JP6825083B2 - レチクルの側面抑制を有するレチクルポッド - Google Patents
レチクルの側面抑制を有するレチクルポッド Download PDFInfo
- Publication number
- JP6825083B2 JP6825083B2 JP2019511549A JP2019511549A JP6825083B2 JP 6825083 B2 JP6825083 B2 JP 6825083B2 JP 2019511549 A JP2019511549 A JP 2019511549A JP 2019511549 A JP2019511549 A JP 2019511549A JP 6825083 B2 JP6825083 B2 JP 6825083B2
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- JP
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- Prior art keywords
- reticle
- pod
- retainer
- contact
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000004044 response Effects 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 10
- 239000002245 particle Substances 0.000 description 7
- 239000013618 particulate matter Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical compound [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004963 Torlon Substances 0.000 description 1
- 229920003997 Torlon® Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Packaging Frangible Articles (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
本出願は、2016年8月27日に出願された「レチクルの側面抑制を有するレチクルポッド」と題する米国仮特許出願第62/380,377号、2016年10月7日に出願された「レチクルの側面抑制を有するレチクルポッド」と題する米国仮特許出願第62/405,518号、および2016年11月15日に出願された「レチクルの側面抑制を有するレチクルポッド」と題する米国仮特許出願第62/422,229号の利益を主張し、これらの出願のそれぞれは、その全体が参照により本明細書に組み込まれる。
Claims (9)
- レチクルを支持するように構成されたベースと、
上部表面を有しかつ前記ベースに嵌合するように構成されたカバーと、
各レチクル接触部材が外方延在腕部および前記上部表面から前記カバーを貫通して延在する下方延在脚部を含み、レチクルの側壁に接触して前記レチクルの移動を限定するように構成されたレチクル接触部材をそれぞれ含む1つまたは複数のレチクルリテーナとを備え、前記腕部の作動時に、前記下方延在脚部がレチクルの側壁に向かう方向で移動するように構成される、
レチクルを保持するためのレチクルポッド。 - 前記レチクル接触部材が水平方向で前記レチクルの移動を限定する、請求項1に記載のレチクルポッド。
- 前記レチクル接触部材が垂直方向で移動を限定する、請求項2に記載のレチクルポッド。
- 前記レチクル接触部材がレチクルの上部表面と接触するようにさらに構成される、請求項1に記載のレチクルポッド。
- 前記1つまたは複数のレチクルリテーナのそれぞれが弾性部材をさらに備え、前記弾性部材が前記レチクル接触部材を非接触位置に付勢する、請求項1に記載のレチクルポッド。
- 前記外方延在腕部が前記カバーの上部表面の上方に少なくとも部分的に延在する、請求項1に記載のレチクルポッド。
- 前記外方延在腕部が少なくとも1つの下方延在部材を備える、請求項1に記載のレチクルポッド。
- 前記下方延在脚部が少なくとも第1の凹部と、前記第1の凹部に収容される第1の接触部材とを含む、請求項1に記載のレチクルポッド。
- 前記レチクルポッドが外側ポッドベースと、前記外側ポッドベースに嵌合するように構成された外側ポッドカバーとを有する外側ポッド内に格納され、前記外側ポッドカバーが内表面と、前記内表面から延在して前記レチクルポッドの前記外方延在腕部に接触し作動させ、前記下方延在脚部を前記レチクルの前記側壁に向かう方向に移動させる少なくとも1つの接触パッドとを有する、請求項1に記載のレチクルポッド。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662380377P | 2016-08-27 | 2016-08-27 | |
US62/380,377 | 2016-08-27 | ||
US201662405518P | 2016-10-07 | 2016-10-07 | |
US62/405,518 | 2016-10-07 | ||
US201662422229P | 2016-11-15 | 2016-11-15 | |
US62/422,229 | 2016-11-15 | ||
PCT/US2017/048396 WO2018044678A1 (en) | 2016-08-27 | 2017-08-24 | Reticle pod having side containment of reticle |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019528578A JP2019528578A (ja) | 2019-10-10 |
JP6825083B2 true JP6825083B2 (ja) | 2021-02-03 |
Family
ID=59772802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019511549A Active JP6825083B2 (ja) | 2016-08-27 | 2017-08-24 | レチクルの側面抑制を有するレチクルポッド |
Country Status (7)
Country | Link |
---|---|
US (3) | US20200211876A1 (ja) |
EP (1) | EP3504591B1 (ja) |
JP (1) | JP6825083B2 (ja) |
KR (1) | KR102214147B1 (ja) |
CN (1) | CN109690401B (ja) |
TW (1) | TWI652757B (ja) |
WO (1) | WO2018044678A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US10256132B2 (en) * | 2016-04-28 | 2019-04-09 | Varian Semiconductor Equipment Associates, Inc. | Reticle processing system |
TWI685711B (zh) * | 2018-08-27 | 2020-02-21 | 家登精密工業股份有限公司 | 光罩盒及其作動方法 |
TWI705522B (zh) * | 2019-07-30 | 2020-09-21 | 家登精密工業股份有限公司 | 基板容納裝置及其製造方法 |
US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
US11442370B2 (en) | 2019-10-16 | 2022-09-13 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
TW202134774A (zh) * | 2019-12-05 | 2021-09-16 | 美商應用材料股份有限公司 | 光標處理系統 |
WO2021133553A1 (en) * | 2019-12-24 | 2021-07-01 | Entegris, Inc. | Reticle pod having retention through baseplate |
WO2021138012A1 (en) * | 2019-12-31 | 2021-07-08 | Entegris, Inc. | Reticle pod having retention through reticle compartment wall |
JP7176165B2 (ja) * | 2020-04-24 | 2022-11-22 | 家登精密工業股▲ふん▼有限公司 | Euvレチクルポッド |
US11982937B2 (en) * | 2020-05-14 | 2024-05-14 | Gudeng Precision Industrial Co., Ltd. | Reticle pod provided with optically identifiable marks and method for identifying the same |
TWI760062B (zh) * | 2020-05-14 | 2022-04-01 | 家登精密工業股份有限公司 | 提供有保持銷組件之光罩盒及固持光罩的方法 |
TWI755795B (zh) * | 2020-07-23 | 2022-02-21 | 家登精密工業股份有限公司 | 具有導位構件的光罩盒 |
US11874596B2 (en) * | 2020-09-30 | 2024-01-16 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
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US20220100106A1 (en) * | 2020-09-30 | 2022-03-31 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
DE102020213422A1 (de) | 2020-10-23 | 2021-10-28 | Carl Zeiss Smt Gmbh | Lagerelement für ein retikel für die mikrolithographie |
KR20230104732A (ko) * | 2020-11-18 | 2023-07-10 | 브룩스 오토메이션 (저머니) 게엠베하 | Euv 레티클 스토커 및 그 작동 방법 |
US11822257B2 (en) | 2021-03-12 | 2023-11-21 | Gudeng Precision Industrial Co., Ltd. | Reticle storage pod and method for securing reticle |
US20230066653A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle enclosure for lithography systems |
KR20240055818A (ko) * | 2021-09-09 | 2024-04-29 | 엔테그리스, 아이엔씨. | 경사면을 포함하는 래치를 갖는 레티클 포드 |
TW202400488A (zh) * | 2022-06-28 | 2024-01-01 | 美商恩特葛瑞斯股份有限公司 | 光罩容器中用於間隔之插件 |
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-
2017
- 2017-08-24 EP EP17761738.8A patent/EP3504591B1/en active Active
- 2017-08-24 WO PCT/US2017/048396 patent/WO2018044678A1/en unknown
- 2017-08-24 CN CN201780053077.7A patent/CN109690401B/zh active Active
- 2017-08-24 US US16/319,093 patent/US20200211876A1/en not_active Abandoned
- 2017-08-24 JP JP2019511549A patent/JP6825083B2/ja active Active
- 2017-08-24 KR KR1020197005284A patent/KR102214147B1/ko active IP Right Grant
- 2017-08-25 TW TW106128968A patent/TWI652757B/zh active
-
2020
- 2020-11-05 US US17/089,987 patent/US11594437B2/en active Active
-
2023
- 2023-02-08 US US18/107,325 patent/US12062560B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20210057248A1 (en) | 2021-02-25 |
TW201820511A (zh) | 2018-06-01 |
CN109690401A (zh) | 2019-04-26 |
KR102214147B1 (ko) | 2021-02-09 |
JP2019528578A (ja) | 2019-10-10 |
EP3504591A1 (en) | 2019-07-03 |
US12062560B2 (en) | 2024-08-13 |
US11594437B2 (en) | 2023-02-28 |
TWI652757B (zh) | 2019-03-01 |
KR20190033578A (ko) | 2019-03-29 |
EP3504591B1 (en) | 2022-05-11 |
CN109690401B (zh) | 2022-08-02 |
US20230187246A1 (en) | 2023-06-15 |
US20200211876A1 (en) | 2020-07-02 |
WO2018044678A1 (en) | 2018-03-08 |
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