JP3868453B2 - 部品の実装方法 - Google Patents
部品の実装方法 Download PDFInfo
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- JP3868453B2 JP3868453B2 JP2005078798A JP2005078798A JP3868453B2 JP 3868453 B2 JP3868453 B2 JP 3868453B2 JP 2005078798 A JP2005078798 A JP 2005078798A JP 2005078798 A JP2005078798 A JP 2005078798A JP 3868453 B2 JP3868453 B2 JP 3868453B2
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/014—Solder alloys
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- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
これにより、部品の電気接合部と実装対象物の電気接合部との圧接状態で摩擦させ電気接合部どうしを溶融を伴い超音波接合するのと同時に、電気接合部どうしを圧接する際に部品および実装対象物の接合面の少なくとも一方の全域にその電気接続部を覆って予め供与されているままの封止材を互いの近づきによって圧迫し、特別な作業および時間なしに相互間の必要な範囲に強制的に一瞬に充満させられるので、電気接合部どうしの電気的な接合と、封止材を必要範囲に充満させること、を1つの作業のうちに短時間で達成することができるし、用いる封止材も流し込みの場合のような粘度の制限はなく高い粘度のものを用いて低い温度で前記作業とともに短時間に硬化させられるので、部品の実装が簡単な作業および装置で短時間に少ない熱消費で達成される。しかも、電気接合部どうしの電気的な接合は金属接合を伴うもので確実であり、接触不良による不良品の発生がなく歩留りが向上する。従って、製品コストの低減が図れる。
2 ダイシングシート
3 ベアICチップ
4 回路基板
3a、4a 接合面
5、6 電気接合部
7 電極
8 バンプ
9 導体ランド
10 溶接接合部
11 封止材
13 ぬれ広がり部
14、45 吸着ノズル
15 ボイスコイルモータ
21 部品供給部
22 実装対象物取り扱い手段
23 部品取り扱い手段
23a 反転手段
23b 接合手段
24 超音波振動手段
25 制御手段
25a 検出手段
26 プログラムデータ
33 ローダ部
35 ボンディングステージ
33a 予備加熱部
35a 本加熱部
37 エキスパンド台
61 封止材供与手段
62 ディスペンサ
70 メモリ
72 バーコード
73、74 認識カメラ
75 画像処理回路
Claims (6)
- 部品を金属部分の電気的な接合を伴って実装対象物に実装する部品の実装方法において、
部品あるいは実装対象物の一方または双方の接合面の全域にその電気接合部を覆って封止材を予め供与したままで、部品の電気接合部を実装対象物の電気接合部に圧接させるのに併せ、吸引した部品の電気接合部と吸引した実装対象物の電気接合部とを、部品および実装対象を相対移動させて摩擦させることにより、両電気接合部どうしを金属接合し、部品を実装対象物に実装することを特徴とする部品の実装方法。 - 部品を金属部分の電気的な接合を伴って実装対象物に実装する部品の実装方法において、部品あるいは実装対象物の一方または双方の接合面の全域にその電気接合部を覆って封止材を予め供与したままで、部品の電気接合部を実装対象物の電気接合部に圧接させるのに併せ、部品の電気接合部と実装対象物の電気接合部とを、部品に超音波振動を与えて摩擦させることにより、両電気接合部どうしを金属接合し、部品を実装対象物に実装することを特徴とする部品の実装方法。
- 封止材は、前記金属接合と並行した加熱により硬化させる請求項1、2のいずれか一項に記載の部品の実装方法。
- 封止材は、ディスペンサで塗布して供与する請求項1〜3のいずれか一項に記載の部品の実装方法。
- 封止材は、印刷によって供与する請求項1〜3のいずれか一項に記載の部品の実装方法。
- 封止材は、転写によって供与する請求項1〜3のいずれか一項に記載の部品の実装方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005078798A JP3868453B2 (ja) | 2005-03-18 | 2005-03-18 | 部品の実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005078798A JP3868453B2 (ja) | 2005-03-18 | 2005-03-18 | 部品の実装方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10233875A Division JP2000068327A (ja) | 1998-08-20 | 1998-08-20 | 部品の実装方法と装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005198612A Division JP4268155B2 (ja) | 2005-07-07 | 2005-07-07 | 部品の実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005217435A JP2005217435A (ja) | 2005-08-11 |
JP3868453B2 true JP3868453B2 (ja) | 2007-01-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005078798A Expired - Fee Related JP3868453B2 (ja) | 2005-03-18 | 2005-03-18 | 部品の実装方法 |
Country Status (1)
Country | Link |
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JP (1) | JP3868453B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5089966B2 (ja) * | 2006-11-29 | 2012-12-05 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法および装置 |
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2005
- 2005-03-18 JP JP2005078798A patent/JP3868453B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005217435A (ja) | 2005-08-11 |
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