TWI619181B - Installation method and installation device - Google Patents

Installation method and installation device Download PDF

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Publication number
TWI619181B
TWI619181B TW103111517A TW103111517A TWI619181B TW I619181 B TWI619181 B TW I619181B TW 103111517 A TW103111517 A TW 103111517A TW 103111517 A TW103111517 A TW 103111517A TW I619181 B TWI619181 B TW I619181B
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Taiwan
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wafer
mounting
wafer component
component
substrate
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TW103111517A
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TW201448067A (zh
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寺田勝美
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東麗工程股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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Abstract

本發明之安裝方法係快速且精度良好地使晶片零件安裝及正式壓接於形成於電路基板之複數個電路圖案。具體而言，在藉由複數台接合頭21a、21b將晶片零件安裝於晶圓W之過程中，先行將晶片零件安裝於晶圓W之特定位置，且經特定時間將該晶片零件一面加熱一面進行正式壓接。於藉由該接合頭21a、21b之任一者而將晶片零件安裝及正式壓接於晶圓W之期間，將該接合頭與埋設於另一接合頭之加熱器一併地冷卻至特定溫度。若藉由先行之接合頭進行之晶片零件之安裝結束，則藉由另一接合頭將晶片零件安裝於晶圓W之特定位置，且經特定時間將該晶片零件一面加熱一面進行正式壓接。

Description

安裝方法及安裝裝置
本發明係關於一種將積體電路等之晶片零件安裝於半導體晶圓或電路基板等之安裝方法及安裝裝置。
近年來，伴隨電子製品之輕量化及小型化，電路基板之圖案存在微間距化(高精度化、微細化)之傾向。伴隨微間距化，而存在安裝於電路基板之零件件數亦增加之傾向。因此，為縮短對電路基板之安裝時間，而利用具備複數台接合頭之安裝裝置將晶片安裝於1塊電路基板。即，將晶片零件安裝及臨時壓接於電路基板上之塗佈或轉印於電極部分之非導電性樹脂(NCP，Non Conductive Paste)、非導電性膜(NCF，Non Conductive Film)或各向異性導電膜(ACF，Anisotropic Conductive Film)等之上。
將該經臨時壓接之基板搬送至後續步驟，藉由專用之接合頭來加熱晶片零件，使非導電性膜(NCF)等加熱硬化進行正式壓接(專利文獻1)。
先前技術文獻 專利文獻
專利文獻1：國際公開公報WO2010/110165
然而，於先前之安裝裝置中，必須在臨時壓接步驟及正式壓接 步驟中分別設置個別之接合頭，導致裝置構成大型化，從而必須確保充分之設置空間之不佳狀況。
又，於臨時壓接時之接著力不充分之情形時，將產生在自臨時壓接步驟朝向正式壓接步驟搬送之過程中，晶片零件自電路基板之電極剝落或者產生位置偏移之類的問題。
本發明係鑒於如上所述之情況而完成者，其主要目的在於提供一種可快速且精度良好地將晶片零件安裝於半導體晶圓或電路基板等的安裝方法及安裝裝置。
因此，本發明者為解決上述不佳狀況及問題，而製成具備複數台正式壓接用之接合頭之安裝裝置，進行快速地使晶片零件正式壓接於1塊電路基板之實驗及模擬，經銳意研究，最終獲得如下之新穎見解。
即，設置2台正式壓接用之接合頭，重複實施將晶片零件交替地安裝於電路基板之實驗。然而，晶片零件不斷地自電路基板之電極部位剝落或者產生連接不良。因此，為查明該連接不良等之原因，而觀察即將安裝於電路基板之前之晶片零件之背面時，發現被覆電極表面之助焊劑消失。又，根據晶片零件，而包含不僅助焊劑消失而且凸塊前端部之焊料熔融或變形者。
進而，若晶片零件之溫度始終較高，則介置於晶片零件與電路基板之間之NCF等之樹脂之硬化被過度地促進。即，雖然使晶片零件之凸塊僅與電路基板之電極相互接觸，但為了將凸塊與電極之間密封，即便必須將剩餘之樹脂排出，亦於排出前導致樹脂硬化而產生接觸不良。
因此，本發明之目的在於解決上述問題及該等新問題。
為達成此種目的，本發明採取如下構成。
即，一種安裝方法，其特徵在於：其係將晶片零件安裝於形成有複數個電路圖案之基板，在藉由複數台接合頭而將晶片零件安裝於上述基板之過程中，包括如下過程：安裝過程，其先行將晶片零件安裝於上述基板之特定位置，且經特定時間將該晶片零件一面加熱一面進行正式壓接；及冷卻過程，其於藉由上述接合頭而將晶片零件安裝及正式壓接於基板之期間，將其他接合頭冷卻至特定溫度；且，重複地進行：若藉由先行之接合頭所進行之晶片零件之安裝結束，則藉由其他接合頭而將晶片零件安裝於基板之特定位置，且經特定時間將該晶片零件一面加熱一面使其正式壓接。
(作用/效果)根據該方法，在先行之接合頭將晶片零件安裝及正式壓接於基板之期間，主動地將其他接合頭冷卻至特定溫度。因此，在藉由接著執行安裝及正式壓接之接合頭來保持安裝晶片零件之前之期間，該晶片零件之凸塊前端部之焊料不會以與正式壓接時之加熱溫度接近之溫度被加熱。即，可避免晶片零件之凸塊前端之焊料之熔融、變形、及助焊劑之消失等，進而，可消除對於基板之連接不良。
再者，於上述方法中，較佳為，於安裝過程之期間，使辨識機構一面移動，一面辨識接著要進行晶片零件之安裝之安裝部位之基板上所設置之對準標記，且求出對準座標。
根據該方法，若先行之接合頭結束晶片零件對於基板之正式壓接，則可於短時間內實施接著進行安裝處理之接合頭與基板之安裝部位之對準。因此，可縮短安裝處理之工站時間。
又，於該方法中，較理想為於冷卻過程之接合頭，觀察要進行晶片零件之吸附之附件工具的晶片零件吸附前之表面。進而，亦可由辨識晶片零件之對準標記之辨識機構進行上述表面之觀察。
根據該方法，可防止因樹脂附著於附件工具等引起之安裝時之晶片零件之破損或位置偏移。
於使用辨識晶片零件之對準標記之辨識機構之情形時，亦可測定上述附件工具與吸附於上述附件工具之晶片零件之位置偏移量。
進而，亦可相應於上述位置偏移量，修正晶片零件對於上述附件工具之吸附位置。
可藉由該方法，而防止安裝時樹脂附著於附件工具之情況。
又，較佳為於安裝過程中，使保持基板之保持台移動而進行安裝位置之對準。
根據該方法，可使保持台移動，使接合頭固定。即，可避免接合頭移動時產生之晶片零件之保持位置之偏移。換言之，可避免伴隨保持位置之偏移之安裝位置之偏移。
再者，於上述方法中較佳為，於1台保持台上隔開特定間隔成排配置複數塊上述基板，於上述安裝過程中，將至少2台接合頭之組於互不相同之基板之同一部位安裝及正式壓接晶片零件，於冷卻過程中，將其他接合頭冷卻。
根據該方法，藉由至少2台接合頭之組而同時地於複數塊基板安裝晶片零件，因此，可進一步縮短安裝處理之工站時間。
又，為達成此種目的，本發明採取如下構成。
即，一種安裝裝置，其特徵在於：其係將晶片零件安裝於形成有複數個電路圖案之基板，且具備：保持台，其保持上述基板；驅動機構，其使上述保持台移動；複數台接合頭，其等將晶片零件安裝及正式壓接於上述保持台上之基板之特定位置； 加熱器，其加熱上述接合頭；冷卻機構，其將上述接合頭冷卻；及控制部，其在先行將晶片零件安裝於上述基板之特定位置，經特定時間將該晶片零件一面加熱一面進行正式壓接的期間，藉由冷卻機構而使其他接合頭冷卻。
(作用/效果)根據該構成，可在先行之接合頭將晶片零件安裝及正式壓接於基板之期間，將其他接合頭及加熱器冷卻。因此，可較佳地實施上述方法。
再者，於上述構成中，較佳為，包括辨識保持於接合頭之晶片零件之對準標記與設置於基板之對準標記的辨識機構，上述控制部係在先行之接合頭將晶片零件安裝及正式壓接於基板之期間，使辨識機構進行掃描，辨識接著要進行晶片零件之安裝之基板之預定安裝部位上設置的對準標記，且求出對準座標。
根據該構成，若先行之接合頭結束晶片零件對基板之正式壓接，則可於短時間內實施接著進行安裝處理之接合頭與基板之安裝部位之對準。因此，可縮短安裝處理之工站時間。
又，較理想為，上述接合頭包括吸附晶片零件之附件工具，且包括觀察機構，上述控制部具備使用上述觀察機構觀察未吸附晶片零件之狀態之上述附件工具之表面的功能。此時，辨識晶片零件之對準標記之辨識機構亦可觀察上述表面。
根據該構成，可防止因樹脂附著於附件工具等引起安裝時之晶片零件之破損或位置偏移。
進而，亦較理想為上述控制部具備如下功能：使用辨識晶片零件之對準標記之辨識機構，測定上述附件工具與吸附於上述附件工具之晶片零件之位置偏移量。
此處，更較理想為包括將晶片零件搬送且交接給上述附件工具 的晶片零件交接機構，且上述控制部具備如下功能：根據上述位置偏移量，於晶片零件交接機構進行晶片零件之位置修正。
根據該構成，可防止安裝時樹脂附著於附件工具。
根據本發明之安裝方法及安裝裝置，可快速且精度良好地使晶片零件安裝及正式壓接於電路基板。
1‧‧‧晶片零件供給部
2‧‧‧晶片零件安裝部
3‧‧‧控制部
4‧‧‧匣盒載置台
5‧‧‧晶圓搬送機構
6‧‧‧拾取工作台
7‧‧‧拾取機構
8a‧‧‧晶片滑塊
8b‧‧‧晶片滑塊
9‧‧‧匣盒
10‧‧‧軌道
11‧‧‧活動台
12‧‧‧臂
13‧‧‧夾具
14‧‧‧拾取嘴
16‧‧‧吸附板
17‧‧‧軌道
18‧‧‧活動台
19‧‧‧伺服馬達
20‧‧‧螺桿軸
21a‧‧‧接合頭
21b‧‧‧接合頭
22‧‧‧雙視野相機
23‧‧‧保持台
24‧‧‧基台
25‧‧‧門型框架
26‧‧‧升降機構
30‧‧‧本體
31‧‧‧保持器
32‧‧‧加熱器基座
33‧‧‧隔熱塊
34‧‧‧陶瓷加熱器
35‧‧‧附件工具
36‧‧‧溫度檢測器
37‧‧‧流路
37a‧‧‧開口部
38‧‧‧耐壓軟管
39‧‧‧氣體供給源
40‧‧‧貫通孔
41‧‧‧真空源
C‧‧‧晶片零件
V‧‧‧閥
V‧‧‧電磁閥
W‧‧‧晶圓
WD‧‧‧晶圓
X‧‧‧軸
Y‧‧‧軸
Z‧‧‧軸
θ‧‧‧方向
圖1係表示本實施例之安裝裝置之概略構成之立體圖。
圖2係晶片滑塊之立體圖。
圖3係接合頭之局部斷裂剖面圖。
圖4係表示實施例裝置之一系列動作之流程圖。
圖5係表示接合頭之單一處理時間內之溫度分佈之圖。
圖6係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖7係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖8係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖9係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖10係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖11係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖12係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖13係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖14係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖15係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖16係對藉由實施例裝置而將晶片零件安裝於電路基板之動作進行說明的圖。
圖17(a)、(b)係表示變化例之安裝形態之圖。
圖18係表示變化例之安裝形態之圖。
以下，參照圖式對本發明之一實施例進行說明。
圖1係表示本發明之實施例之安裝裝置之概略構成的立體圖。
如圖1及圖3所示，安裝裝置包括晶片零件供給部1、晶片零件安裝部2及控制部3等。
晶片零件供給部1包括匣盒載置台4、晶圓搬送機構5、拾取工作台6、拾取機構7及晶片滑塊8等。
匣盒載置台4係載置隔開特定間隔而多段地收納經切割處理之半導體晶圓WD(以下，簡稱為「晶圓」)的匣盒9。晶圓8係藉由擴展處理而分斷成單片，從而成為晶片零件C。晶片零件C係由切割膠帶接著保持。
晶圓搬送機構5係將晶圓WD自匣盒9搬出，載置於拾取工作台6。即，於受到可沿軌道10滑動移動之活動台11懸臂支持之臂12之前端具備夾具13。該活動台11係以由利用伺服馬達正反驅動之螺桿軸螺旋進給驅動的方式構成。
拾取工作台6係吸附保持由切割膠帶接著保持之晶圓WD。
拾取機構7具備可前後左右(圖中之XY軸方向)地移動，並且可升降(Z軸方向)之朝下之拾取嘴14。即，拾取機構7係以將由拾取嘴14吸附保持之晶片零件C交接給晶片滑塊8的方式構成。
晶片滑塊8具備與下述之接合頭21a、21b之個數對應之台數。因此，於本實施例中，上下2段地具備2台晶片滑塊8a、8b。如圖2所示，各晶片滑塊8a、8b係藉由吸附保持晶片零件C之吸附板16而分別自拾取機構7側之接收位置往返移動至接合頭21a、21b之下方之交接位置。即，包括吸附板16且於軌道17可滑動移動地受到支持的活動台18係以由利用伺服馬達19正反驅動之螺桿軸20螺旋進給驅動的方式構成。只要工站時間存在裕度，則晶片滑塊8亦可利用1台晶片滑塊將晶片零件C交接給各接合頭21a、21b。
晶片零件安裝部2包括接合頭21a、21b、雙視野相機22及保持台23等。
接合頭21a、21b係介隔氣缸或滾珠螺桿等升降機構26，安裝於橫跨保持台23豎立設置於基台24之門型框架25之橫樑部分。又，接合頭21a、21b構成為可圍繞縱Z軸旋轉。即，接合頭21a、21b可進行圖中之θ方向之位置對準。
進而，如圖3所示，接合頭21a、21b係自包括金屬製工具之本體30之下部起依序包括陶瓷製之保持器31、隔熱塊33、陶瓷加熱器34及附件工具35。再者，附件工具35係吸附固定於陶瓷加熱器34，且可自動更換與晶片零件C之形狀對應之專用之工具。
於陶瓷加熱器34設置有例如熱電偶、測溫電阻器等溫度檢測器36。即，利用溫度檢測器36檢測自陶瓷加熱器34接受之熱，並將其檢測結果發送至控制部3。
將氣體流通地排出至陶瓷加熱器34之發熱部分之上端面的流路37係貫通至本體30。又，流路37係經由具備閥V之耐壓軟管38而與氣 體供給源39連通連接。
即，自氣體供給構件39供給之氣體係通過流路37而自開口部37a排出。因此，自陶瓷加熱器34之發熱部發出之熱因氣體循環而被奪取，從而能夠將包含陶瓷加熱器34及附件工具35之兩者之接合頭21a、21b急速地冷卻。又，若自設置於外部之噴嘴對陶瓷加熱器34及附件工具35之兩者噴附氣體進行冷卻，則可進一步縮短冷卻時間。
再者，接合頭21a、21b係自本體30至附件工具35形成有貫通孔40，且該貫通孔40與外部之真空源41經由電磁閥V而連通連接。
雙視野相機22係將安裝晶片零件C之基板之電路圖案上被賦予之對準標記與晶片零件C上被賦予之對準標記進行圖像辨識，且將圖像資料發送至控制部3。即，雙視野相機22係以於保持台23與晶片零件C之間水平移動之方式構成。再者，於本實施例中，使用晶圓W作為安裝晶片零件C之基板，但基板並不限定於晶圓，亦可為以耐熱性樹脂等為基材之軟性印刷基板，或者以陶瓷或玻璃等為基材之剛性印刷基板。
保持台23係設置於基台24，且以於前後左右(圖中之XY方向)水平移動之方式構成。
控制部3係被輸入與每種使用之樹脂、例如非導電性樹脂(NCP)、非導電性膜(NCF)或各向異性導電膜(ACF)對應之設定條件。例如，輸入有加熱時間、陶瓷加熱器34之冷卻溫度等。基於該等輸入條件與自溫度檢測器36所檢測之檢測結果，調整對陶瓷加熱器34通電之電流，進行溫度控制，及來自氣體供給源39之氣體之供給之接通．斷開切換、流量等之控制。例如，將溫度檢測器36實測值與設定值進行比較，根據所求出之溫度偏差而控制溫度。又，統一地控制裝置整體。關於具體之控制，將於以下之動作說明中詳細敍述。
其次，按照圖4之流程圖，對使用上述安裝裝置安裝及正式壓接 形成有複數個電路圖案之晶片零件的一系列動作進行說明。
首先，藉由實驗或模擬，在進行第1次安裝處理而處於加熱狀態之接合頭21a、21b吸附下一晶片零件C起至下降至安裝部位為止之期間，預先求出晶片零件C之下端之焊料不熔融或者不變化之溫度及助焊劑不消失之溫度(冷卻溫度)。又，求出陶瓷加熱器34及附件工具35之溫度自為將晶片零件C安裝及正式壓接於晶圓W而經升溫之溫度下降至冷卻溫度為止的時間。即，如圖5所示地獲取包含晶片零件C之安裝時間、冷卻時間之1台接合頭21a、21b之單一處理時間與溫度分佈之資料，且以該資料為基礎而記憶於控制部3之記憶部(步驟S1)。例如，將樹脂加熱至220℃，且於下降至樹脂之晶片零件C之接著開始穩定之玻璃轉移點之120℃之時間點使接合頭21a、21b上升，開始進行冷卻。
若條件設定結束，且使裝置作動，則控制部3藉由晶圓搬送機構5而自匣盒9將晶圓WD搬出，載置於拾取工作台6。其後，控制部3基於經條件設定之單一處理時間，一面切換接合頭21a、21b之作動，一面開始進行安裝處理(步驟S2)。
拾取機構7係將所吸附之晶片零件C依序交接給晶片滑塊8a、8b。其後，執行接合頭21a、21b之並列處理(步驟S2)。
首先，執行接合頭21a之安裝處理。
晶片滑塊8a係先行移動至接合頭21a之下方之交接位置。如圖6所示，接合頭21a下降，吸附晶片零件C(步驟S3a)。同時地，雙視野相機22移動至保持於接合頭21a之晶片零件C與晶圓W之間。其後，晶片滑塊8a朝向拾取機構7側移動，以接收下一晶片零件C。
如圖7所示，藉由雙視野相機22而對晶圓W之電路圖案上被賦予之對準標記與晶片零件C上被賦予之對準標記進行圖像辨識，且將圖像資料發送至控制部3。
控制部3係作動控制驅動機構，以利用該圖像資料進行對準處理(步驟S4a)。即，控制部3求出兩對準標記之位置座標。進而，算出自電路圖案之對準標記之位置座標至晶片零件C之對準標記之位置座標為止之方向及距離，僅使保持台23移動進行對準。另一接合頭21a圍繞縱軸旋轉進行對準。
若對準處理結束，則如圖8所示，使接合頭21a下降至特定高度，將晶片零件C安裝於電路圖案上之樹脂(步驟S5a)。此時，雙視野相機22移動至另一接合頭21b之下方。若於該階段中接合頭21b之附件工具35之晶片吸附面之表面存在污垢，則在吸附晶片零件C時，將對晶片零件C施加多餘之應力，從而存在引起安裝時之破損或位置偏移之虞。因此，亦可對控制構件3附加如下功能：使用圖像辨識構件，觀察附件工具35之表面狀態，判斷樹脂等有無附著或劃痕，亦可使用雙視野相機22作為圖像辨識構件。此時，若判斷附著物或劃痕為容許範圍以內則移行至下一步驟。
如圖9所示，藉由接合頭21a之陶瓷加熱器34而將附件工具35加熱，經特定時間將晶片零件C加熱至特定溫度。即，介隔晶片零件C使樹脂加熱硬化，將晶片零件C正式壓接於晶圓8之電路圖案(步驟S6a)。
於接合頭21a進行正式壓接處理之期間，將晶片零件C自晶片滑塊8b交接給接合頭21b(步驟S3b)。再者，若於該階段中晶片零件C未吸附於接合頭21b之附件工具35之特定位置，則產生在安裝階段中自晶片零件C突出之樹脂附著於附件工具35之可能性。樹脂對於附件工具35之附著如上所述成為晶片零件C安裝時之破損或位置偏移之原因。因此，若晶片滑塊8b為接收下一晶片零件C而移動至拾取機構7側，則雙視野相機22之位置成為保持於接合頭21b之晶片零件C與晶圓W之間，因而，可藉由雙視野相機22測定晶片零件C是否吸附於附 件工具35之特定位置及其位置偏移量。亦可為修正該位置偏移量，而對控制構件3附加如下功能：進行自拾取機構7朝向晶片滑塊8b之交接階段或/及自晶片滑塊8b朝向接合頭21b交接時的晶片零件C之位置修正。
正式壓接處理結束，如圖10所示，接合頭21a上升(步驟S7b)。使該接合頭21a之陶瓷加熱器34成為斷開，自氣體供給源39供給氣體，使該接合頭21a冷卻至特定之溫度(步驟S8a)。
與接合頭21a上升同時地，如圖11所示，使保持台23以預定之方向及特定距離移動。如圖12所示，藉由雙視野相機22而對晶圓W之電路圖案上被賦予之對準標記與保持於接合頭21b之晶片零件C上被賦予之對準標記進行圖像辨識，並將圖像資料發送至控制部3。控制部3係基於該圖像資料，進行保持台23及接合頭21b之對準(步驟S4b)。
此時，新晶片零件C被搬送至冷卻處理中之接合頭21a之下方。
若接合頭21b之對準處理結束，則如圖13所示，接合頭21b開始下降至特定高度(步驟S5b)。同時地，雙視野相機22移動至接合頭21a之下方。
亦可對控制構件3附加如下功能：於該階段中，使用圖像辨識構件，觀察接合頭21a之附件工具35表面狀態，判斷樹脂等有無附著或劃痕；亦可使用雙視野相機22作為圖像辨識構件。此時，若判斷附著物或劃痕為容許範圍以內則移行至下一步驟。
如圖14所示，藉由接合頭21b而將晶片零件C安裝及正式壓接於晶圓W之電路圖案上(步驟S6b)。藉由晶片滑塊8a而將晶片零件C交接給另一接合頭21a。其後，若晶片滑塊8a為接收下一晶片零件C而移動至拾取機構7側，則可藉由雙視野相機22而測定晶片零件C是否吸附於接合頭21a之附件工具35之特定位置及其位置偏移量。此處，亦可為修正位置偏移量，而對控制構件3附加如下功能：進行自拾取機構7 朝向晶片滑塊8a之交接階段或/及自晶片滑塊8a朝向接合頭21b交接時的晶片零件C之位置修正。
如圖15所示，若接合頭21b之正式壓接處理結束，則使該接合頭21b上升，並且使保持台23以預定之方向及特定距離移動(步驟S7b)。若開始進行一接合頭21b之冷卻處理(步驟S8b)，則開始進行另一接合頭21a之對準處理。
以上，利用2台接合頭21a、21b完成正式壓接處理，隨後，於步驟S9a、S9b中，在達到預定安裝數量之前進行計數，以相同之週期重複執行與形成於晶圓W之電路圖案之個數相應之正式壓接處理。
根據上述實施例裝置，於一接合頭21b將晶片零件C安裝及正式壓接於晶圓8之電路圖案之期間，可自氣體供給源39對已先行完成正式壓接處理之接合頭21a之內部供給氣體，主動地進行冷卻。即，既不會使晶片零件C之凸塊之焊料熔融或變形，亦不會意外地使電路基板上之樹脂硬化，且可交替地切換接合頭21a、21b，連續且精度良好地將晶片零件C安裝於晶圓W之電路圖案。
本發明並不限定於上述實施例者，亦能夠以如下方式實施變化。
(1)於上述實施例裝置中，亦可於接合頭21a、21b之任一者將晶片零件C安裝於晶圓W之電路圖案之期間，使雙視野相機22進行掃描，僅先辨識另一接合頭接著安裝晶片零件C之預定之電路圖案之對準標記。根據該構成，可利用待機時間，僅實施一對準標記之圖像處理，因此，可減輕圖像處理對控制部3之負擔，並且可縮短處理時間。
(2)於上述實施例裝置中，亦可如圖17所示地構成如下：於1台保持台23隔開特定間距地成排配置複數塊電路基板，且使2台一組接合頭可同時地於電路基板之同一部位安裝晶片零件C。根據該構成，能 夠以上述實施例之2倍之速度將晶片零件C安裝於電路基板。
(3)於上述實施例裝置中，亦可構成為如下：利用溫度檢測器36檢測接合頭21a、21b之溫度，且根據該檢測結果，調整氣體之供給量等，將冷卻時間保持為固定。
(4)於上述實施例裝置中，亦可如圖18所示，將電路基板上之安裝區域劃分為3個，將左右之區域分配為各接合頭21a、21b之安裝區域，且將中央之區域設為兩接合頭21a、21b可利用進行安裝的共用區域。
即，分配給各接合頭21a、21b之安裝區域中存在對不良電路圖案之部位標註不良標記而無法進行安裝的部位。可藉由將預定安裝於該不良電路圖案之晶片零件C安裝於共用區域，而將兩接合頭21a、21b之安裝數量保持均等。
(4)於上述實施例裝置，對1台保持台23進行配備之接合頭21a、21b並不限定於2台。即，只要為2台以上即可。

Claims (14)

  1. 一種安裝方法，其特徵在於：其係將晶片零件安裝於形成有複數個電路圖案之基板者，在藉由複數台接合頭而將晶片零件安裝於上述基板之過程中，包括如下過程：安裝過程，其先行將晶片零件安裝於上述基板之特定位置，且經特定時間將該晶片零件一面加熱一面進行正式壓接；及冷卻過程，其於藉由上述接合頭而將晶片零件安裝及正式壓接於基板之期間，將其他接合頭冷卻至特定溫度；重複地進行：若藉由先行之接合頭所進行之晶片零件之安裝結束，則藉由其他接合頭而將晶片零件安裝於基板之特定位置，且經特定時間將該晶片零件一面加熱一面使其正式壓接；辨識晶片零件之對準標記之辨識機構測定要進行晶片零件之吸附之附件工具、及吸附於上述附件工具之晶片零件之位置偏移量。
  2. 如請求項1之安裝方法，其中於上述安裝過程之期間，使辨識機構一面移動，一面辨識接著要進行晶片零件之安裝之安裝部位之基板上設置之對準標記，且求出對準座標。
  3. 如請求項1或2之安裝方法，其中於冷卻過程之接合頭，觀察上述附件工具的晶片零件吸附前之表面。
  4. 如請求項1或2之安裝方法，其中上述辨識機構進行上述附件工具的晶片零件吸附前之表面之觀察。
  5. 如請求項1或2之安裝方法，其中根據上述位置偏移量，修正晶片零件對於上述附件工具之吸附位置。
  6. 如請求項1或2之安裝方法，其中上述安裝過程係使保持基板之保持台移動而進行安裝位置之對準。
  7. 如請求項1或2之安裝方法，其中於1台保持台上隔開特定間隔成排配置複數塊上述基板，且在上述安裝過程中，將至少2台接合頭之組於互不相同之基板之同一部位安裝及正式壓接晶片零件，在冷卻過程中，將其他接合頭冷卻。
  8. 一種安裝裝置，其特徵在於：其係將晶片零件安裝於形成有複數個電路圖案之基板者，且具備：晶片零件供給部，其包括拾取晶片零件的拾取機構、及搬送自上述拾取機構交接來之晶片零件的晶片滑塊；晶片零件安裝部，其包括：保持上述基板之保持台、使上述保持台移動之驅動機構、將晶片零件安裝及正式壓接於上述保持台上之基板之特定位置之複數台接合頭、加熱上述接合頭之加熱器、及將上述接合頭冷卻的冷卻機構；且上述晶片滑塊係具有於上述拾取機構與上述接合頭之間往返移動之機能；上述晶片滑塊係具有以一台上述晶片滑塊將晶片零件交接給複數台上述接合頭之機能。
  9. 如請求項8之安裝裝置，其包括：控制部，其在先行將晶片零件安裝於上述基板之特定位置，經特定時間將該晶片零件一面加熱一面進行正式壓接的期間， 藉由冷卻機構而使其他接合頭冷卻。
  10. 如請求項8或9之安裝裝置，其包括辨識保持於上述接合頭之晶片零件之對準標記與設置於基板之對準標記的辨識機構，且上述控制部係在先行之接合頭將晶片零件安裝及正式壓接於基板之期間，使辨識機構進行掃描，辨識接著要進行晶片零件之安裝之基板之預定安裝部位上設置的對準標記，且求出對準座標。
  11. 如請求項8或9之安裝裝置，其中上述接合頭包括吸附晶片零件之附件工具，且包括觀察機構，上述控制部具備使用上述觀察機構，觀察未吸附晶片零件之狀態之上述附件工具之表面的功能。
  12. 如請求項8或9之安裝裝置，其中辨識晶片零件之對準標記之辨識機構亦具備觀察上述表面之功能。
  13. 如請求項8或9之安裝裝置，其中上述控制部具備如下功能：使用辨識晶片零件之對準標記之辨識機構，測定上述附件工具與吸附於上述附件工具之晶片零件之位置偏移量。
  14. 如請求項13之安裝裝置，其包括將晶片零件搬送且交接給上述附件工具的晶片零件交接機構，且上述控制部具備如下功能：根據上述位置偏移量，於晶片零件交接機構進行晶片零件之位置修正。
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