JP2016500844A - ベース板にカバーの位置を合わせる機構を備えたレチクルポッド - Google Patents
ベース板にカバーの位置を合わせる機構を備えたレチクルポッド Download PDFInfo
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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Abstract
Description
Claims (23)
- 基板やレチクルを格納するためのレチクル運搬容器であって、
協同して筐体を形成する上側部材と下側部材を含む外側ポッド組立品と、基板やレチクルを保管するための内側ポッド組立品とを含み、内側ポッド組立品が外側ポッド組立品の筐体内に格納できるようになっており、
内側ポッド組立品がカバーとベースと位置合わせ機構を含み、カバーとベースの中心の位置が一本の中心軸に合わせて同じになっており、その中心軸を軸方向とし、
位置合わせ機構は、カバーとベースのうちの一方に設けられた穴が形成された構造と、カバーとベースのうちの他方の端に面した位置に形成したガイドとなる窪みと、穴に配置する位置合わせピンとを含んでおり、
カバーとベースを組み合わせると位置合わせピンがガイドとなる窪みの位置に来るようになっており、カバーとベースの位置合わせのためにカバーをベースに向かって軸方向に動かすときにガイドとなる窪みで位置合わせピンを案内できるようになっているもの。 - 請求項1のレチクル運搬容器であって、穴が貫通穴であるもの。
- 請求項2のレチクル運搬容器であって、位置合わせピンが貫通穴から突き出る頭を含むもの。
- 請求項1のレチクル運搬容器であって、穴が止まり穴であるもの。
- 請求項4のレチクル運搬容器であって、止まり穴と連通した空気穴が形成された構造をさらに含むもの。
- 請求項1のレチクル運搬容器であって、カバーをベースに対して軸方向に動かすときに位置合わせピンが接触できるよう、ガイドとなる窪みの内側から径方向に突起が出ているもの。
- 請求項の6のレチクル運搬容器であって、ガイドとなる窪みに陥凹部を設け、この陥凹部にボールを配置して突起としたもの。
- 請求項1のレチクル運搬容器であって、ガイドとなる窪みが稜線のある段状の壁を備えており、位置合わせピンが軸方向に動くときにその稜線がピンと線接触か点接触できるようになっているもの。
- 請求項8のレチクル運搬容器であって、段状の壁が、カバーとベースの他方の内側表面のすぐ隣にある円錐面部分と、この円錐面部分のすぐ隣にある直円柱面部分とを含み、
円錐面部分の半径がカバーとベースの他方の内側表面に面する位置で第一半径となっており、直円柱面部分の半径が第一半径より小さい第二半径となっており、
円錐面部分と直円柱面部分の合流点に段状の壁の稜線が形成されているもの。 - 請求項1のレチクル運搬容器であって、カバーが材料の単一の塊から形成される一体構造であるもの。
- 請求項1のレチクル運搬容器であって、ベースが材料の単一の塊から形成される一体構造であるもの。
- 請求項11のレチクル運搬容器であって、材料が金属であるもの。
- 請求項1のレチクル運搬容器であって、位置合わせピンが、上側の軸部と下側の軸部を含む金属の核と、少なくとも下側の軸部を覆うポリマーの軸鞘または塗膜とで構成されるもの。
- 請求項13のレチクル運搬容器であって、ポリマーの軸鞘または塗膜がポリアミドイミド材料からできているもの。
- 請求項13のレチクル運搬容器であって、ポリマーの軸鞘または塗膜を下側の軸部に固定できるよう、下側の軸部に径方向外側へ突き出た掛かりが設けられているもの。
- 請求項1のレチクル運搬容器であって、位置合わせピンがストッパーとなる突出部を含むもの。
- 請求項1のレチクル運搬容器であって、ガイドとなる窪みが端に形成した陥凹部であるもの。
- 粒子生成を抑えるためのレチクル運搬容器を作る方法であって、
組み合わせた際に基板やレチクルを保管するための筐体を形成できるようになった内側ポッド組立品のカバーとベースを製造する工程と、
カバーとベースのうち一方にガイドとなる窪みを形成する工程と、
位置決めピンを準備する工程と、
カバーとベースのうち他方に位置決めピンを固定する工程とを含み、
カバーをベースと組み合わせて筐体を形成するときに、位置決めピンが位置決め軸を決め、位置決め軸に沿ってガイドとなる窪みに入って位置を合わせることができる方法。 - 請求項18の方法であって、カバーとベースを製造する過程において、カバーとベースのうち少なくとも一つが一体であるもの。
- 請求項18の方法であって、ガイドとなる窪みの壁から突出部が外向きに出ており、位置合わせピンとガイドとなる窪みとの間に位置合わせの軸に沿った相対的な動きがあるときにその突出部が位置合わせピンと接触するように配置されているもの。
- 請求項20の方法であって、ガイドとなる窪みを形成する段階において、ガイドとなる窪みの壁にある円錐面部分と直円柱面部分の合流点で突出部を形成するもの。
- 請求項20の方法であって、ガイドとなる窪みの壁に陥凹部を形成する段階と、陥凹部にボールを固定する段階とを含み、このボールで突出部を形成するもの。
- 請求項22の方法であって、固定する段階で用いるボールがポリマーでできているもの。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201261716445P | 2012-10-19 | 2012-10-19 | |
US61/716,445 | 2012-10-19 | ||
PCT/US2013/065506 WO2014062956A1 (en) | 2012-10-19 | 2013-10-17 | Reticle pod with cover to baseplate alignment system |
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JP2016500844A true JP2016500844A (ja) | 2016-01-14 |
JP6322638B2 JP6322638B2 (ja) | 2018-05-09 |
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JP2015537837A Active JP6322638B2 (ja) | 2012-10-19 | 2013-10-17 | ベース板にカバーの位置を合わせる機構を備えたレチクルポッド |
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US (1) | US9919863B2 (ja) |
EP (1) | EP2909110B1 (ja) |
JP (1) | JP6322638B2 (ja) |
KR (1) | KR20150067375A (ja) |
TW (1) | TWI591002B (ja) |
WO (1) | WO2014062956A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6286090B1 (ja) * | 2017-01-26 | 2018-02-28 | 家登精密工業股▲ふん▼有限公司 | レチクルポッド |
JP6975302B1 (ja) * | 2020-07-23 | 2021-12-01 | 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co., Ltd | ガイド部材を有するマスクケース |
JP2022551521A (ja) * | 2019-10-10 | 2022-12-09 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2909110B1 (en) | 2012-10-19 | 2017-08-30 | Entegris, Inc. | Reticle pod with cover to baseplate alignment system |
US10153187B2 (en) * | 2014-11-11 | 2018-12-11 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate |
WO2016149517A1 (en) * | 2015-03-18 | 2016-09-22 | Entegris, Inc. | Mechanical venting of a reticle pod |
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TWI686666B (zh) * | 2016-04-08 | 2020-03-01 | 美商恩特葛瑞斯股份有限公司 | 基板容器 |
US10256132B2 (en) * | 2016-04-28 | 2019-04-09 | Varian Semiconductor Equipment Associates, Inc. | Reticle processing system |
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TWI666510B (zh) * | 2017-01-25 | 2019-07-21 | 家登精密工業股份有限公司 | 極紫外光光罩容器 |
TWI690771B (zh) * | 2018-01-11 | 2020-04-11 | 家登精密工業股份有限公司 | 光罩壓抵單元及應用其之極紫外光光罩容器 |
TWD209928S (zh) * | 2019-08-02 | 2021-02-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
TWD209426S (zh) * | 2019-08-02 | 2021-01-21 | 家登精密工業股份有限公司 | 光罩傳送盒之底座 |
US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
US11442370B2 (en) | 2019-10-16 | 2022-09-13 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
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TWI803860B (zh) * | 2020-04-30 | 2023-06-01 | 美商恩特葛瑞斯股份有限公司 | 光罩盒密封 |
TWD211778S (zh) * | 2020-09-22 | 2021-05-21 | 家登精密工業股份有限公司 | 光罩盒 |
TWD211780S (zh) * | 2020-09-22 | 2021-05-21 | 家登精密工業股份有限公司 | 光罩盒 |
WO2023086297A1 (en) * | 2021-11-09 | 2023-05-19 | Entegris, Inc. | Reticle pod including motion limiting features and method of assembling same |
US20230194978A1 (en) * | 2021-12-21 | 2023-06-22 | Entegris, Inc. | Reticle pod inner pod having dissimilar material at contact surface interfaces |
WO2023129642A1 (en) * | 2021-12-29 | 2023-07-06 | Entegris, Inc. | Inner reticle pod cover and baseplate shipper |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06305554A (ja) * | 1993-04-27 | 1994-11-01 | Canon Inc | 基板供給方法およびその装置 |
JPH11255332A (ja) * | 1998-03-10 | 1999-09-21 | Sigma Meltec Kk | 基板収納ケース |
JP3070851U (ja) * | 2000-02-08 | 2000-08-15 | 株式会社マルニ | 椅子の脚先保護構造 |
JP2003100851A (ja) * | 2001-09-26 | 2003-04-04 | Ulvac Japan Ltd | 真空処理装置および真空処理方法 |
JP2007210655A (ja) * | 2006-02-10 | 2007-08-23 | Fujitsu Ltd | 収納ケース |
JP2007266453A (ja) * | 2006-03-29 | 2007-10-11 | Toppan Printing Co Ltd | 電子線露光用マスクホルダ |
JP2009510525A (ja) * | 2005-09-27 | 2009-03-12 | インテグリス・インコーポレーテッド | レチクルポッド |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5054418A (en) * | 1989-05-23 | 1991-10-08 | Union Oil Company Of California | Cage boat having removable slats |
JP3089590B2 (ja) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | 板状物収納容器およびその蓋開口装置 |
KR0169786B1 (ko) * | 1995-12-21 | 1999-02-18 | 김광호 | 웨이퍼 표면 불순물의 전 처리 분석 장치 |
JPH1179274A (ja) | 1997-09-04 | 1999-03-23 | Shin Etsu Polymer Co Ltd | 熱可塑性プラスチック製カセットの構造及び封止方法 |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
US6338409B1 (en) * | 2000-04-13 | 2002-01-15 | International Business Machines Corporation | Reticle SMIF pod in situ orientation |
US7040487B2 (en) * | 2001-07-14 | 2006-05-09 | Entegris, Inc. | Protective shipper |
TWI319123B (en) | 2002-02-22 | 2010-01-01 | Asml Holding Nv | System and method for using a two part cover for protecting a reticle |
US7008487B1 (en) * | 2002-03-04 | 2006-03-07 | Micron Technology, Inc. | Method and system for removal of contaminates from phaseshift photomasks |
US6988620B2 (en) * | 2002-09-06 | 2006-01-24 | E.Pak International, Inc. | Container with an adjustable inside dimension that restricts movement of items within the container |
US6727029B1 (en) * | 2003-01-02 | 2004-04-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for making reticles with reduced particle contamination and reticles formed |
US6988621B2 (en) * | 2003-06-17 | 2006-01-24 | Illinois Tool Works Inc. | Reduced movement wafer box |
JP4710308B2 (ja) * | 2004-10-29 | 2011-06-29 | 株式会社ニコン | レチクル搬送装置、露光装置、及びレチクルの搬送方法 |
US7607543B2 (en) | 2005-02-27 | 2009-10-27 | Entegris, Inc. | Reticle pod with isolation system |
US7528936B2 (en) * | 2005-02-27 | 2009-05-05 | Entegris, Inc. | Substrate container with pressure equalization |
US20070187286A1 (en) * | 2006-02-16 | 2007-08-16 | Pylant James D | Wafer storage container and apparatus |
JP4853872B2 (ja) | 2007-05-24 | 2012-01-11 | ラピスセミコンダクタ株式会社 | チップの製造方法 |
EP2209726A4 (en) * | 2007-10-12 | 2012-08-15 | Peak Plastic & Metal Prod | CONTAINER FOR PLATELETS WITH STRUCTURE OF WALLS IN QUINCONCE |
JP5429796B2 (ja) | 2009-08-25 | 2014-02-26 | キヤノンアネルバ株式会社 | マスク位置合わせ機構及びマスク位置合わせ方法並びに真空処理装置 |
TWI411563B (zh) * | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
TWI414464B (zh) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | 具有固定結構之極紫外光光罩儲存傳送盒 |
EP2909110B1 (en) | 2012-10-19 | 2017-08-30 | Entegris, Inc. | Reticle pod with cover to baseplate alignment system |
-
2013
- 2013-10-17 EP EP13847167.7A patent/EP2909110B1/en active Active
- 2013-10-17 KR KR1020157012756A patent/KR20150067375A/ko not_active Application Discontinuation
- 2013-10-17 US US14/437,121 patent/US9919863B2/en active Active
- 2013-10-17 JP JP2015537837A patent/JP6322638B2/ja active Active
- 2013-10-17 WO PCT/US2013/065506 patent/WO2014062956A1/en active Application Filing
- 2013-10-18 TW TW102137678A patent/TWI591002B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06305554A (ja) * | 1993-04-27 | 1994-11-01 | Canon Inc | 基板供給方法およびその装置 |
JPH11255332A (ja) * | 1998-03-10 | 1999-09-21 | Sigma Meltec Kk | 基板収納ケース |
JP3070851U (ja) * | 2000-02-08 | 2000-08-15 | 株式会社マルニ | 椅子の脚先保護構造 |
JP2003100851A (ja) * | 2001-09-26 | 2003-04-04 | Ulvac Japan Ltd | 真空処理装置および真空処理方法 |
JP2009510525A (ja) * | 2005-09-27 | 2009-03-12 | インテグリス・インコーポレーテッド | レチクルポッド |
JP2007210655A (ja) * | 2006-02-10 | 2007-08-23 | Fujitsu Ltd | 収納ケース |
JP2007266453A (ja) * | 2006-03-29 | 2007-10-11 | Toppan Printing Co Ltd | 電子線露光用マスクホルダ |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6286090B1 (ja) * | 2017-01-26 | 2018-02-28 | 家登精密工業股▲ふん▼有限公司 | レチクルポッド |
JP2018120200A (ja) * | 2017-01-26 | 2018-08-02 | 家登精密工業股▲ふん▼有限公司 | レチクルポッド |
JP2022551521A (ja) * | 2019-10-10 | 2022-12-09 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
JP7379689B2 (ja) | 2019-10-10 | 2023-11-14 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
JP6975302B1 (ja) * | 2020-07-23 | 2021-12-01 | 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co., Ltd | ガイド部材を有するマスクケース |
JP2022022047A (ja) * | 2020-07-23 | 2022-02-03 | 家登精密工業股▲ふん▼有限公司 | ガイド部材を有するマスクケース |
Also Published As
Publication number | Publication date |
---|---|
TW201420462A (zh) | 2014-06-01 |
KR20150067375A (ko) | 2015-06-17 |
EP2909110A1 (en) | 2015-08-26 |
US9919863B2 (en) | 2018-03-20 |
WO2014062956A1 (en) | 2014-04-24 |
TWI591002B (zh) | 2017-07-11 |
US20150266660A1 (en) | 2015-09-24 |
JP6322638B2 (ja) | 2018-05-09 |
EP2909110A4 (en) | 2016-08-24 |
EP2909110B1 (en) | 2017-08-30 |
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