JP6342036B1 - レチクルポッド - Google Patents
レチクルポッド Download PDFInfo
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- JP6342036B1 JP6342036B1 JP2017095238A JP2017095238A JP6342036B1 JP 6342036 B1 JP6342036 B1 JP 6342036B1 JP 2017095238 A JP2017095238 A JP 2017095238A JP 2017095238 A JP2017095238 A JP 2017095238A JP 6342036 B1 JP6342036 B1 JP 6342036B1
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- reticle
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- reticle pod
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- 230000003068 static effect Effects 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 13
- -1 polyethylene Polymers 0.000 claims description 12
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 10
- 229920002530 polyetherether ketone Polymers 0.000 claims description 10
- 229920002312 polyamide-imide Polymers 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 7
- 229920002292 Nylon 6 Polymers 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- 239000004962 Polyamide-imide Substances 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 6
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920006324 polyoxymethylene Polymers 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 4
- 239000004640 Melamine resin Substances 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 3
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000010687 lubricating oil Substances 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 239000010419 fine particle Substances 0.000 abstract description 13
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000003749 cleanliness Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
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- 239000007779 soft material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
1 ベース
11 上面コーナー
2 上部カバー
3 支持装置
31 ケース体
311 カバー
312 本体
3121 第2凹溝
313 開口
314 ホコリ排出通路
315 濾過膜
316 シーリング部材
32 支持部材
321 突出部
322 本体部
3211 接触部材
3221 第1凹溝
323 スペーサ
33 移動部材
331 第1磁性部材
332 第2磁性部材
333 液体
4 レチクル
5 位置決め装置
51 変形部材
52 当接部材
53 弾性部材
54 ハウジング
541 第1開口
542 第2開口
6 固定部材
Claims (20)
- レチクルを収容するレチクルポッドであり、
ベースと、
前記ベースと結合する上部カバーと、
前記ベース上に設置された少なくとも1つの支持装置と、を備え、
前記支持装置は、
開口を有するケース体と、
前記ケース体に設置される突出部と本体部を有し、前記突出部の一部が前記開口を通して前記ケース体から突出する支持部材と、
前記ケース体と前記本体部との間に設置される複数の移動部材と、を備え、
前記支持部材は、前記移動部材で前記ケース体に対して横方向に移動可能であり、
前記レチクルが前記レチクルポッドに保管された場合、前記支持装置は前記突出部で前記レチクルに当接し、
前記レチクルと前記突出部との最大静止摩擦力は、常に前記レチクルの前記突出部に対する水平方向における力より大きいことを特徴とするレチクルポッド。 - 前記突出部と前記レチクルの摩擦係数μは0.5〜6であることを特徴とする請求項1記載のレチクルポッド。
- 前記突出部の中心線平均粗さRaは8〜25μmであることを特徴とする請求項1記載のレチクルポッド。
- 前記突出部と前記レチクルとの間の摩擦により、ズレが生じないことを特徴とする請求項1記載のレチクルポッド。
- 前記支持部材はプラスチック材料からなり、前記プラスチック材料は、ポリ塩化ビニル(PVC)、ポリメタクリル酸メチル樹脂(PMMA)、ポリスチレン(PS)、ポリアミド(PA)、ポリエチレン(PE)、ポリテトラフルオロエチレン(PTFE)、ポリプロピレン(PP)、アクリロニトリル−ブタジエン−スチレン共重合体(ABS)、フェノール樹脂(PF)、ユリア樹脂(UF)、メラミン樹脂(MF)、不飽和ポリエステル樹脂(UP)、エポキシ樹脂(EP)、ポリウレタン(PU)、ポリカーボネート(PC)、ポリブチレンテレフタレート(PBT)、ナイロン66(PA−66)、ナイロン6(PA−6)、ポリアセタール(POM)、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリアミドイミド(PEI)、ポリエーテルイミド(PAI)、ポリイミド(PI)、およびその混合物からなる群より選ばれることを特徴とする請求項1記載のレチクルポッド。
- 前記支持部材はポリエーテルエーテルケトン(PEEK)からなることを特徴とする請求項5記載のレチクルポッド。
- 前記支持部材は接触部材を備え、前記接触部材は、前記突出部の先端に設置され、前記レチクルに接触し、前記接触部材と前記レチクルとの摩擦係数μは0.5〜6であり、前記接触部材の中心線平均粗さRaは8〜25μmであることを特徴とする請求項1記載のレチクルポッド。
- 前記接触部材はシリコーンからなることを特徴とする請求項7記載のレチクルポッド。
- 前記レチクルが前記レチクルポッドに保管された場合、前記レチクルと前記ベースは接触せず、0.05〜0.3mmの間隔で離れていることを特徴とする請求項1記載のレチクルポッド。
- 前記レチクルと前記ベースの間隔は0.1mmであることを特徴とする請求項6記載のレチクルポッド。
- 各前記移動部材はそれぞれボールであり、前記ケース体または前記支持部材の前記本体部には、各前記ボールに対応する位置に前記ボールが嵌まるためのボール溝が設けられることを特徴とする請求項1記載のレチクルポッド。
- 前記移動部材は円柱体であり、前記ケース体または前記支持部材の前記本体部には、各前記円柱体に対応する位置に前記円柱体が嵌まるための円柱溝が設けられることを特徴とする請求項1記載のレチクルポッド。
- 前記移動部材はローラーであり、前記ローラーは、前記ケース体または前記本体部に設置され、且つ前記ケース体と前記支持部材の間に備えられていることを特徴とする請求項1記載のレチクルポッド。
- 前記ケース体は複数のホコリ排出通路を有し、前記ホコリ排出通路は前記ケース体の底面を貫通することを特徴とする請求項11〜13のいずれか一項に記載のレチクルポッド。
- 前記レチクルポッドは濾過膜を備え、前記濾過膜は、前記ケース体の底面に設置され、下方から前記ホコリ排出通路を覆うことを特徴とする請求項9記載のレチクルポッド。
- 前記移動部材は液体であり、前記液体は前記ケース体に収容され、前記レチクルポッドは、前記液体が前記開口からこぼれないように、前記ケース体の前記開口に設置されたシーリング部材を備えることを特徴とする請求項1記載のレチクルポッド。
- 前記液体は、油圧作動油、潤滑油、水銀、およびその混合物からなる群より選ばれることを特徴とする請求項16記載のレチクルポッド。
- 前記移動部材は、互いに対向する第1磁性部材と第2磁性部材からなり、各前記移動部材の前記第1磁性部材と前記第2磁性部材は、磁力の作用で互いに引き合い、或いは反発しあうことによって、前記本体部と前記ケース体を離間させることを特徴とする請求項1記載のレチクルポッド。
- 前記支持部材は少なくとも1つのスペーサを備え、前記スペーサは、前記本体部の側面に形成され、前記本体部と前記ケース体を離間させるように、前記ケース体に接触することを特徴とする請求項1記載のレチクルポッド。
- 前記スペーサは弾性材料からなることを特徴とする請求項19記載のレチクルポッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762450871P | 2017-01-26 | 2017-01-26 | |
US62/450,871 | 2017-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6342036B1 true JP6342036B1 (ja) | 2018-06-13 |
JP2018120201A JP2018120201A (ja) | 2018-08-02 |
Family
ID=61282773
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017095237A Active JP6286090B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
JP2017095238A Active JP6342036B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017095237A Active JP6286090B1 (ja) | 2017-01-26 | 2017-05-12 | レチクルポッド |
Country Status (4)
Country | Link |
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US (2) | US10281815B2 (ja) |
JP (2) | JP6286090B1 (ja) |
KR (2) | KR102061946B1 (ja) |
TW (2) | TWI623810B (ja) |
Families Citing this family (17)
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---|---|---|---|---|
US10670976B2 (en) * | 2017-01-25 | 2020-06-02 | Gudeng Precision Industrial Co., Ltd | EUV reticle pod |
CN108919603A (zh) * | 2018-09-07 | 2018-11-30 | 无锡中微掩模电子有限公司 | 一种集成电路掩模版用新型多片盒 |
TWI680086B (zh) * | 2019-02-25 | 2019-12-21 | 家登精密工業股份有限公司 | 光罩盒及其固持件 |
TWD209928S (zh) | 2019-08-02 | 2021-02-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
TWD209426S (zh) | 2019-08-02 | 2021-01-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
US11442370B2 (en) * | 2019-10-16 | 2022-09-13 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
TW202134774A (zh) * | 2019-12-05 | 2021-09-16 | 美商應用材料股份有限公司 | 光標處理系統 |
JP7475454B2 (ja) | 2019-12-31 | 2024-04-26 | インテグリス・インコーポレーテッド | レチクル仕切壁を通る保持を有するレチクルポッド |
JP7176165B2 (ja) * | 2020-04-24 | 2022-11-22 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
US20210358787A1 (en) * | 2020-05-14 | 2021-11-18 | Gudeng Precision Industrial Co., Ltd. | Reticle pod provided with holding pins and method for holding reticle |
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US10281815B2 (en) | 2019-05-07 |
TWI623810B (zh) | 2018-05-11 |
JP6286090B1 (ja) | 2018-02-28 |
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US9958772B1 (en) | 2018-05-01 |
TWI634383B (zh) | 2018-09-01 |
TW201827918A (zh) | 2018-08-01 |
JP2018120201A (ja) | 2018-08-02 |
KR102045631B1 (ko) | 2019-11-15 |
TW201827919A (zh) | 2018-08-01 |
KR20180088268A (ko) | 2018-08-03 |
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US20180210334A1 (en) | 2018-07-26 |
KR102061946B1 (ko) | 2020-01-02 |
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