JP2019114819A - 実装方法および実装装置 - Google Patents
実装方法および実装装置 Download PDFInfo
- Publication number
- JP2019114819A JP2019114819A JP2019080816A JP2019080816A JP2019114819A JP 2019114819 A JP2019114819 A JP 2019114819A JP 2019080816 A JP2019080816 A JP 2019080816A JP 2019080816 A JP2019080816 A JP 2019080816A JP 2019114819 A JP2019114819 A JP 2019114819A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- chip
- chip component
- bonding head
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 230000008569 process Effects 0.000 claims abstract description 41
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 47
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 5
- 238000012937 correction Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 24
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000000919 ceramic Substances 0.000 description 16
- 238000012545 processing Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
- H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9211—Parallel connecting processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/381—Pitch distance
Abstract
Description
複数台のボンディングヘッドによって前記基板にチップ部品を実装する過程で、
先行して前記基板の所定位置にチップ部品を実装し、所定時間をかけて当該チップ部品を加熱しながら本圧着する実装過程と、
前記ボンディングヘッドによって基板にチップ部品を実装および本圧着している間、他のボンディングヘッドを所定温度まで冷却する冷却過程を備え、
先行したボンディングヘッドによるチップ部品の実装が完了すると、他のボンディングヘッドによって基板の所定位置にチップ部位を実装し、所定時間をかけて当該チップ部品を加熱しながら本圧着させるよう繰り返し、前記冷却過程において、次に実装するチップ部品を、前記ボンディングヘッドに供給することを特徴とする。
前記実装過程では、少なくとも2台のボンディングヘッドの組を、互いに異なる基板の同一部位にチップ部品を実装して本圧着し、
冷却過程では、他のボンディングヘッドを冷却することが好ましい。
チップ部品をピックアップするピックアップ機構と、前記ピックアップ機構から受け渡されたチップ部品を搬送するチップスライダを有するチップ部品供給部と、
前記基板を保持する保持ステージと、前記保持ステージを移動させる駆動機構と、前記保持ステージ上の基板の所定位置にチップ部品を実装および本圧着する複数台のボンディングヘッドと、前記ボンディングヘッドを加熱するヒータと、前記ボンディングヘッドを冷却する冷却機構とを有したチップ部品実装部とを備え、
前記チップスライダは前記ピックアップ機構と前記ボンディングヘッドの間を往復移動する機能を有し、
前記チップスライダが冷却中の前記ボンディングヘッドにチップ部品を受け渡す機能を有する。
前記制御部は、先行するボンディングヘッドが基板にチップ部品を実装および本圧着している間、認識機構を走査させて次にチップ部品の実装を行う基板の実装予定部位に設けられたアライメントマークを認識させてアライメント座標を求めることが好ましい。
搬送されてくる。
この段階において、画像認識手段を用いて、ボンディングヘッド21aのアタッチメントツール35表面状態を観察して、樹脂等の付着やキズの有無を判断する機能を制御手段3に付加してもよく、画像認識手段として2視野カメラ22を用いても良い。その際、付着物やキズが許容範囲以内と判断したら次のステップに移行する。
2 … チップ部品実装部
3 … 制御部
21a… ボンディングヘッド
21b… ボンディングヘッド
22 … 2視野カメラ
30 … 本体
31 … ホルダ
32 … ヒータベース
33 … 断熱ブロック
34 … セラミックヒータ
35 … アタッチメントツール
36 … 温度検出器
37 … 流路
39 … エアー供給源
C … チップ部品
Claims (14)
- 複数個の回路パターンが形成された基板にチップ部品を実装する実装方法であって、
複数台のボンディングヘッドによって前記基板にチップ部品を実装する過程で、
先行して前記基板の所定位置にチップ部品を実装し、所定時間をかけて当該チップ部品を加熱しながら本圧着する実装過程と、
前記ボンディングヘッドによって基板にチップ部品を実装および本圧着している間、他のボンディングヘッドを所定温度まで冷却する冷却過程を備え、
先行したボンディングヘッドによるチップ部品の実装が完了すると、他のボンディングヘッドによって基板の所定位置にチップ部位を実装し、所定時間をかけて当該チップ部品を加熱しながら本圧着させるよう繰り返し、
前記冷却過程において、次に実装するチップ部品を、前記ボンディングヘッドに供給することを特徴とする実装方法。 - 請求項1に記載の実装方法において、
前記実装過程の間、認識機構を移動させながら、次にチップ部品の実装を行う実装部位の基板に設けられたアライメントマークを認識させてアライメント座標を求めることを特徴とする実装方法。 - 請求項1または請求項2に記載の実装方法において、
冷却過程のボンディングヘッドにおいて、チップ部品の吸着を行うアタッチメントツールの、チップ部品吸着前の、表面を観察することを特徴とする実装方法。 - 請求項3に記載の実装方法において、
チップ部品のアライメントマークを認識する認識機構が、前記表面の観察も行うことを特徴とする実装方法。 - 請求項1ないし請求項4のいずれかに記載の実装方法において、
チップ部品のアライメントマークを認識する認識機構が、前記アタッチメントツールと、前記アタッチメントツールに吸着されたチップ部品の位置ズレ量を測定することを特徴とする実装方法。 - 請求項5に記載の実装方法において、
前記位置ズレ量に応じて、前記アタッチメントツールへのチップ部品の吸着位置を補正することを特徴とする実装方法。 - 請求項1ないし請求項6に記載の実装方法において、
前記実装過程は、基板を保持する保持ステージを移動させて実装位置のアライメントを行うことを特徴とする実装方法。 - 請求項1ないし請求項7のいずれかに記載の実装方法において、
1台の保持ステージに複数枚の前記基板を所定間隔をおいて整列配置し、前記実装過程では、少なくとも2台のボンディングヘッドの組を、互いに異なる基板の同一部位にチップ部品を実装して本圧着し、冷却過程では、他のボンディングヘッドを冷却することを特徴とする実装方法。 - 複数個の回路パターンが形成された基板にチップ部品を実装する実装装置であって、
チップ部品をピックアップするピックアップ機構と、前記ピックアップ機構から受け渡されたチップ部品を搬送するチップスライダを有するチップ部品供給部と、
前記基板を保持する保持ステージと、前記保持ステージを移動させる駆動機構と、前記保持ステージ上の基板の所定位置にチップ部品を実装および本圧着する複数台のボンディングヘッドと、前記ボンディングヘッドを加熱するヒータと、前記ボンディングヘッドを冷却する冷却機構とを有したチップ部品実装部とを備え、
前記チップスライダは前記ピックアップ機構と前記ボンディングヘッドの間を往復移動する機能を有し、
前記チップスライダが冷却中の前記ボンディングヘッドにチップ部品を受け渡す機能を有する実装装置。 - 請求項9に記載の実装装置であって、
前記ボンディングヘッドに保持されているチップ部品のアライメントマークと基板に設けられたアライメントマークを認識する認識機構を備え前記制御部は、先行するボンディングヘッドが基板にチップ部品を実装および本圧着している間、認識機構を走査させて次にチップ部品の実装を行う基板の実装予定部位に設けられたアライメントマークを認識させてアライメント座標を求めることを特徴とする実装装置。 - 請求項9または請求項10に記載の実装装置であって、
前記ボンディングヘッドがチップ部品を吸着するアタッチメントツールを備え、
観察機構を備え、
前記制御部が、前記観察機構を用いて、チップ部品を吸着していない状態の前記アタッチメントツールの表面を観察する機能を備えたことを特徴とする実装装置。 - 請求項11に記載の実装装置であって、
チップ部品のアライメントマークを認識する認識機構が、前記表面を観察する機能も備えることを特徴とする実装装置。 - 請求項9ないし請求項12のいずれかに記載の実装装置であって、
前記制御部が、チップ部品のアライメントマークを認識する認識機構を用いて、前記アタッチメントツールと、前記アタッチメントツールに吸着されたチップ部品の位置ズレ量を測定する機能を備えたことを特徴とする実装装置。 - 請求項13に記載の実装装置であって、
チップ部品を搬送し、前記アタッチメントツールに受け渡す、チップ部品受け渡し機構を備え、前記制御部が、前記位置ズレ量に応じて、チップ部品受け渡し機構において、チップ部品の位置補正を行う機能を備えたことを特徴とする実装装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013069628 | 2013-03-28 | ||
JP2013069628 | 2013-03-28 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017052153A Division JP6518709B2 (ja) | 2013-03-28 | 2017-03-17 | 実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019114819A true JP2019114819A (ja) | 2019-07-11 |
JP6823103B2 JP6823103B2 (ja) | 2021-01-27 |
Family
ID=51624105
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015508510A Pending JPWO2014157134A1 (ja) | 2013-03-28 | 2014-03-25 | 実装方法および実装装置 |
JP2017052153A Active JP6518709B2 (ja) | 2013-03-28 | 2017-03-17 | 実装装置 |
JP2019080816A Active JP6823103B2 (ja) | 2013-03-28 | 2019-04-22 | 実装方法および実装装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015508510A Pending JPWO2014157134A1 (ja) | 2013-03-28 | 2014-03-25 | 実装方法および実装装置 |
JP2017052153A Active JP6518709B2 (ja) | 2013-03-28 | 2017-03-17 | 実装装置 |
Country Status (4)
Country | Link |
---|---|
JP (3) | JPWO2014157134A1 (ja) |
KR (1) | KR102232636B1 (ja) |
TW (1) | TWI619181B (ja) |
WO (1) | WO2014157134A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023139685A1 (ja) * | 2022-01-19 | 2023-07-27 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102452411B1 (ko) * | 2015-03-20 | 2022-10-06 | 토레이 엔지니어링 컴퍼니, 리미티드 | 본딩 툴 냉각 장치 및 이것을 구비한 본딩 장치 및 본딩 툴 냉각 방법 |
JP6499286B2 (ja) * | 2015-06-15 | 2019-04-10 | 株式会社Fuji | 部品実装機 |
JP6705668B2 (ja) * | 2016-03-11 | 2020-06-03 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP2017183616A (ja) * | 2016-03-31 | 2017-10-05 | 東レエンジニアリング株式会社 | ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法 |
KR20180072035A (ko) | 2016-12-20 | 2018-06-29 | 삼성전자주식회사 | 본딩 장치 |
JP6781677B2 (ja) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 |
WO2020022345A1 (ja) * | 2018-07-24 | 2020-01-30 | 株式会社新川 | 電子部品実装装置 |
WO2020075216A1 (ja) * | 2018-10-09 | 2020-04-16 | ヤマハ発動機株式会社 | 部品実装装置 |
JP6667879B1 (ja) * | 2018-12-19 | 2020-03-18 | アサヒ・エンジニアリング株式会社 | 電子部品の実装装置 |
KR102122042B1 (ko) * | 2019-02-19 | 2020-06-26 | 세메스 주식회사 | 칩 본더 및 이를 갖는 기판 처리 장치 |
KR102267950B1 (ko) * | 2019-06-17 | 2021-06-22 | 세메스 주식회사 | 다이 본딩 방법 |
CN112566485B (zh) * | 2019-09-25 | 2022-05-13 | 芝浦机械电子装置株式会社 | 电子零件的安装装置 |
WO2022049685A1 (ja) * | 2020-09-02 | 2022-03-10 | 株式会社新川 | 半導体装置の製造装置および製造方法 |
CN114466526A (zh) * | 2021-11-02 | 2022-05-10 | 深圳市智链信息技术有限公司 | 一种无线接收信号放大器的芯片固定装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252212A (ja) * | 1993-02-24 | 1994-09-09 | Hitachi Ltd | ボンディング装置 |
JPH1022350A (ja) * | 1996-07-08 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JP2003297878A (ja) * | 2002-04-02 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 部品の基板への部品押圧接合装置及び接合方法 |
JP2005142460A (ja) * | 2003-11-10 | 2005-06-02 | Sony Corp | ボンディング装置及びボンディング方法 |
JP2005210608A (ja) * | 2004-01-26 | 2005-08-04 | Seiko Epson Corp | 圧電デバイスの製造方法および圧電デバイスの製造装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3497078B2 (ja) * | 1998-03-31 | 2004-02-16 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ |
JP4002431B2 (ja) * | 2001-12-21 | 2007-10-31 | シャープ株式会社 | 半導体レーザ装置の製造方法および半導体レーザ装置の製造装置 |
JP4043253B2 (ja) * | 2002-02-21 | 2008-02-06 | 松下電器産業株式会社 | 部品実装装置 |
JP4642565B2 (ja) * | 2005-06-29 | 2011-03-02 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
JP4828298B2 (ja) * | 2006-05-11 | 2011-11-30 | ヤマハ発動機株式会社 | 部品実装方法および部品実装装置 |
JP2009212254A (ja) * | 2008-03-04 | 2009-09-17 | Toray Eng Co Ltd | チップ搭載方法およびチップ搭載装置 |
JP2010212505A (ja) * | 2009-03-11 | 2010-09-24 | Toshiba Corp | 半導体装置の接合装置及び半導体装置の製造方法 |
TWI512858B (zh) | 2009-03-23 | 2015-12-11 | Toray Eng Co Ltd | Installation device and installation method |
-
2014
- 2014-03-25 KR KR1020157030537A patent/KR102232636B1/ko active IP Right Grant
- 2014-03-25 JP JP2015508510A patent/JPWO2014157134A1/ja active Pending
- 2014-03-25 WO PCT/JP2014/058178 patent/WO2014157134A1/ja active Application Filing
- 2014-03-27 TW TW103111517A patent/TWI619181B/zh active
-
2017
- 2017-03-17 JP JP2017052153A patent/JP6518709B2/ja active Active
-
2019
- 2019-04-22 JP JP2019080816A patent/JP6823103B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252212A (ja) * | 1993-02-24 | 1994-09-09 | Hitachi Ltd | ボンディング装置 |
JPH1022350A (ja) * | 1996-07-08 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JP2003297878A (ja) * | 2002-04-02 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 部品の基板への部品押圧接合装置及び接合方法 |
JP2005142460A (ja) * | 2003-11-10 | 2005-06-02 | Sony Corp | ボンディング装置及びボンディング方法 |
JP2005210608A (ja) * | 2004-01-26 | 2005-08-04 | Seiko Epson Corp | 圧電デバイスの製造方法および圧電デバイスの製造装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023139685A1 (ja) * | 2022-01-19 | 2023-07-27 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2017118147A (ja) | 2017-06-29 |
WO2014157134A1 (ja) | 2014-10-02 |
TW201448067A (zh) | 2014-12-16 |
TWI619181B (zh) | 2018-03-21 |
KR20150136510A (ko) | 2015-12-07 |
JP6518709B2 (ja) | 2019-05-22 |
JP6823103B2 (ja) | 2021-01-27 |
KR102232636B1 (ko) | 2021-03-25 |
JPWO2014157134A1 (ja) | 2017-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6518709B2 (ja) | 実装装置 | |
JP4816194B2 (ja) | 電子部品実装システムおよび電子部品搭載装置ならびに電子部品実装方法 | |
US8819929B2 (en) | Component mounting method | |
JP6692376B2 (ja) | 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 | |
JP4482598B2 (ja) | ボンディング装置、ボンディング装置の補正量算出方法及びボンディング方法 | |
WO2015038074A1 (en) | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method | |
JP6717630B2 (ja) | 電子部品の実装装置 | |
JP2009016673A (ja) | 部品の吸着位置補正方法および部品移載装置 | |
JP2007042766A (ja) | 電子部品の実装装置および実装方法 | |
JP6643578B2 (ja) | 部品搭載装置及び部品搭載方法 | |
US10285317B2 (en) | Component mounter | |
CN112017992A (zh) | 接合装置 | |
JP2013168465A (ja) | キャリブレート用ターゲット治具および半導体製造装置 | |
JP7451342B2 (ja) | 基板作業装置 | |
JP5851719B2 (ja) | マスクを用いてワークに導電性ボールを搭載する方法 | |
JP3872332B2 (ja) | 電子部品実装装置 | |
JP2023106662A (ja) | 実装装置および実装方法 | |
JPH11274240A (ja) | 電子部品の実装装置および実装方法 | |
US20200243476A1 (en) | Bonding apparatus and bonding method | |
TW202202808A (zh) | 安裝裝置及安裝方法 | |
JP2000286452A (ja) | 発光素子の発光中心検出方法 | |
TWI460776B (zh) | 應用於晶圓的銅柱焊料的製造方法及其設備 | |
KR20150088097A (ko) | 평판 디스플레이 패널용 가본딩장치 | |
KR20200142135A (ko) | 다이 본딩 방법 및 다이 본딩 장치 | |
WO2015105149A1 (ja) | 半導体装置の実装方法および実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190507 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200304 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200427 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200915 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201110 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201224 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210107 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6823103 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |