SG11201908617QA - Surface treatment methods and compositions therefor - Google Patents
Surface treatment methods and compositions thereforInfo
- Publication number
- SG11201908617QA SG11201908617QA SG11201908617QA SG11201908617QA SG 11201908617Q A SG11201908617Q A SG 11201908617QA SG 11201908617Q A SG11201908617Q A SG 11201908617QA SG 11201908617Q A SG11201908617Q A SG 11201908617QA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- go3f
- pct
- surface treatment
- compositions therefor
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000004381 surface treatment Methods 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 241000220010 Rhode Species 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000012776 electronic material Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000002335 surface treatment layer Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/008—Temporary coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02334—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment in-situ cleaning after layer formation, e.g. removing process residues
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Detergent Compositions (AREA)
- Lubricants (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Formation Of Insulating Films (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 27 September 2018 (27.09.2018) WIPO I PCT (51) International Patent Classification: GO3F 7/42 (2006.01) GO3F 7/075 (2006.01) C07C 311/48 (2006.01) GO3F 7/40 (2006.01) CO8L 83/14 (2006.01) HO1L 21/3105 (2006.01) (21) International Application Number: PCT/US2018/023697 (22) International Filing Date: 22 March 2018 (22.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/476,182 24 March 2017 (24.03.2017) US 62/617,688 16 January 2018 (16.01.2018) US (71) Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. [US/US]; 80 Circuit Drive, N. Kingstown, Rhode Island 02852 (US). (72) Inventors: WOJTCZAK, William A.; 6803 Rio Bra- vo Lane, Austin, Texas 78737 (US). PARK, Keeyoung; 3658 S. Joshua Tree Lane, Gilbert, Arizona 85297 (US). MIZUTANI, Atsushi; Avenue Marcel Thiry 80 B5, 1200 Woluwe, Saint Lambert (BE). (74) Agent: ZHANG, Tony et al.; Fish & Richardson P.C., P.O. Box 1022, Minneapolis, Minnesota 55440-1022 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) 1-1 0 (57) : The disclosure provides methods and compositions therefor for treating a surface wherein a surface treatment layer is \" formed on the surface, thereby minimizing or preventing pattern collapse as the surface is subjected to typical cleaning steps in the 0 semiconductor manufacturing process. O V SID o Ho iflo VII IE (10) International Publication Number WO 2018/175682 Al (54) Title: SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762476182P | 2017-03-24 | 2017-03-24 | |
US201862617688P | 2018-01-16 | 2018-01-16 | |
PCT/US2018/023697 WO2018175682A1 (en) | 2017-03-24 | 2018-03-22 | Surface treatment methods and compositions therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201908617QA true SG11201908617QA (en) | 2019-10-30 |
Family
ID=63581154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201908617Q SG11201908617QA (en) | 2017-03-24 | 2018-03-22 | Surface treatment methods and compositions therefor |
Country Status (9)
Country | Link |
---|---|
US (1) | US10593538B2 (en) |
EP (1) | EP3602606B1 (en) |
JP (1) | JP7452782B2 (en) |
KR (1) | KR102519448B1 (en) |
CN (1) | CN110462525A (en) |
IL (1) | IL269490B (en) |
SG (1) | SG11201908617QA (en) |
TW (1) | TWI835725B (en) |
WO (1) | WO2018175682A1 (en) |
Families Citing this family (11)
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US10941301B2 (en) * | 2017-12-28 | 2021-03-09 | Tokyo Ohka Kogyo Co., Ltd. | Surface treatment method, surface treatment agent, and method for forming film region-selectively on substrate |
IL275626B1 (en) | 2018-01-05 | 2024-03-01 | Fujifilm Electronic Mat Usa Inc | Surface treatment compositions and methods |
KR102084164B1 (en) * | 2018-03-06 | 2020-05-27 | 에스케이씨 주식회사 | Composition for semiconductor process and semiconductor process |
CN111886676A (en) * | 2018-04-05 | 2020-11-03 | 中央硝子株式会社 | Method for surface treatment of wafer and composition therefor |
US20200035494A1 (en) * | 2018-07-30 | 2020-01-30 | Fujifilm Electronic Materials U.S.A., Inc. | Surface Treatment Compositions and Methods |
KR20210092297A (en) * | 2018-11-22 | 2021-07-23 | 샌트랄 글래스 컴퍼니 리미티드 | Bevel treatment agent composition and manufacturing method of wafer |
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KR102669766B1 (en) * | 2019-08-27 | 2024-05-28 | 가부시끼가이샤 레조낙 | Compositions and methods for cleaning adhesive polymers |
JPWO2021235476A1 (en) | 2020-05-21 | 2021-11-25 | ||
WO2023192000A1 (en) * | 2022-03-31 | 2023-10-05 | Fujifilm Electronic Materials U.S.A., Inc. | Surface treatment compositions and methods |
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JP6310583B2 (en) * | 2017-02-10 | 2018-04-11 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
CN108250916A (en) * | 2017-12-29 | 2018-07-06 | 安徽鑫发铝业有限公司 | A kind of aluminum section for automobile process of surface treatment |
IL275626B1 (en) | 2018-01-05 | 2024-03-01 | Fujifilm Electronic Mat Usa Inc | Surface treatment compositions and methods |
-
2018
- 2018-03-22 US US15/928,152 patent/US10593538B2/en active Active
- 2018-03-22 JP JP2019552589A patent/JP7452782B2/en active Active
- 2018-03-22 CN CN201880019856.XA patent/CN110462525A/en active Pending
- 2018-03-22 KR KR1020197030566A patent/KR102519448B1/en active IP Right Grant
- 2018-03-22 WO PCT/US2018/023697 patent/WO2018175682A1/en active Application Filing
- 2018-03-22 SG SG11201908617Q patent/SG11201908617QA/en unknown
- 2018-03-22 EP EP18772478.6A patent/EP3602606B1/en active Active
- 2018-03-23 TW TW107110073A patent/TWI835725B/en active
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KR102519448B1 (en) | 2023-04-07 |
WO2018175682A1 (en) | 2018-09-27 |
EP3602606B1 (en) | 2024-06-26 |
JP2023027033A (en) | 2023-03-01 |
JP7452782B2 (en) | 2024-03-19 |
EP3602606A1 (en) | 2020-02-05 |
US10593538B2 (en) | 2020-03-17 |
TW201842148A (en) | 2018-12-01 |
IL269490B (en) | 2022-06-01 |
JP2020512693A (en) | 2020-04-23 |
EP3602606A4 (en) | 2020-02-05 |
TWI835725B (en) | 2024-03-21 |
IL269490A (en) | 2019-11-28 |
CN110462525A (en) | 2019-11-15 |
US20180277357A1 (en) | 2018-09-27 |
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