JP2020528160A - レチクルを保持及び輸送するための、透明窓アセンブリを有する容器 - Google Patents
レチクルを保持及び輸送するための、透明窓アセンブリを有する容器 Download PDFInfo
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- 229920000642 polymer Polymers 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 7
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 238000007872 degassing Methods 0.000 description 5
- 229920002313 fluoropolymer Polymers 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Plasma & Fusion (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
いくつかの実施形態では、内側ベース板には、ツール(tool)による窓アセンブリの除去を容易にするために切欠き凹部が形成される。内側ベース板はまた、保持器を収容するために境界面にアンダーカット領域を含む。
Claims (20)
- レチクルを輸送するためのポッドであって、
カバーと、
レチクルを取り付けるための空間を確立するように前記カバーと協働するように構成された内側ベース板とを含み、前記内側ベース板は、
境界面を有する穴、
前記境界面から内方に延び、取り付け面を有する第1のフランジ、
前記境界面から内方に延びる第2のフランジ、及び
前記穴内に取り付けられるように構成された窓アセンブリを含み、前記窓アセンブリは、
内側平坦面、外側平坦面及び側面平坦面を有する透明板であって、前記内側平坦面が前記取り付け面に接触するように構成された、透明板と、
前記透明板の外側平坦面又は側面平坦面に接触するシールであって、前記穴の境界面に接触し、前記窓アセンブリと前記穴との間の界面を密閉するように構成されたシールと、
前記第2のフランジに接触し、前記シール及び透明板を前記穴内に保持するように構成された保持器と、を有する、ポッド。 - 前記保持器はポリマーで作られる、請求項1に記載のポッド。
- 前記保持器は止め輪である、請求項1に記載のポッド。
- 前記窓アセンブリはワッシャを有する、請求項3に記載のポッド。
- 前記止め輪はステンレス鋼で作られ、前記ワッシャはステンレス鋼で作られる、請求項4に記載のポッド。
- 前記透明板は角丸矩形であるか、又は円形である、請求項1に記載のポッド。
- 前記保持器は、前記第2のフランジに接触するように、且つ前記シール及び透明板を前記穴内に着脱可能に保持するように構成される、請求項1に記載のポッド。
- 前記内側ベース板には、ツールによる前記窓アセンブリの除去を容易にするための切欠き凹部と、前記保持器を収容するための前記境界面におけるアンダーカット領域とが形成される、請求項1に記載のポッド。
- 前記透明板はポッドの外側から前記内側ベース板に支持されるレチクルの視認を容易にするように構成される、請求項1に記載のポッド。
- 境界面を備えた穴、前記境界面から内方に延び、取り付け面を有する第1のフランジ、及び前記境界面から内方に延びる第2のフランジを有する内側ベース板に取り付けられるように構成された窓アセンブリであって、
内側平坦面、外側平坦面及び側面平坦面を有する透明板であって、前記内側平坦面は前記取り付け面に接触するように構成された、透明板と、
前記透明板の外側平坦面又は側面平坦面に接触するシールであって、前記穴の境界面に接触し、前記窓アセンブリと前記穴との間の界面を密閉するように構成されたシールと、
前記第2のフランジに接触し、前記シール及び透明板を前記穴内に保持するように構成された保持器と、を含む、窓アセンブリ。 - 前記保持器はポリマーで作られる、請求項10に記載の窓アセンブリ。
- 前記保持器は止め輪である、請求項10に記載の窓アセンブリ。
- ワッシャをさらに含む、請求項12に記載の窓アセンブリ。
- 前記止め輪はステンレス鋼で作られ、前記ワッシャはステンレス鋼で作られる、請求項13に記載の窓アセンブリ。
- 前記透明板は角丸矩形であるか、又は円形である、請求項10に記載の窓アセンブリ。
- 前記保持器は、前記第2のフランジに接触するように、且つ前記シール及び透明板を前記穴内に着脱可能に保持するように構成される、請求項10に記載の窓アセンブリ。
- レチクルを輸送するためのポッドの内側ベース板内に窓アセンブリを取り付ける方法であって、前記内側ベース板は、境界面を有する穴、前記境界面から内方に延び、取り付け面を有する第1のフランジ、及び前記境界面から内方に延びる第2のフランジを含み、前記方法は、
内側平坦面、外側平坦面及び側面平坦面を有する透明板を、前記内側平坦面が前記取り付け面に接触するように配置する工程と、
前記窓アセンブリと前記穴との間の界面を密閉するために、シールを前記透明板の外側平坦面又は側面平坦面と前記穴の境界面とに接触させる工程と、
前記シール及び透明板を前記穴内に保持するために、保持器を前記第2のフランジに接触させる工程と、を含む、方法。 - 前記保持器を前記第2のフランジに接触させる工程は、前記保持器を境界面における内側ベース板のアンダーカット部分内に配置する工程を含む、請求項17に記載の方法。
- 前記保持器により前記シールを圧縮する工程をさらに含む、請求項17に記載の方法。
- 前記窓アセンブリと前記穴との間の界面を密閉するために前記シールにより前記透明板を加圧する工程と、前記内側ベース板に支持されたレチクルをポッドの外側から視認できるようにする工程と、をさらに含む、請求項17に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201762535660P | 2017-07-21 | 2017-07-21 | |
US62/535,660 | 2017-07-21 | ||
PCT/US2018/042275 WO2019018281A1 (en) | 2017-07-21 | 2018-07-16 | CONTAINER FOR CONTAINING AND TRANSPORTING RETICLES HAVING A TRANSPARENT WINDOW ASSEMBLY |
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JP2020528160A true JP2020528160A (ja) | 2020-09-17 |
JP6796741B2 JP6796741B2 (ja) | 2020-12-09 |
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Country Status (6)
Country | Link |
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US (1) | US11914287B2 (ja) |
JP (1) | JP6796741B2 (ja) |
KR (1) | KR102398973B1 (ja) |
CN (1) | CN110945434B (ja) |
TW (1) | TWI699849B (ja) |
WO (1) | WO2019018281A1 (ja) |
Cited By (1)
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JP2022551521A (ja) * | 2019-10-10 | 2022-12-09 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
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DE102019117484B4 (de) | 2019-06-28 | 2021-07-08 | Carl Zeiss Smt Gmbh | Verfahren und Anordnung zum Laden einer Komponente in eine Ladeposition in einem optischen System für die Mikrolithographie |
US11314164B2 (en) * | 2019-12-31 | 2022-04-26 | Taiwan Semiconductor Manufacturing Company Ltd. | Structure and method of reticle pod having inspection window |
TWI755795B (zh) * | 2020-07-23 | 2022-02-21 | 家登精密工業股份有限公司 | 具有導位構件的光罩盒 |
US20220100106A1 (en) * | 2020-09-30 | 2022-03-31 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
US11874596B2 (en) * | 2020-09-30 | 2024-01-16 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
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- 2018-07-16 JP JP2020502632A patent/JP6796741B2/ja active Active
- 2018-07-16 KR KR1020207004684A patent/KR102398973B1/ko active IP Right Grant
- 2018-07-16 CN CN201880049119.4A patent/CN110945434B/zh active Active
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- 2018-07-16 WO PCT/US2018/042275 patent/WO2019018281A1/en active Application Filing
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JP2022551521A (ja) * | 2019-10-10 | 2022-12-09 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
JP7379689B2 (ja) | 2019-10-10 | 2023-11-14 | インテグリス・インコーポレーテッド | 窓付きレチクルポッド |
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CN110945434B (zh) | 2022-06-21 |
JP6796741B2 (ja) | 2020-12-09 |
KR20200020981A (ko) | 2020-02-26 |
TW201921565A (zh) | 2019-06-01 |
US11914287B2 (en) | 2024-02-27 |
TWI699849B (zh) | 2020-07-21 |
CN110945434A (zh) | 2020-03-31 |
KR102398973B1 (ko) | 2022-05-17 |
US20200159109A1 (en) | 2020-05-21 |
WO2019018281A1 (en) | 2019-01-24 |
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