JP2021033290A - 非封止型レチクル貯蔵器具 - Google Patents
非封止型レチクル貯蔵器具 Download PDFInfo
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000011109 contamination Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
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- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
- B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
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- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/02—Construction of housing; Use of materials therefor of lift valves
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- B01D2279/51—Filters adapted for separating dispersed particles from gases or vapours specially modified for specific uses for air conditioning in clean rooms, e.g. production facilities for electronic devices, laboratories
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
【解決手段】レチクル貯蔵器具がシーリング(201)およびこのシーリングを包囲しているカバー(202)を備えた頂部蓋(101)と、キャリヤ(203)およびこのキャリヤを包囲している周辺構造体(204)を備えた底部蓋(102)とを有する。頂部蓋が底部蓋と係合すると、これらの間に通路が形成され、従って、レチクル貯蔵器具は封止されることがない。
【選択図】図3A
Description
102 底部蓋
201 シーリング
202 カバー
203 キャリヤ
204 周辺構造体
211 トレンチ
205 入口
206 出口
207 第1の雌型部材
208 第1の雄型部材
209 第2の雄型部材
210 第2の雌型部材
Claims (11)
- レチクル貯蔵器具であって、
シーリングおよび前記シーリングを包囲しているカバーを備えた頂部蓋と、
キャリヤおよび前記キャリヤを包囲している周辺構造体を備えた底部蓋と、
前記頂部蓋を前記底部の蓋の上方に持ち上げるよう構成された複数のバンプとを有し、
前記キャリヤおよび前記シーリングならびに前記カバーは、前記頂部蓋が前記底部蓋と係合すると、レチクル収容スペースを画定し、前記頂部蓋の前記カバーは、前記底部蓋の前記周辺構造体に向き、前記頂部蓋の前記カバーの少なくとも一部分および前記底部蓋の前記周辺構造体の少なくとも一部分は、前記複数のバンプによって複数の通路を画定し、前記レチクル収容スペースは、前記通路に起因して封止されることがない、レチクル貯蔵器具。 - 前記通路は、互いに異なる方向の少なくとも2つの延長構造体で構成され、前記互いに異なる方向の少なくとも2つの延長構造体は、前記カバー上に形成された第1の雌型部材および前記周辺構造体上に形成された第1の雄型部材によって構成され、前記第1の雌型部材は、前記第1の雄型部材に構造的に一致している、請求項1記載のレチクル貯蔵器具。
- 前記通路は、互いに異なる方向の少なくとも2つの延長構造体で構成され、前記互いに異なる方向の少なくとも2つの延長構造体はさらに、前記カバー上に形成された第2の雄型部材および前記周辺構造体上に形成された第2の雌型部材によって構成され、前記第2の雄型部材は、前記第2の雌型部材に構造的に一致している、請求項2記載のレチクル貯蔵器具。
- 前記第1の雌型部材は、前記第2の雄型部材を包囲し、前記第1の雄型部材は、前記第2の雌型部材を包囲している、請求項3記載のレチクル貯蔵器具。
- 前記通路は、少なくとも、第1の水平延長構造体、第2の水平延長構造体および垂直延長構造体で画定され、前記垂直延長構造体は、前記第1の水平延長構造体と前記第2の水平延長構造体との間に位置し、前記第1の水平延長構造体および前記第2の水平延長構造体は、それぞれ、異なる高さレベルのところで延びている、請求項1記載のレチクル貯蔵器具。
- 前記底部蓋の周辺構造体と前記キャリヤとの間にはトレンチが形成され、前記トレンチは、前記通路と前記レチクル収容スペースとの間に延びている、請求項1記載のレチクル貯蔵器具。
- 前記複数のバンプは、前記カバーから下方に延び、前記底部蓋の前記周辺構造体は、前記複数のバンプに対応しかつ前記周辺構造体から下方に延びる複数の収容凹部を有し、前記収容凹部の各々は、対応関係にある前記バンプを部分的に受け入れるよう構成され、その結果、前記頂部蓋の前記カバーが前記底部蓋の前記周辺構造体の上方に持ち上げられるようになっている、請求項1記載のレチクル貯蔵器具。
- レチクル貯蔵器具であって、
シーリングおよび前記シーリングを包囲しているカバーを備えた頂部蓋と、
キャリヤおよび前記キャリヤを包囲している周辺構造体を備えた底部蓋とを有し、
前記キャリヤおよび前記シーリングならびに前記カバーは、前記頂部蓋が前記底部蓋と係合すると、レチクル収容スペースを画定し、前記頂部蓋の前記カバーは、前記底部蓋の前記周辺構造体に向き、前記頂部蓋の前記カバーの少なくとも一部分および前記底部蓋の前記周辺構造体の少なくとも一部分は、通路を画定し、前記レチクル収容スペースは、前記通路に起因して封止されることがなく、前記通路は、多数の延長構造体で構成され、前記通路は、第1の曲がり角および第2の曲がり角を有し、前記第1の曲がり角および前記第2の曲がり角は、空気流の流れを変更することができる、レチクル貯蔵器具。 - 前記通路は、入口をさらに有し、前記第1の曲がり角は、前記入口の高さレベルよりも高い高さレベルのところに位置し、前記第2の曲がり角は、前記入口の高さレベルよりも低い高さレベルのところに位置している、請求項8記載のレチクル貯蔵器具。
- 前記周辺構造体と前記キャリヤとの間にはトレンチが形成され、前記トレンチは、前記通路と前記レチクル収容スペースとの間に延びている、請求項8記載のレチクル貯蔵器具。
- 前記頂部蓋の前記カバーは、前記カバーから下方に延びる複数のバンプを有し、前記底部蓋の前記周辺構造体は、前記バンプに対応しかつ前記周辺構造体から延びる複数の収容凹部を有し、前記収容凹部の各々は、対応関係にある前記バンプを部分的に受け入れるよう構成され、その結果、前記頂部蓋の前記カバーが前記底部蓋の前記周辺構造体の上方に持ち上げられるようになっている、請求項8記載のレチクル貯蔵器具。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962887753P | 2019-08-16 | 2019-08-16 | |
US62/887,753 | 2019-08-16 | ||
US16/923,458 | 2020-07-08 | ||
US16/923,458 US11104496B2 (en) | 2019-08-16 | 2020-07-08 | Non-sealed reticle storage device |
Publications (2)
Publication Number | Publication Date |
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JP2021033290A true JP2021033290A (ja) | 2021-03-01 |
JP7041722B2 JP7041722B2 (ja) | 2022-03-24 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2020133042A Active JP7041722B2 (ja) | 2019-08-16 | 2020-08-05 | 非封止型レチクル貯蔵器具 |
JP2020133043A Active JP7164570B2 (ja) | 2019-08-16 | 2020-08-05 | 軟質接触部を備えた封止型レチクル貯蔵器具 |
JP2020135745A Active JP6995171B2 (ja) | 2019-08-16 | 2020-08-11 | 急速解放弁モジュール、急速解放弁モジュールを備えたレクチルポッド、および、レクチルポッド上に急速解放弁モジュールを迅速に設けるための方法 |
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JP2020133043A Active JP7164570B2 (ja) | 2019-08-16 | 2020-08-05 | 軟質接触部を備えた封止型レチクル貯蔵器具 |
JP2020135745A Active JP6995171B2 (ja) | 2019-08-16 | 2020-08-11 | 急速解放弁モジュール、急速解放弁モジュールを備えたレクチルポッド、および、レクチルポッド上に急速解放弁モジュールを迅速に設けるための方法 |
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US (2) | US11104496B2 (ja) |
JP (3) | JP7041722B2 (ja) |
KR (3) | KR102439646B1 (ja) |
CN (3) | CN112393003B (ja) |
TW (3) | TWI752547B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2021033291A (ja) * | 2019-08-16 | 2021-03-01 | 家登精密工業股▲ふん▼有限公司 | 軟質接触部を備えた封止型レチクル貯蔵器具 |
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CN113937041A (zh) | 2021-06-30 | 2022-01-14 | 家登精密工业股份有限公司 | 基板容器系统 |
US20230066653A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle enclosure for lithography systems |
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TWI792020B (zh) | 2023-02-11 |
KR20210021268A (ko) | 2021-02-25 |
CN112389846A (zh) | 2021-02-23 |
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