JP2018120200A - レチクルポッド - Google Patents
レチクルポッド Download PDFInfo
- Publication number
- JP2018120200A JP2018120200A JP2017095237A JP2017095237A JP2018120200A JP 2018120200 A JP2018120200 A JP 2018120200A JP 2017095237 A JP2017095237 A JP 2017095237A JP 2017095237 A JP2017095237 A JP 2017095237A JP 2018120200 A JP2018120200 A JP 2018120200A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- reticle pod
- base
- case body
- deformable member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 230000009466 transformation Effects 0.000 abstract 2
- 239000010419 fine particle Substances 0.000 description 13
- 239000000428 dust Substances 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 8
- 230000003749 cleanliness Effects 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 102100033121 Transcription factor 21 Human genes 0.000 description 1
- 101710119687 Transcription factor 21 Proteins 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
1 ベース
11 上面コーナー
2 上部カバー
3 位置決め装置
31 変形部材
32 当接部材
33 弾性部材
34 ハウジング
341 第1開口
342 第2開口
4 レチクル
5 支持装置
51 ケース体
511 カバー
512 本体
5121 第2凹溝
513 開口
514 ホコリ排出通路
515 濾過膜
52 支持部材
521 突出部
522 本体部
5221 第1凹溝
523 スペーサ
53 移動部材
531 第1磁性部材
532 第2磁性部材
6 固定部材
Claims (11)
- レチクルを収容するレチクルポッドであり、
4つの上面コーナーを有するベースと、
前記ベースと結合する上部カバーと、
前記ベースの少なくとも1つの前記上面コーナーに設置される位置決め装置と、を備え、
前記位置決め装置は、
変形部材と、
前記変形部材の上方に設置される当接部材と、を備え
前記レチクルが前記レチクルポッドに保管されて前記上部カバーと前記ベースが結合した場合、前記上部カバーは前記当接部材に接触するとともに下方への圧力を与えることによって、前記当接部材は垂直方向に前記変形部材を圧縮させ、前記変形部材は横方向に拡張変形して前記レチクルに接触することを特徴とするレチクルポッド。 - 前記変形部材が圧力を受けた場合、前記変形部材の前記横方向における伸長変形量は0.1mm〜3.0mmであることを特徴とする請求項1記載のレチクルポッド。
- 前記変形部材のショア硬さはA20〜A70であることを特徴とする請求項1記載のレチクルポッド。
- 前記変形部材は中空構造を有することを特徴とする請求項1記載のレチクルポッド。
- 前記位置決め装置は、前記変形部材の中空構造に設置される弾性部材を備え、
前記レチクルが前記レチクルポッドに保管されて前記上部カバーと前記ベースが結合した場合、前記上部カバーから下方への圧力によって、前記弾性部材は圧縮され、
前記上部カバーが外された場合、前記変形部材が復元するように、前記弾性部材は上方への弾性力を与えることを特徴とする請求項4記載のレチクルポッド。 - 前記変形部材はシリコーン材料からなることを特徴とする請求項1記載のレチクルポッド。
- 前記位置決め装置はハウジングを備え、
前記ハウジングは、前記レチクルに向かう第1開口と、前記ハウジングの上方に設けられる第2開口と、を備え、
前記ハウジングは上方から前記変形部材の一部を覆い、前記当接部材の一部は前記ハウジングの第2開口を通して前記ハウジングから突出することを特徴とする請求項1記載のレチクルポッド。 - 前記レチクルポッドは支持装置を備え、前記支持装置は前記ベースに設置され、その一部は前記ベースから突出し、
前記レチクルが前記レチクルポッドに保管された場合、前記支持装置は突出部で前記レチクルに当接することを特徴とする請求項1記載のレチクルポッド。 - 前記支持装置は、
開口を有するケース体と、
前記ケース体に設置される前記突出部と本体部を有し、前記突出部の一部が前記開口を通して前記ケース体から突出する支持部材と、
前記ケース体と前記本体部との間に設置される複数の移動部材と、を備え、
前記支持部材は前記移動部材で前記ケース体に対して横方向に移動可能であることを特徴とする請求項8記載のレチクルポッド。 - 前記支持部材はプラスチック材料からなることを特徴とする請求項9記載のレチクルポッド。
- 前記移動部材は、ボール、円柱体、ローラーまたは液体であることを特徴とする請求項9記載のレチクルポッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762450871P | 2017-01-26 | 2017-01-26 | |
US62/450,871 | 2017-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6286090B1 JP6286090B1 (ja) | 2018-02-28 |
JP2018120200A true JP2018120200A (ja) | 2018-08-02 |
Family
ID=61282773
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017095237A Active JP6286090B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
JP2017095238A Active JP6342036B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017095238A Active JP6342036B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
Country Status (4)
Country | Link |
---|---|
US (2) | US10281815B2 (ja) |
JP (2) | JP6286090B1 (ja) |
KR (2) | KR102045631B1 (ja) |
TW (2) | TWI623810B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021064776A (ja) * | 2019-10-16 | 2021-04-22 | 家登精密工業股▲ふん▼有限公司 | レチクル保持システム及び保持システム |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10670976B2 (en) * | 2017-01-25 | 2020-06-02 | Gudeng Precision Industrial Co., Ltd | EUV reticle pod |
CN108919603B (zh) * | 2018-09-07 | 2024-08-13 | 无锡中微掩模电子有限公司 | 一种集成电路掩模版用新型多片盒 |
TWI680086B (zh) * | 2019-02-25 | 2019-12-21 | 家登精密工業股份有限公司 | 光罩盒及其固持件 |
TWD209426S (zh) | 2019-08-02 | 2021-01-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
TWD209928S (zh) | 2019-08-02 | 2021-02-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
TW202134774A (zh) * | 2019-12-05 | 2021-09-16 | 美商應用材料股份有限公司 | 光標處理系統 |
US20230038768A1 (en) * | 2019-12-31 | 2023-02-09 | Entegris, Inc. | Reticle pod having retention through reticle compartment wall |
JP7176165B2 (ja) * | 2020-04-24 | 2022-11-22 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
TWI760062B (zh) * | 2020-05-14 | 2022-04-01 | 家登精密工業股份有限公司 | 提供有保持銷組件之光罩盒及固持光罩的方法 |
US11703754B2 (en) * | 2020-05-14 | 2023-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Particle prevention method in reticle pod |
US20210356858A1 (en) * | 2020-05-14 | 2021-11-18 | Gudeng Precision Industrial Co., Ltd. | Container for accommodating substrate with effective hermetic sealing |
KR102171068B1 (ko) * | 2020-07-07 | 2020-10-29 | 엔엠시스코(주) | 새도 마스크의 표면 이물질 제거장치 |
TWI769514B (zh) * | 2020-09-01 | 2022-07-01 | 家登精密工業股份有限公司 | 光罩盒潔淨設備 |
US12087605B2 (en) * | 2020-09-30 | 2024-09-10 | Gudeng Precision Industrial Co., Ltd. | Reticle pod with antistatic capability |
US11822257B2 (en) * | 2021-03-12 | 2023-11-21 | Gudeng Precision Industrial Co., Ltd. | Reticle storage pod and method for securing reticle |
US20220357650A1 (en) * | 2021-05-07 | 2022-11-10 | Entegris, Inc. | Metal plating with lubricant |
US20230194978A1 (en) * | 2021-12-21 | 2023-06-22 | Entegris, Inc. | Reticle pod inner pod having dissimilar material at contact surface interfaces |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284334U (ja) * | 1988-12-20 | 1990-06-29 | ||
JP2003222992A (ja) * | 2002-01-31 | 2003-08-08 | Arakawa Jushi:Kk | マスクケース |
JP2003257852A (ja) * | 2002-02-22 | 2003-09-12 | Asml Netherlands Bv | レチクルを保護する2部分カバーを用いるシステムおよび方法 |
CN1697586A (zh) * | 2004-05-11 | 2005-11-16 | 家登精密工业股份有限公司 | 光罩传送盒的防静电装置 |
JP3120494U (ja) * | 2006-01-16 | 2006-04-06 | 家登精密工業股▲ふん▼有限公司 | レチクルポッドの保持構造 |
JP2006146079A (ja) * | 2004-11-24 | 2006-06-08 | Miraial Kk | レチクル搬送容器 |
US20080041760A1 (en) * | 2006-08-17 | 2008-02-21 | Microtome Precision, Inc. | High cleanliness article transport system |
US20100294688A1 (en) * | 2009-05-19 | 2010-11-25 | Ming-Chien Chiu | Photomask case structure |
JP2011166065A (ja) * | 2010-02-15 | 2011-08-25 | Gugeng Precision Industrial Co Ltd | レチクルポッド |
JP2013011723A (ja) * | 2011-06-29 | 2013-01-17 | Arakawa Jushi:Kk | マスクケースのマスク係止具 |
JP3181255U (ja) * | 2011-11-17 | 2013-01-31 | 家登精密工業股▲ふん▼有限公司 | 排水構造を具えたポッド |
JP2014191351A (ja) * | 2013-03-26 | 2014-10-06 | Gugeng Precision Industrial Co Ltd | 気体ガイド装置を具えたフォトマスク収納容器 |
CN104231542A (zh) * | 2013-06-14 | 2014-12-24 | 家登精密工业股份有限公司 | 用于晶圆/光罩载具的塑料组合物及应用其的光罩传送盒 |
JP2016500844A (ja) * | 2012-10-19 | 2016-01-14 | インテグリス・インコーポレーテッド | ベース板にカバーの位置を合わせる機構を備えたレチクルポッド |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60134179D1 (de) * | 2000-07-10 | 2008-07-03 | Entegris Inc | Smif-behälter mit elektrostatische ladungen ableitender stützkonstruktion für retikül |
US20030213716A1 (en) * | 2002-05-17 | 2003-11-20 | Brian Cleaver | Wafer shipping and storage container |
US6825916B2 (en) | 2002-07-05 | 2004-11-30 | Entegris, Inc. | Reticle carrier with positioning cover |
TWI224719B (en) * | 2003-05-28 | 2004-12-01 | Gudeng Prec Ind Co Ltd | Reinforced structure device of mask frame |
US7607543B2 (en) * | 2005-02-27 | 2009-10-27 | Entegris, Inc. | Reticle pod with isolation system |
TWI370093B (en) | 2005-02-27 | 2012-08-11 | Entegris Inc | Reticle pod with isolation system |
JP4373359B2 (ja) * | 2005-04-19 | 2009-11-25 | クリーンサアフェイス技術株式会社 | 基板ケース |
TWI391304B (zh) * | 2005-09-27 | 2013-04-01 | Entegris Inc | 光罩盒 |
KR20070037822A (ko) * | 2005-10-04 | 2007-04-09 | 삼성전자주식회사 | 레티클 위치 제어 유닛 및 이를 포함하는 노광 장치 |
TWM295333U (en) * | 2005-10-18 | 2006-08-01 | Gudeng Prec Ind Co Ltd | Positioning structure of mask box |
JP5122484B2 (ja) * | 2006-02-03 | 2013-01-16 | インテグリス・インコーポレーテッド | 衝撃吸収基板容器及びその形成方法 |
JP2008265761A (ja) * | 2007-04-16 | 2008-11-06 | Miraial Kk | レチクルケース |
TW200845116A (en) * | 2007-05-03 | 2008-11-16 | E Sun Prec Ind Co Ltd | Mask box |
TWM335007U (en) | 2007-12-27 | 2008-06-21 | Gudeng Prec Ind Co Ltd | Photomask pod and supporter thereof |
CN101494185A (zh) * | 2008-01-24 | 2009-07-29 | 中芯国际集成电路制造(上海)有限公司 | 光罩盒 |
TWI344926B (en) * | 2008-12-05 | 2011-07-11 | Gudeng Prec Industral Co Ltd | Reticle pod |
TWI411563B (zh) | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
TWI378887B (en) * | 2009-12-29 | 2012-12-11 | Gudeng Prec Industral Co Ltd | Reticle pod and supporting components therebetween |
TWI389828B (zh) * | 2010-07-21 | 2013-03-21 | Gudeng Prec Industral Co Ltd | 具有感測器之光罩盒 |
TWI414464B (zh) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | 具有固定結構之極紫外光光罩儲存傳送盒 |
TWM409519U (en) | 2011-02-09 | 2011-08-11 | Chung King Entpr Co Ltd | Positioning structure of mask box |
JP5823040B2 (ja) * | 2011-07-22 | 2015-11-25 | エーエスエムエル ホールディング エヌ.ブイ. | リソグラフィ装置及びデバイス製造方法 |
JP5959302B2 (ja) | 2012-05-16 | 2016-08-02 | 信越ポリマー株式会社 | 基板収納容器 |
WO2013186929A1 (ja) * | 2012-06-15 | 2013-12-19 | 株式会社ニコン | マスク保護装置、露光装置、及びデバイス製造方法 |
CN202956584U (zh) * | 2012-12-07 | 2013-05-29 | 中芯国际集成电路制造(北京)有限公司 | 光罩定位结构及光罩盒 |
JP2015081947A (ja) | 2013-10-21 | 2015-04-27 | レーザーテック株式会社 | レチクル収納容器及びデュアルポッド |
-
2017
- 2017-03-14 TW TW106108386A patent/TWI623810B/zh active
- 2017-03-14 TW TW106108400A patent/TWI634383B/zh active
- 2017-05-12 JP JP2017095237A patent/JP6286090B1/ja active Active
- 2017-05-12 JP JP2017095238A patent/JP6342036B1/ja active Active
- 2017-07-17 US US15/651,399 patent/US10281815B2/en active Active
- 2017-07-17 US US15/651,312 patent/US9958772B1/en active Active
- 2017-11-29 KR KR1020170161626A patent/KR102045631B1/ko active IP Right Grant
- 2017-11-29 KR KR1020170161633A patent/KR102061946B1/ko active IP Right Grant
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284334U (ja) * | 1988-12-20 | 1990-06-29 | ||
JP2003222992A (ja) * | 2002-01-31 | 2003-08-08 | Arakawa Jushi:Kk | マスクケース |
JP2003257852A (ja) * | 2002-02-22 | 2003-09-12 | Asml Netherlands Bv | レチクルを保護する2部分カバーを用いるシステムおよび方法 |
CN1697586A (zh) * | 2004-05-11 | 2005-11-16 | 家登精密工业股份有限公司 | 光罩传送盒的防静电装置 |
JP2006146079A (ja) * | 2004-11-24 | 2006-06-08 | Miraial Kk | レチクル搬送容器 |
JP3120494U (ja) * | 2006-01-16 | 2006-04-06 | 家登精密工業股▲ふん▼有限公司 | レチクルポッドの保持構造 |
US20080041760A1 (en) * | 2006-08-17 | 2008-02-21 | Microtome Precision, Inc. | High cleanliness article transport system |
US20100294688A1 (en) * | 2009-05-19 | 2010-11-25 | Ming-Chien Chiu | Photomask case structure |
JP2011166065A (ja) * | 2010-02-15 | 2011-08-25 | Gugeng Precision Industrial Co Ltd | レチクルポッド |
JP2013011723A (ja) * | 2011-06-29 | 2013-01-17 | Arakawa Jushi:Kk | マスクケースのマスク係止具 |
JP3181255U (ja) * | 2011-11-17 | 2013-01-31 | 家登精密工業股▲ふん▼有限公司 | 排水構造を具えたポッド |
JP2016500844A (ja) * | 2012-10-19 | 2016-01-14 | インテグリス・インコーポレーテッド | ベース板にカバーの位置を合わせる機構を備えたレチクルポッド |
JP2014191351A (ja) * | 2013-03-26 | 2014-10-06 | Gugeng Precision Industrial Co Ltd | 気体ガイド装置を具えたフォトマスク収納容器 |
CN104231542A (zh) * | 2013-06-14 | 2014-12-24 | 家登精密工业股份有限公司 | 用于晶圆/光罩载具的塑料组合物及应用其的光罩传送盒 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021064776A (ja) * | 2019-10-16 | 2021-04-22 | 家登精密工業股▲ふん▼有限公司 | レチクル保持システム及び保持システム |
JP7059491B2 (ja) | 2019-10-16 | 2022-04-26 | 家登精密工業股▲ふん▼有限公司 | レチクル保持システム及び保持システム |
US11442370B2 (en) | 2019-10-16 | 2022-09-13 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
Also Published As
Publication number | Publication date |
---|---|
JP2018120201A (ja) | 2018-08-02 |
US10281815B2 (en) | 2019-05-07 |
JP6286090B1 (ja) | 2018-02-28 |
KR102045631B1 (ko) | 2019-11-15 |
KR20180088268A (ko) | 2018-08-03 |
TWI634383B (zh) | 2018-09-01 |
TW201827919A (zh) | 2018-08-01 |
US9958772B1 (en) | 2018-05-01 |
JP6342036B1 (ja) | 2018-06-13 |
US20180210334A1 (en) | 2018-07-26 |
KR20180088269A (ko) | 2018-08-03 |
TW201827918A (zh) | 2018-08-01 |
KR102061946B1 (ko) | 2020-01-02 |
TWI623810B (zh) | 2018-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6286090B1 (ja) | レチクルポッド | |
KR102214147B1 (ko) | 레티클이 측면 격납되는 레티클 포드 | |
US11442370B2 (en) | Reticle retaining system | |
CN101166681B (zh) | 带隔离系统的光罩盒 | |
US8528738B2 (en) | Reusable resilient cushion for wafer container | |
US20060081635A1 (en) | Storage container | |
JP6427674B2 (ja) | 基板格納用の一体型コーナースプリングを備える水平基板コンテナ | |
US20170365496A1 (en) | Wafer container wiht shock condition protection | |
KR102398973B1 (ko) | 투명 창 조립체를 갖는 레티클의 보유 및 운송을 위한 컨테이너 | |
TW200301949A (en) | Wafer enclosure sealing arrangement for wafer containers | |
KR102677319B1 (ko) | 기판 수납 용기 | |
CN215599482U (zh) | 相机模块 | |
JPWO2016084882A1 (ja) | リングスペーサー | |
US11314175B2 (en) | Reticle pod having positioning member | |
JP2016149492A (ja) | 基板収納容器 | |
JP2004311779A (ja) | 半導体ウェーハ収納容器及び半導体ウェーハの搬送方法 | |
TWI652211B (zh) | Substrate storage container and holding member | |
JP2016189373A (ja) | 基板収納容器 | |
JP2007153414A (ja) | リテーナ及び基板収納容器 | |
KR200159982Y1 (ko) | 매스크 보관케이스의 매스크 유동억제구조 | |
JP2006160347A (ja) | 光学素子用梱包ケース | |
KR20040063355A (ko) | 레티클 케이스 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180116 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180202 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6286090 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |