JP2022551521A - 窓付きレチクルポッド - Google Patents
窓付きレチクルポッド Download PDFInfo
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- JP2022551521A JP2022551521A JP2022521531A JP2022521531A JP2022551521A JP 2022551521 A JP2022551521 A JP 2022551521A JP 2022521531 A JP2022521531 A JP 2022521531A JP 2022521531 A JP2022521531 A JP 2022521531A JP 2022551521 A JP2022551521 A JP 2022551521A
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- door
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- reticle
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- 230000006835 compression Effects 0.000 abstract description 15
- 238000007906 compression Methods 0.000 abstract description 15
- 239000000356 contaminant Substances 0.000 abstract description 2
- 230000000717 retained effect Effects 0.000 description 12
- 229920001973 fluoroelastomer Polymers 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000010128 melt processing Methods 0.000 description 4
- 239000013618 particulate matter Substances 0.000 description 4
- 101100495256 Caenorhabditis elegans mat-3 gene Proteins 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Blocking Light For Cameras (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
本出願は、2019年10月10日に出願された米国仮特許出願第62/913,518号の利益及び優先権を主張し、あらゆる目的のためにその全体が参照により本明細書に組み込まれる。
Claims (17)
- レチクルポッド扉であって、
扉ハウジングと、
前記扉ハウジングに固定された扉カバーと、
前記扉ハウジング中に画定された開口部と、
レンズ、側壁、及びレッジを含む窓と、を備え、前記窓が、前記レンズが前記扉ハウジング中に画定された前記開口部を通して見えるように、前記レチクルポッド扉内の前記扉ハウジングと前記扉カバーとの間に収容されている、レチクルポッド扉。 - 前記扉カバーが、前記レンズが前記レチクルポッド扉の底部から見えるように追加の開口部を含む、請求項1に記載のレチクルポッド扉。
- 前記側壁が、前記レンズから下方に遠ざかるように延在し、前記窓の外周を画定する前記レンズの周りを囲む、請求項1に記載のレチクルポッド扉。
- 前記側壁が、前記側壁の下縁が前記扉カバーの上面に接触するように、前記レンズから下方に遠ざかるように延在する、請求項3に記載のレチクルポッド。
- 前記側壁が、前記側壁の下縁が前記扉ハウジングの下面と前記扉カバーの上面との間にあるように、前記レンズから下方に遠ざかるように延在する、請求項3に記載のレチクルポッド。
- 前記レッジが、前記窓の外周の周りで前記側壁から外側に遠ざかるように終端する、請求項1に記載のレチクルポッド扉。
- 前記レッジが、前記側壁中に形成された凹部によって画定されている、請求項1に記載のレチクルポッド扉。
- 前記レッジが、前記窓の外周の周りで前記側壁から外側に遠ざかるように終端し、かつ第2の外周よりも大きい第1の外周を有する、請求項1に記載のレチクルポッド扉。
- 前記レンズの下面と前記レッジの上面との間に凹部が画定されている、請求項8に記載のレチクルポッド扉。
- 前記窓、前記レンズ、及び前記レッジが、前記扉カバーが前記扉ハウジングに固定されたときに前記レンズが前記扉ハウジングの前記開口部内に受容されるように、前記扉カバー中に一体的に形成されている、請求項1に記載のレチクルポッド扉。
- 圧縮性シールをさらに備える、請求項1から10のいずれか一項に記載のレチクルポッド。
- 前記レンズ、前記側壁、及び前記レッジが、単一の一体部品として設けられている、請求項1から10のいずれか一項に記載のレチクルポッド扉。
- レチクル容器であって、
ポッドカバーと、
ポッド扉と、を備え、前記ポッド扉が、扉ハウジングと、前記扉ハウジングに固定された扉カバーと、前記扉ハウジング中に画定された開口部と、レンズ、側壁、及びレッジを含む窓と、を含み、前記窓が、前記レンズが前記扉ハウジング中に画定された前記開口部を通して見えるように前記ポッド扉内に保持されている、レチクル容器。 - 前記内側ポッドカバー及び内側ポッド扉が、外側ポッドを画定し、前記レチクルポッド容器が、前記外側ポッド内に収容された内側ポッドをさらに備え、前記内側ポッドが、内側ポッドハウジングと、内側ポッド窓を含む内側ポッド扉と、を含み、前記内側ポッドが前記外側ポッド内に収容されたとき、前記内側ポッド窓が、前記外側ポッドの前記ポッド扉内の前記窓と位置合わせされる、請求項13に記載のレチクル容器。
- 前記窓の前記側壁が、前記側壁の下縁が前記ポッド扉の前記扉カバーの上面に接触するように、前記レンズから下方に遠ざかるように延在する、請求項13に記載のレチクル容器。
- 前記窓の前記側壁が、前記側壁の下縁が前記扉ハウジングの下面と前記扉カバーの上面との間にあるように、前記レンズから下方に遠ざかるように延在する、請求項13に記載のレチクル容器。
- 圧縮性シールをさらに備える、請求項13から16のいずれか一項に記載のレチクル容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962913518P | 2019-10-10 | 2019-10-10 | |
US62/913,518 | 2019-10-10 | ||
PCT/US2020/054853 WO2021072126A1 (en) | 2019-10-10 | 2020-10-08 | Reticle pod with window |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022551521A true JP2022551521A (ja) | 2022-12-09 |
JP7379689B2 JP7379689B2 (ja) | 2023-11-14 |
Family
ID=75347054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022521531A Active JP7379689B2 (ja) | 2019-10-10 | 2020-10-08 | 窓付きレチクルポッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210109439A1 (ja) |
EP (1) | EP4042242A4 (ja) |
JP (1) | JP7379689B2 (ja) |
KR (1) | KR20220079611A (ja) |
CN (2) | CN112650021B (ja) |
TW (1) | TWI769547B (ja) |
WO (1) | WO2021072126A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11508592B2 (en) * | 2018-10-29 | 2022-11-22 | Gudeng Precision Industrial Co., Ltd | Reticle retaining system |
US20210109439A1 (en) * | 2019-10-10 | 2021-04-15 | Entegris, Inc. | Reticle pod with window |
US20230066653A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle enclosure for lithography systems |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427949A (ja) * | 1990-05-24 | 1992-01-30 | Fujitsu Ltd | レチクルケース |
US20030234208A1 (en) * | 2002-06-20 | 2003-12-25 | Taiwan Semiconductor Manufacturing Co.. Ltd. | Container with magnifying identification lens |
JP2007329439A (ja) * | 2006-05-12 | 2007-12-20 | Miraial Kk | レチクルケース |
JP2009246154A (ja) * | 2008-03-31 | 2009-10-22 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2011124591A (ja) * | 2004-10-29 | 2011-06-23 | Nikon Corp | レチクル保護装置及び露光装置 |
US20140116920A1 (en) * | 2012-10-25 | 2014-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle Pod |
JP2015163967A (ja) * | 2007-11-15 | 2015-09-10 | 株式会社ニコン | マスクケース、搬送装置、露光装置、露光方法及びデバイス製造方法 |
JP2016500844A (ja) * | 2012-10-19 | 2016-01-14 | インテグリス・インコーポレーテッド | ベース板にカバーの位置を合わせる機構を備えたレチクルポッド |
JP2020528160A (ja) * | 2017-07-21 | 2020-09-17 | インテグリス・インコーポレーテッド | レチクルを保持及び輸送するための、透明窓アセンブリを有する容器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
JP3733114B2 (ja) * | 2000-07-25 | 2006-01-11 | 株式会社メヂアナ電子 | プラスチックパッケージベース及びエアキャビティ型パッケージ |
US6948619B2 (en) * | 2002-07-05 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Reticle pod and reticle with cut areas |
EP1434094A1 (en) * | 2002-12-27 | 2004-06-30 | ASML Netherlands B.V. | Container for a mask |
US7236233B2 (en) * | 2003-10-27 | 2007-06-26 | Asml Netherlands B.V. | Assembly of a reticle holder and a reticle |
TWI414464B (zh) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | 具有固定結構之極紫外光光罩儲存傳送盒 |
TWI501910B (zh) * | 2011-11-17 | 2015-10-01 | Gudeng Prec Ind Co Ltd | 具有排水結構之極紫外光光罩儲存傳送盒 |
WO2015066484A1 (en) * | 2013-10-31 | 2015-05-07 | Entegris, Inc. | A modular reticle pod system |
KR102164153B1 (ko) * | 2016-04-06 | 2020-10-12 | 엔테그리스, 아이엔씨. | 윈도우 보유 스프링을 구비한 기판 용기 |
US10670976B2 (en) * | 2017-01-25 | 2020-06-02 | Gudeng Precision Industrial Co., Ltd | EUV reticle pod |
US20210109439A1 (en) * | 2019-10-10 | 2021-04-15 | Entegris, Inc. | Reticle pod with window |
-
2020
- 2020-10-08 US US17/066,358 patent/US20210109439A1/en active Pending
- 2020-10-08 JP JP2022521531A patent/JP7379689B2/ja active Active
- 2020-10-08 WO PCT/US2020/054853 patent/WO2021072126A1/en unknown
- 2020-10-08 KR KR1020227015165A patent/KR20220079611A/ko not_active Application Discontinuation
- 2020-10-08 EP EP20875619.7A patent/EP4042242A4/en active Pending
- 2020-10-08 TW TW109135022A patent/TWI769547B/zh active
- 2020-10-12 CN CN202011086804.XA patent/CN112650021B/zh active Active
- 2020-10-12 CN CN202022258503.2U patent/CN213240796U/zh not_active Withdrawn - After Issue
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427949A (ja) * | 1990-05-24 | 1992-01-30 | Fujitsu Ltd | レチクルケース |
US20030234208A1 (en) * | 2002-06-20 | 2003-12-25 | Taiwan Semiconductor Manufacturing Co.. Ltd. | Container with magnifying identification lens |
JP2011124591A (ja) * | 2004-10-29 | 2011-06-23 | Nikon Corp | レチクル保護装置及び露光装置 |
JP2007329439A (ja) * | 2006-05-12 | 2007-12-20 | Miraial Kk | レチクルケース |
JP2015163967A (ja) * | 2007-11-15 | 2015-09-10 | 株式会社ニコン | マスクケース、搬送装置、露光装置、露光方法及びデバイス製造方法 |
JP2009246154A (ja) * | 2008-03-31 | 2009-10-22 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2016500844A (ja) * | 2012-10-19 | 2016-01-14 | インテグリス・インコーポレーテッド | ベース板にカバーの位置を合わせる機構を備えたレチクルポッド |
US20140116920A1 (en) * | 2012-10-25 | 2014-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle Pod |
JP2020528160A (ja) * | 2017-07-21 | 2020-09-17 | インテグリス・インコーポレーテッド | レチクルを保持及び輸送するための、透明窓アセンブリを有する容器 |
Also Published As
Publication number | Publication date |
---|---|
JP7379689B2 (ja) | 2023-11-14 |
TW202122913A (zh) | 2021-06-16 |
CN112650021A (zh) | 2021-04-13 |
EP4042242A1 (en) | 2022-08-17 |
CN112650021B (zh) | 2024-06-11 |
TWI769547B (zh) | 2022-07-01 |
WO2021072126A1 (en) | 2021-04-15 |
US20210109439A1 (en) | 2021-04-15 |
KR20220079611A (ko) | 2022-06-13 |
EP4042242A4 (en) | 2023-11-08 |
CN213240796U (zh) | 2021-05-18 |
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