JP7452782B2 - 表面処理方法およびそのための組成物 - Google Patents

表面処理方法およびそのための組成物 Download PDF

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Publication number
JP7452782B2
JP7452782B2 JP2019552589A JP2019552589A JP7452782B2 JP 7452782 B2 JP7452782 B2 JP 7452782B2 JP 2019552589 A JP2019552589 A JP 2019552589A JP 2019552589 A JP2019552589 A JP 2019552589A JP 7452782 B2 JP7452782 B2 JP 7452782B2
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Prior art keywords
surface treatment
composition
treatment composition
trimethylsilyl
weight
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Japanese (ja)
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JP2020512693A (ja
Inventor
エー． ヴォイチュクザック、ウィリアム
パク、キヨン
水谷篤史
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Fujifilm Electronic Materials USA Inc
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Fujifilm Electronic Materials USA Inc
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Publication of JP2020512693A publication Critical patent/JP2020512693A/ja
Priority to JP2022162821A priority Critical patent/JP7502388B2/ja
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Publication of JP7452782B2 publication Critical patent/JP7452782B2/ja
Priority to JP2024092571A priority patent/JP2024103792A/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6528—In-situ cleaning after layer formation, e.g. removing process residues
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Lubricants (AREA)
  • Detergent Compositions (AREA)
JP2019552589A 2017-03-24 2018-03-22 表面処理方法およびそのための組成物 Active JP7452782B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022162821A JP7502388B2 (ja) 2017-03-24 2022-10-07 表面処理方法およびそのための組成物
JP2024092571A JP2024103792A (ja) 2017-03-24 2024-06-06 表面処理方法およびそのための組成物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762476182P 2017-03-24 2017-03-24
US62/476,182 2017-03-24
US201862617688P 2018-01-16 2018-01-16
US62/617,688 2018-01-16
PCT/US2018/023697 WO2018175682A1 (en) 2017-03-24 2018-03-22 Surface treatment methods and compositions therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022162821A Division JP7502388B2 (ja) 2017-03-24 2022-10-07 表面処理方法およびそのための組成物

Publications (2)

Publication Number Publication Date
JP2020512693A JP2020512693A (ja) 2020-04-23
JP7452782B2 true JP7452782B2 (ja) 2024-03-19

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JP2019552589A Active JP7452782B2 (ja) 2017-03-24 2018-03-22 表面処理方法およびそのための組成物
JP2022162821A Active JP7502388B2 (ja) 2017-03-24 2022-10-07 表面処理方法およびそのための組成物
JP2024092571A Pending JP2024103792A (ja) 2017-03-24 2024-06-06 表面処理方法およびそのための組成物

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JP2024092571A Pending JP2024103792A (ja) 2017-03-24 2024-06-06 表面処理方法およびそのための組成物

Country Status (9)

Country Link
US (1) US10593538B2 (https=)
EP (1) EP3602606B1 (https=)
JP (3) JP7452782B2 (https=)
KR (1) KR102519448B1 (https=)
CN (2) CN110462525B (https=)
IL (1) IL269490B (https=)
SG (1) SG11201908617QA (https=)
TW (1) TWI835725B (https=)
WO (1) WO2018175682A1 (https=)

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SG11202009171XA (en) * 2018-04-05 2020-10-29 Central Glass Co Ltd Surface treatment method of wafer and composition used for said method
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
CN113169060B (zh) * 2018-11-22 2025-04-01 中央硝子株式会社 倒角部处理剂组合物和晶圆的制造方法
KR20220050922A (ko) * 2019-08-21 2022-04-25 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 처리 조성물 및 방법
JP7574798B2 (ja) * 2019-08-27 2024-10-29 株式会社レゾナック 組成物、及び接着性ポリマーの洗浄方法
JP7446097B2 (ja) * 2019-12-06 2024-03-08 東京応化工業株式会社 表面処理剤及び表面処理方法
CN115668459B (zh) * 2020-05-21 2025-12-16 中央硝子株式会社 半导体基板的表面处理方法及表面处理剂组合物
KR20230015959A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물
JP7701868B2 (ja) * 2021-12-13 2025-07-02 東京応化工業株式会社 基板表面処理方法、基板表面の領域選択的製膜方法、及び表面処理剤
US20230317464A1 (en) * 2022-03-31 2023-10-05 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
US20240101929A1 (en) * 2022-09-14 2024-03-28 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
WO2024248021A1 (ja) * 2023-05-31 2024-12-05 セントラル硝子株式会社 膜形成用組成物、基板の製造方法、および膜形成用組成物の製造方法
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Publication number Publication date
TWI835725B (zh) 2024-03-21
TW201842148A (zh) 2018-12-01
EP3602606A4 (en) 2020-02-05
CN110462525B (zh) 2024-07-26
JP2023027033A (ja) 2023-03-01
JP7502388B2 (ja) 2024-06-18
JP2020512693A (ja) 2020-04-23
CN118344845A (zh) 2024-07-16
JP2024103792A (ja) 2024-08-01
KR102519448B1 (ko) 2023-04-07
KR20190124795A (ko) 2019-11-05
US20180277357A1 (en) 2018-09-27
SG11201908617QA (en) 2019-10-30
CN110462525A (zh) 2019-11-15
US10593538B2 (en) 2020-03-17
EP3602606A1 (en) 2020-02-05
IL269490A (en) 2019-11-28
IL269490B (en) 2022-06-01
WO2018175682A1 (en) 2018-09-27
EP3602606B1 (en) 2024-06-26

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