JP2023027033A5 - - Google Patents
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- Publication number
- JP2023027033A5 JP2023027033A5 JP2022162821A JP2022162821A JP2023027033A5 JP 2023027033 A5 JP2023027033 A5 JP 2023027033A5 JP 2022162821 A JP2022162821 A JP 2022162821A JP 2022162821 A JP2022162821 A JP 2022162821A JP 2023027033 A5 JP2023027033 A5 JP 2023027033A5
- Authority
- JP
- Japan
- Prior art keywords
- surface treatment
- composition
- trimethylsilyl
- aprotic solvent
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 62
- 238000004381 surface treatment Methods 0.000 claims description 31
- 239000000010 aprotic solvent Substances 0.000 claims description 18
- -1 siloxanes Chemical class 0.000 claims description 17
- 239000012756 surface treatment agent Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- 150000002596 lactones Chemical class 0.000 claims description 11
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 10
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical group O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 6
- JOOMLFKONHCLCJ-UHFFFAOYSA-N N-(trimethylsilyl)diethylamine Chemical compound CCN(CC)[Si](C)(C)C JOOMLFKONHCLCJ-UHFFFAOYSA-N 0.000 claims description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- 235000013877 carbamide Nutrition 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- 150000003951 lactams Chemical class 0.000 claims description 5
- 150000003672 ureas Chemical class 0.000 claims description 5
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical group CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 4
- JYOQNYLFMVKQHO-UHFFFAOYSA-N 1,1-bis(trimethylsilyl)urea Chemical compound C[Si](C)(C)N(C(N)=O)[Si](C)(C)C JYOQNYLFMVKQHO-UHFFFAOYSA-N 0.000 claims description 3
- KRUQDZRWZXUUAD-UHFFFAOYSA-N bis(trimethylsilyl) sulfate Chemical compound C[Si](C)(C)OS(=O)(=O)O[Si](C)(C)C KRUQDZRWZXUUAD-UHFFFAOYSA-N 0.000 claims description 3
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 claims description 3
- KAHVZNKZQFSBFW-UHFFFAOYSA-N n-methyl-n-trimethylsilylmethanamine Chemical group CN(C)[Si](C)(C)C KAHVZNKZQFSBFW-UHFFFAOYSA-N 0.000 claims description 3
- VMZOBROUFBEGAR-UHFFFAOYSA-N tris(trimethylsilyl) phosphite Chemical compound C[Si](C)(C)OP(O[Si](C)(C)C)O[Si](C)(C)C VMZOBROUFBEGAR-UHFFFAOYSA-N 0.000 claims description 3
- CVNCFZIIZGNVFD-UHFFFAOYSA-N n,n-bis(trimethylsilyl)prop-2-en-1-amine Chemical compound C[Si](C)(C)N([Si](C)(C)C)CC=C CVNCFZIIZGNVFD-UHFFFAOYSA-N 0.000 claims description 2
- FBADCSUQBLLAHW-UHFFFAOYSA-N 4-trimethylsilyloxypent-3-en-2-one Chemical compound CC(=O)C=C(C)O[Si](C)(C)C FBADCSUQBLLAHW-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 239000002335 surface treatment layer Substances 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ZSMNRKGGHXLZEC-UHFFFAOYSA-N n,n-bis(trimethylsilyl)methanamine Chemical compound C[Si](C)(C)N(C)[Si](C)(C)C ZSMNRKGGHXLZEC-UHFFFAOYSA-N 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- FBADCSUQBLLAHW-SOFGYWHQSA-N (e)-4-trimethylsilyloxypent-3-en-2-one Chemical compound CC(=O)\C=C(/C)O[Si](C)(C)C FBADCSUQBLLAHW-SOFGYWHQSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- HIMXYMYMHUAZLW-UHFFFAOYSA-N [[[dimethyl(phenyl)silyl]amino]-dimethylsilyl]benzene Chemical compound C=1C=CC=CC=1[Si](C)(C)N[Si](C)(C)C1=CC=CC=C1 HIMXYMYMHUAZLW-UHFFFAOYSA-N 0.000 description 2
- YFONAHAKNVIHPT-UHFFFAOYSA-N [methyl-[[methyl(diphenyl)silyl]amino]-phenylsilyl]benzene Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C)N[Si](C)(C=1C=CC=CC=1)C1=CC=CC=C1 YFONAHAKNVIHPT-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 239000006184 cosolvent Substances 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- CWXWPIUMYLZIME-UHFFFAOYSA-N n-[dimethyl(2-phenylethyl)silyl]-n-methylmethanamine Chemical compound CN(C)[Si](C)(C)CCC1=CC=CC=C1 CWXWPIUMYLZIME-UHFFFAOYSA-N 0.000 description 2
- QULMGWCCKILBTO-UHFFFAOYSA-N n-[dimethylamino(dimethyl)silyl]-n-methylmethanamine Chemical group CN(C)[Si](C)(C)N(C)C QULMGWCCKILBTO-UHFFFAOYSA-N 0.000 description 2
- 239000012487 rinsing solution Substances 0.000 description 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024092571A JP2024103792A (ja) | 2017-03-24 | 2024-06-06 | 表面処理方法およびそのための組成物 |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762476182P | 2017-03-24 | 2017-03-24 | |
| US62/476,182 | 2017-03-24 | ||
| US201862617688P | 2018-01-16 | 2018-01-16 | |
| US62/617,688 | 2018-01-16 | ||
| JP2019552589A JP7452782B2 (ja) | 2017-03-24 | 2018-03-22 | 表面処理方法およびそのための組成物 |
| PCT/US2018/023697 WO2018175682A1 (en) | 2017-03-24 | 2018-03-22 | Surface treatment methods and compositions therefor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019552589A Division JP7452782B2 (ja) | 2017-03-24 | 2018-03-22 | 表面処理方法およびそのための組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024092571A Division JP2024103792A (ja) | 2017-03-24 | 2024-06-06 | 表面処理方法およびそのための組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023027033A JP2023027033A (ja) | 2023-03-01 |
| JP2023027033A5 true JP2023027033A5 (https=) | 2023-12-18 |
| JP7502388B2 JP7502388B2 (ja) | 2024-06-18 |
Family
ID=63581154
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019552589A Active JP7452782B2 (ja) | 2017-03-24 | 2018-03-22 | 表面処理方法およびそのための組成物 |
| JP2022162821A Active JP7502388B2 (ja) | 2017-03-24 | 2022-10-07 | 表面処理方法およびそのための組成物 |
| JP2024092571A Pending JP2024103792A (ja) | 2017-03-24 | 2024-06-06 | 表面処理方法およびそのための組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019552589A Active JP7452782B2 (ja) | 2017-03-24 | 2018-03-22 | 表面処理方法およびそのための組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024092571A Pending JP2024103792A (ja) | 2017-03-24 | 2024-06-06 | 表面処理方法およびそのための組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10593538B2 (https=) |
| EP (1) | EP3602606B1 (https=) |
| JP (3) | JP7452782B2 (https=) |
| KR (1) | KR102519448B1 (https=) |
| CN (2) | CN110462525B (https=) |
| IL (1) | IL269490B (https=) |
| SG (1) | SG11201908617QA (https=) |
| TW (1) | TWI835725B (https=) |
| WO (1) | WO2018175682A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10941301B2 (en) * | 2017-12-28 | 2021-03-09 | Tokyo Ohka Kogyo Co., Ltd. | Surface treatment method, surface treatment agent, and method for forming film region-selectively on substrate |
| SG11202005938SA (en) | 2018-01-05 | 2020-07-29 | Fujifilm Electronic Materials Usa Inc | Surface treatment compositions and methods |
| KR102084164B1 (ko) * | 2018-03-06 | 2020-05-27 | 에스케이씨 주식회사 | 반도체 공정용 조성물 및 반도체 공정 |
| SG11202009171XA (en) * | 2018-04-05 | 2020-10-29 | Central Glass Co Ltd | Surface treatment method of wafer and composition used for said method |
| US20200035494A1 (en) * | 2018-07-30 | 2020-01-30 | Fujifilm Electronic Materials U.S.A., Inc. | Surface Treatment Compositions and Methods |
| SG11202105360UA (en) * | 2018-11-22 | 2021-06-29 | Central Glass Co Ltd | Bevel portion treatment agent composition and method of manufacturing wafer |
| EP4017924A4 (en) * | 2019-08-21 | 2023-11-08 | FUJIFILM Electronic Materials U.S.A., Inc. | SURFACE TREATMENT COMPOSITIONS AND METHODS |
| US11781092B2 (en) * | 2019-08-27 | 2023-10-10 | Resonac Corporation | Composition, and method for cleaning adhesive polymer |
| JP7446097B2 (ja) * | 2019-12-06 | 2024-03-08 | 東京応化工業株式会社 | 表面処理剤及び表面処理方法 |
| EP4155375A4 (en) * | 2020-05-21 | 2024-07-24 | Central Glass Company, Limited | SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION |
| KR20230015958A (ko) | 2020-05-21 | 2023-01-31 | 샌트랄 글래스 컴퍼니 리미티드 | 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물 |
| JP7701868B2 (ja) * | 2021-12-13 | 2025-07-02 | 東京応化工業株式会社 | 基板表面処理方法、基板表面の領域選択的製膜方法、及び表面処理剤 |
| US20230317464A1 (en) * | 2022-03-31 | 2023-10-05 | Fujifilm Electronic Materials U.S.A., Inc. | Surface Treatment Compositions and Methods |
| TW202429525A (zh) * | 2022-09-14 | 2024-07-16 | 美商富士軟片電子材料美國股份有限公司 | 表面處理組成物及方法 |
| JPWO2024248021A1 (https=) * | 2023-05-31 | 2024-12-05 | ||
| US20250157825A1 (en) * | 2023-11-13 | 2025-05-15 | Fujifilm Electronic Materials U.S.A., Inc. | Etching methods |
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| JP6681796B2 (ja) | 2016-06-21 | 2020-04-15 | 東京応化工業株式会社 | シリル化剤溶液、表面処理方法、及び半導体デバイスの製造方法 |
| JP6310583B2 (ja) * | 2017-02-10 | 2018-04-11 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| CN108250916A (zh) * | 2017-12-29 | 2018-07-06 | 安徽鑫发铝业有限公司 | 一种汽车用铝型材表面处理工艺 |
| SG11202005938SA (en) | 2018-01-05 | 2020-07-29 | Fujifilm Electronic Materials Usa Inc | Surface treatment compositions and methods |
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2018
- 2018-03-22 US US15/928,152 patent/US10593538B2/en active Active
- 2018-03-22 SG SG11201908617Q patent/SG11201908617QA/en unknown
- 2018-03-22 CN CN201880019856.XA patent/CN110462525B/zh active Active
- 2018-03-22 KR KR1020197030566A patent/KR102519448B1/ko active Active
- 2018-03-22 JP JP2019552589A patent/JP7452782B2/ja active Active
- 2018-03-22 WO PCT/US2018/023697 patent/WO2018175682A1/en not_active Ceased
- 2018-03-22 CN CN202410395705.1A patent/CN118344845A/zh active Pending
- 2018-03-22 EP EP18772478.6A patent/EP3602606B1/en active Active
- 2018-03-23 TW TW107110073A patent/TWI835725B/zh active
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2019
- 2019-09-20 IL IL269490A patent/IL269490B/en unknown
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2022
- 2022-10-07 JP JP2022162821A patent/JP7502388B2/ja active Active
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2024
- 2024-06-06 JP JP2024092571A patent/JP2024103792A/ja active Pending
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