JP2008531416A - 絶縁システムを備えるレチクルポッド - Google Patents
絶縁システムを備えるレチクルポッド Download PDFInfo
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- JP2008531416A JP2008531416A JP2007557250A JP2007557250A JP2008531416A JP 2008531416 A JP2008531416 A JP 2008531416A JP 2007557250 A JP2007557250 A JP 2007557250A JP 2007557250 A JP2007557250 A JP 2007557250A JP 2008531416 A JP2008531416 A JP 2008531416A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
レチクルに対する衝撃および振動を高度に絶縁することが、本発明の好適な実施例の特徴および利点である。
レチクルを二重に収納することが、本発明の好適な実施例の特徴および利点であり、出荷装置および加工設備内(特に中間加工工程において)でレチクルを保管するための装置の両方にこのようなポッドを使用することは特に有利である。
Claims (20)
- 基板を支持して衝撃および振動を絶縁する装置であって、
凹状内面により形成されたカバーおよび基部を備える第1のポッドと、該カバーは、該基部と着脱可能に係合して、該凹状内面と基部との間に第1の密閉されたエンクロージャを形成することと、該基部はラッチ機構を備える内部を有することと、
下部および上部を含む第2のポッドと、該上部は該下部と係合して、該基部を収納するための第2のエンクロージャを形成することと、該下部は基板を保持するための支持構造を含むことと、該上部は、該下部と係合すると該基板を保持するための保持構造を含むことと、
該第1のポッドと第2のポッドとの間に延び、かつ、該第1のポッドに対して該第2のポッドの第1の位置を規定する少なくとも1つの弾性連結部とを備え、該第2のポッドは衝撃または振動により該第1の位置から復帰可能に移動できることと、該弾性連結部は、該第1のポッドに対して該第2のポッドに多自由度の運動性を付与することとを特徴とする装置。 - 前記弾性連結部は、前記第2のポッドが前記第1の位置から変位する際に6度の運動の自由度を付与する請求項1に記載の装置。
- 前記第1のポッドと第2のポッドとの間に延びる複数の弾性連結部をさらに備える請求項1に記載の装置。
- 前記第2のポッドは4つの隅部を有し、前記複数の弾性連結部は、該4つの隅部の各々において、前記第2のポッドと第1のポッドとの間において鉛直に延びる請求項3に記載の装置。
- 前記弾性連結部の各々は、第1端部および第2端部を有し、かつ、該端部の各々において開口部を有することと、該弾性連結部の各々は、前記第1のポッドおよび第2のポッドから延びる複数の突起により、これらのポッドと結合することと、該突起は該端部において開口部に受容されることとを特徴とする請求項4に記載の装置。
- 前記第2のポッドの下部は、4つの隅部を備えるほぼ正方形状をなし、かつ、該隅部の間に延びる4つの側面を有することと、該側面の各々は、レチクルが該下部において支持される場合に、該レチクルに対して凹状をなすアーチ形状を有することとを特徴とする請求項1に記載の装置。
- 前記第2のポッドの下部は上面および下面を有し、該下部は、4つの隅部を備えるほぼ正方形状をなし、該隅部の各々は対向する隅部に向かって内方に延びる、下面に形成されたガセットを有することとを特徴とする請求項1に記載の装置。
- 前記第2のポッドの下部は上面および下面を有し、該下部は、4つの隅部を備えるほぼ正方形状をなし、該隅部の各々は対向する隅部に向かって内方に延びる、下面に形成されたガセットを有することとを特徴とする請求項6に記載の装置。
- 前記第2のポッドの上部は上面および下面を有し、該上部は、4つの隅部を備えるほぼ正方形状をなし、該隅部の各々は該上部の上面に径方向へ延びるガセットを有することとを特徴とする請求項7に記載の装置。
- 前記上部の各ガセットは、隆起した中央部分を有し、該中央部分は、その隆起した部分から下向きに延びる1対の側壁を有し、前記下部の各ガセットは、1対の側壁を有して下方へ延びる下部分を有することを特徴とする請求項9に記載の装置。
- 前記第1のポッドの基部は外縁部を含む上向面を有し、該上向面は該縁部に沿ってグルーブを有し、該装置は、該グルーブに配置されたループに形成された弾性シールをさらに備え、前記カバーは、該弾性シールを係合するための係合突起を有し、該弾性シールおよび係合突起は、該カバーと基部とを気密的に係合させる連続的係合を構成することとを特徴とする請求項1に記載の装置。
- 前記弾性シールは、前記カバーと基部と間において圧縮され、該カバーは該基部に対してラッチされ、該カバーは、該基部上を少なくとも0.10インチ(約0.254cm)の距離を鉛直方向に移動可能であることとを特徴とする請求項11に記載の装置。
- 前記弾性シールは、2つの片持ち梁部分および中間部分を含む上面を有し、該上カバーは外周を有し、3つの係合リブは該外周に沿って延びることと、該3つの係合リブは該片持ち梁部分および中間部分と係合することとを特徴とする請求項11に記載の装置。
- 前記基部は、4つの隅部ガイドを含む請求項1に記載の装置。
- レチクルを支持して衝撃および振動を絶縁するコンテナであって、
カバーおよび該カバーにラッチ可能なドアを備える第1のポッドと、
下部および上部を含む第2のポッドと、該上部は該下部と係合して、該レチクルを収納するための第2のエンクロージャを形成することと、該下部は基板を保持するための支持構造を含むことと、該上部は、該下部と係合すると該基板を保持するための保持構造を含むことと、
該第1のポッドと第2のポッドとの間に延びて、該第2のポッドを包含的に支持する弾性連結部とを備えるコンテナ。 - 前記第2のポッドは4つの隅部を有し、前記複数の弾性連結部は、該4つの隅部の各々において、前記第2のポッドと第1のポッドとの間を鉛直に延びる請求項15に記載のコンテナ。
- 前記弾性連結部の各々は、第1端部および第2端部を有し、かつ、該端部の各々において開口部を有することと、該弾性連結部の各々は、前記第1のポッドおよび第2のポッドから延びる複数の突起により、これらのポッドと結合することと、該突起は該端部において該開口部に受容されることとを特徴とする請求項15に記載のコンテナ。
- 前記第2のポッドの下部は、4つの隅部を備えるほぼ正方形状をなし、かつ、該隅部の間に延びる4つの側面を有することと、該側面の各々は、レチクルが該下部において支持される場合に、該レチクルに対して凹状をなすアーチ形状を有することとを特徴とする請求項15に記載のコンテナ。
- 前記第2のポッドの上部および下部は、該第2のポッドの外側から内側へ延びる間隙を有する請求項15に記載のコンテナ。
- 前記弾性連結部は熱可塑性エラストマーから形成される請求項15に記載のコンテナ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65761605P | 2005-02-27 | 2005-02-27 | |
US65735505P | 2005-02-27 | 2005-02-27 | |
US77483406P | 2006-02-18 | 2006-02-18 | |
US11/364,562 US7607543B2 (en) | 2005-02-27 | 2006-02-26 | Reticle pod with isolation system |
PCT/US2006/007370 WO2006094100A2 (en) | 2005-02-27 | 2006-02-27 | Reticle pod with isolation system |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008531416A true JP2008531416A (ja) | 2008-08-14 |
Family
ID=36941805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007557250A Pending JP2008531416A (ja) | 2005-02-27 | 2006-02-27 | 絶縁システムを備えるレチクルポッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US7607543B2 (ja) |
EP (1) | EP1853497A2 (ja) |
JP (1) | JP2008531416A (ja) |
KR (1) | KR20070106037A (ja) |
CN (1) | CN101166681B (ja) |
IL (1) | IL185520A0 (ja) |
WO (1) | WO2006094100A2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017045893A (ja) * | 2015-08-27 | 2017-03-02 | 株式会社ディスコ | 搬送ケース |
JP6342036B1 (ja) * | 2017-01-26 | 2018-06-13 | 家登精密工業股▲ふん▼有限公司 | レチクルポッド |
JP2021033290A (ja) * | 2019-08-16 | 2021-03-01 | 家登精密工業股▲ふん▼有限公司 | 非封止型レチクル貯蔵器具 |
JP2021510209A (ja) * | 2018-10-29 | 2021-04-15 | 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co.,Ltd | レチクル保持システム |
WO2022039254A1 (ja) * | 2020-08-21 | 2022-02-24 | 積水成型工業株式会社 | フォトマスク容器 |
JP2022058166A (ja) * | 2020-09-30 | 2022-04-11 | 家登精密工業股▲ふん▼有限公司 | 衝突防止距離構造を備えたレチクルポッド |
JP2022115767A (ja) * | 2021-01-28 | 2022-08-09 | 家登精密工業股▲ふん▼有限公司 | 迅速解除機構体付きレチクルポッド |
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TWI344926B (en) * | 2008-12-05 | 2011-07-11 | Gudeng Prec Industral Co Ltd | Reticle pod |
TWI411563B (zh) * | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
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US9341942B2 (en) * | 2010-08-24 | 2016-05-17 | Nikon Research Corporation Of America | Vacuum chamber assembly for supporting a workpiece |
KR101851250B1 (ko) | 2010-10-19 | 2018-04-24 | 엔테그리스, 아이엔씨. | 로봇식 플랜지를 구비한 전면 개방형 웨이퍼 컨테이너 |
TWI414464B (zh) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | 具有固定結構之極紫外光光罩儲存傳送盒 |
TWI575631B (zh) | 2011-06-28 | 2017-03-21 | Dynamic Micro Systems | 半導體儲存櫃系統與方法 |
CN103858057A (zh) * | 2011-09-09 | 2014-06-11 | 迈普尔平版印刷Ip有限公司 | 振动隔绝模块和基板处理系统 |
TWI501910B (zh) * | 2011-11-17 | 2015-10-01 | Gudeng Prec Ind Co Ltd | 具有排水結構之極紫外光光罩儲存傳送盒 |
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Also Published As
Publication number | Publication date |
---|---|
IL185520A0 (en) | 2008-01-06 |
EP1853497A2 (en) | 2007-11-14 |
US20060260978A1 (en) | 2006-11-23 |
WO2006094100A2 (en) | 2006-09-08 |
US7607543B2 (en) | 2009-10-27 |
KR20070106037A (ko) | 2007-10-31 |
CN101166681B (zh) | 2013-06-12 |
CN101166681A (zh) | 2008-04-23 |
WO2006094100A3 (en) | 2007-09-20 |
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