JP6518709B2 - 実装装置 - Google Patents
実装装置 Download PDFInfo
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- JP6518709B2 JP6518709B2 JP2017052153A JP2017052153A JP6518709B2 JP 6518709 B2 JP6518709 B2 JP 6518709B2 JP 2017052153 A JP2017052153 A JP 2017052153A JP 2017052153 A JP2017052153 A JP 2017052153A JP 6518709 B2 JP6518709 B2 JP 6518709B2
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- 238000000034 method Methods 0.000 claims description 26
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- 238000012546 transfer Methods 0.000 description 3
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- 230000007423 decrease Effects 0.000 description 2
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- 238000004891 communication Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
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- 238000009751 slip forming Methods 0.000 description 1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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Description
基板にチップ部品を実装する実装装置であって、
前記基板を保持する保持ステージと、
前記チップ部品をピックアップするピックアップ機構と、前記ピックアップ機構から受け渡されたチップ部品を搬送するチップスライダを有したチップ部品供給部と、前記保持ステージ上に配置され、前記チップスライダから受け渡された前記チップ部品を前記基板に加熱圧着するボンディングヘッドと、を備え、
前記チップスライダは、レールと、前記レールにスライド移動可能に支持された可動台と、前記可動台に設けられ前記チップ部品を吸着保持する吸着部とを構成要素とし、前記吸着部を、前記ピックアップ機構と冷却処理中の前記ボンディングヘッドの間で往復移動させる機能を有し、前記ピックアップ機構1台に対し、前記ボンディングヘッドを複数台有する実装装置である。
請求項2に記載の発明は、請求項1に記載の実装装置であって、
前記チップスライダ1台が、前記ピックアップ機構と複数台の前記ボンディングヘッドの間で、前記可動台を往復移動させる機能を有する実装装置である。
前記チップスライダが1回に搬送するチップ部品は1個である実装装置である。
チップ部品のアライメントマークを認識する認識機構を備え、
前記チップスライダが前記ボンディングヘッドにチップ部品を受け渡す位置において、前記認識機構が前記ボンディングヘッドの下部に進退可能に動作する実装装置である。
搬送されてくる。
この段階において、画像認識手段を用いて、ボンディングヘッド21aのアタッチメントツール35表面状態を観察して、樹脂等の付着やキズの有無を判断する機能を制御手段3に付加してもよく、画像認識手段として2視野カメラ22を用いても良い。その際、付着物やキズが許容範囲以内と判断したら次のステップに移行する。
2 … チップ部品実装部
3 … 制御部
21a… ボンディングヘッド
21b… ボンディングヘッド
22 … 2視野カメラ
30 … 本体
31 … ホルダ
32 … ヒータベース
33 … 断熱ブロック
34 … セラミックヒータ
35 … アタッチメントツール
36 … 温度検出器
37 … 流路
39 … エアー供給源
C … チップ部品
Claims (4)
- 基板にチップ部品を実装する実装装置であって、
前記基板を保持する保持ステージと、
前記チップ部品をピックアップするピックアップ機構と、
前記ピックアップ機構から受け渡されたチップ部品を搬送するチップスライダを有したチップ部品供給部と、
前記保持ステージ上に配置され、前記チップスライダから受け渡された前記チップ部品を前記基板に加熱圧着するボンディングヘッドと、を備え、
前記チップスライダは、レールと、前記レールにスライド移動可能に支持された可動台と、前記可動台に設けられ前記チップ部品を吸着保持する吸着部とを構成要素とし、前記吸着部を、前記ピックアップ機構と冷却処理中の前記ボンディングヘッドの間で往復移動させる機能を有し、
前記ピックアップ機構1台に対し、前記ボンディングヘッドを複数台有する実装装置。 - 請求項1に記載の実装装置であって、
前記チップスライダ1台が、前記ピックアップ機構と複数台の前記ボンディングヘッドの間で、前記可動台を往復移動させる機能を有する実装装置。 - 請求項1または請求項2に記載の実装装置であって、
前記チップスライダが1回に搬送するチップ部品は1個である実装装置。 - 請求項1から請求項3のいずれかに記載の実装装置であって、
チップ部品のアライメントマークを認識する認識機構を備え、
前記チップスライダが前記ボンディングヘッドにチップ部品を受け渡す位置において、前記認識機構が前記ボンディングヘッドの下部に進退可能に動作する実装装置。
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JP2017183616A (ja) * | 2016-03-31 | 2017-10-05 | 東レエンジニアリング株式会社 | ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法 |
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JP6781677B2 (ja) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 |
WO2020022345A1 (ja) * | 2018-07-24 | 2020-01-30 | 株式会社新川 | 電子部品実装装置 |
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