12-18 | ||
US08/657,211 US5780172A (en) | 1995-12-18 | 1996-06-03 | Tin coated electrical connector |
US08/657,211 | 1996-06-03 | ||
US08/769,912 US5916695A (en) | 1995-12-18 | 1996-12-09 | Tin coated electrical connector |
US08/769,912 | 1996-12-09 | ||
PCT/US1996/019768 WO1997022472A1 (en) | 1995-12-18 | 1996-12-10 | Tin coated electrical connector |
CA002240239A CA2240239C (en) | 1995-12-18 | 1998-06-10 | Tin coated electrical connector |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005143106A Division JP4427487B2 (ja) | 1995-12-18 | 2005-05-16 | 錫被覆電気コネクタ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001526734A true JP2001526734A (ja) | 2001-12-18 |
JP2001526734A5 JP2001526734A5 (ja) | 2004-11-04 |
JP3727069B2 JP3727069B2 (ja) | 2005-12-14 |
Family
ID=31499384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52290197A Expired - Lifetime JP3727069B2 (ja) | 1995-12-18 | 1996-12-10 | 錫被覆電気コネクタ |
Country Status (6)
Country | Link |
---|---|
US (1) | US5916695A (ja) |
EP (2) | EP0869867B1 (ja) |
JP (1) | JP3727069B2 (ja) |
CA (1) | CA2240239C (ja) |
DE (1) | DE69622192T2 (ja) |
WO (1) | WO1997022472A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1643015A2 (en) | 2004-09-29 | 2006-04-05 | Dowa Mining Co., Ltd. | Tin-plated product |
JP2006161127A (ja) * | 2004-12-09 | 2006-06-22 | Takamatsu Mekki:Kk | 嵌合型接続端子に適した電子材料とその製造方法 |
JP2006265642A (ja) * | 2005-03-24 | 2006-10-05 | Dowa Mining Co Ltd | 錫めっき材およびその製造方法 |
JP2007092144A (ja) * | 2005-09-29 | 2007-04-12 | Dowa Metaltech Kk | 複合めっき材およびその製造方法 |
JP2010541139A (ja) * | 2007-10-01 | 2010-12-24 | タイコ エレクトロニクス アンプ ゲゼルシャフト ミット ベシュレンクテル ハウツンク | 電気コンタクト要素およびその製造方法 |
JP2011225966A (ja) * | 2010-03-30 | 2011-11-10 | Mitsubishi Materials Corp | Snめっき付き導電材及びその製造方法 |
JP2015525833A (ja) * | 2012-07-20 | 2015-09-07 | タイコ エレクトロニクス フランス エス アー エス | プレスフィットコンタクトのためのコーティング方法およびコーティング |
JP2017043827A (ja) * | 2015-08-28 | 2017-03-02 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6861159B2 (en) * | 1992-03-27 | 2005-03-01 | The Louis Berkman Company | Corrosion-resistant coated copper and method for making the same |
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Cited By (10)
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EP1643015A2 (en) | 2004-09-29 | 2006-04-05 | Dowa Mining Co., Ltd. | Tin-plated product |
US7651785B2 (en) | 2004-09-29 | 2010-01-26 | Dowa Mining Co., Ltd. | Tin-plated product |
JP2006161127A (ja) * | 2004-12-09 | 2006-06-22 | Takamatsu Mekki:Kk | 嵌合型接続端子に適した電子材料とその製造方法 |
JP2006265642A (ja) * | 2005-03-24 | 2006-10-05 | Dowa Mining Co Ltd | 錫めっき材およびその製造方法 |
JP4749746B2 (ja) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | 錫めっき材およびその製造方法 |
JP2007092144A (ja) * | 2005-09-29 | 2007-04-12 | Dowa Metaltech Kk | 複合めっき材およびその製造方法 |
JP2010541139A (ja) * | 2007-10-01 | 2010-12-24 | タイコ エレクトロニクス アンプ ゲゼルシャフト ミット ベシュレンクテル ハウツンク | 電気コンタクト要素およびその製造方法 |
JP2011225966A (ja) * | 2010-03-30 | 2011-11-10 | Mitsubishi Materials Corp | Snめっき付き導電材及びその製造方法 |
JP2015525833A (ja) * | 2012-07-20 | 2015-09-07 | タイコ エレクトロニクス フランス エス アー エス | プレスフィットコンタクトのためのコーティング方法およびコーティング |
JP2017043827A (ja) * | 2015-08-28 | 2017-03-02 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE69622192D1 (de) | 2002-08-08 |
EP1203654A3 (en) | 2006-03-08 |
EP0869867B1 (en) | 2002-07-03 |
CA2240239C (en) | 2009-12-01 |
EP0869867A1 (en) | 1998-10-14 |
DE69622192T2 (de) | 2003-02-27 |
EP0869867A4 (en) | 1998-12-09 |
JP3727069B2 (ja) | 2005-12-14 |
CA2240239A1 (en) | 1999-12-10 |
WO1997022472A1 (en) | 1997-06-26 |
US5916695A (en) | 1999-06-29 |
EP1203654A2 (en) | 2002-05-08 |
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