TWI699849B - 具有一透明窗總成之用於固持及傳送光罩的容器 - Google Patents
具有一透明窗總成之用於固持及傳送光罩的容器 Download PDFInfo
- Publication number
- TWI699849B TWI699849B TW107125196A TW107125196A TWI699849B TW I699849 B TWI699849 B TW I699849B TW 107125196 A TW107125196 A TW 107125196A TW 107125196 A TW107125196 A TW 107125196A TW I699849 B TWI699849 B TW I699849B
- Authority
- TW
- Taiwan
- Prior art keywords
- window assembly
- hole
- seal
- flat surface
- flange
- Prior art date
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Library & Information Science (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762535660P | 2017-07-21 | 2017-07-21 | |
US62/535,660 | 2017-07-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201921565A TW201921565A (zh) | 2019-06-01 |
TWI699849B true TWI699849B (zh) | 2020-07-21 |
Family
ID=65015495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107125196A TWI699849B (zh) | 2017-07-21 | 2018-07-20 | 具有一透明窗總成之用於固持及傳送光罩的容器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11914287B2 (ja) |
JP (1) | JP6796741B2 (ja) |
KR (1) | KR102398973B1 (ja) |
CN (1) | CN110945434B (ja) |
TW (1) | TWI699849B (ja) |
WO (1) | WO2019018281A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019117484B4 (de) | 2019-06-28 | 2021-07-08 | Carl Zeiss Smt Gmbh | Verfahren und Anordnung zum Laden einer Komponente in eine Ladeposition in einem optischen System für die Mikrolithographie |
EP4042242A4 (en) * | 2019-10-10 | 2023-11-08 | Entegris, Inc. | MASK HOLDER WITH WINDOW |
US11314164B2 (en) * | 2019-12-31 | 2022-04-26 | Taiwan Semiconductor Manufacturing Company Ltd. | Structure and method of reticle pod having inspection window |
TWI755795B (zh) * | 2020-07-23 | 2022-02-21 | 家登精密工業股份有限公司 | 具有導位構件的光罩盒 |
US20220100106A1 (en) * | 2020-09-30 | 2022-03-31 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
US11874596B2 (en) * | 2020-09-30 | 2024-01-16 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090103061A1 (en) * | 2004-10-29 | 2009-04-23 | Nikon Corporation | Reticle Protection Member, Reticle Carrying Device, Exposure Device and Method for Carrying Reticle |
US20130051785A1 (en) * | 2011-08-31 | 2013-02-28 | Benjamin J. Pope | Camera window assembly for electronic device |
US20140291198A1 (en) * | 2013-03-26 | 2014-10-02 | Gudeng Precision Industrial Co., Ltd. | Reticle pod having gas guiding apparatus |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
JP2000340642A (ja) | 1999-05-27 | 2000-12-08 | Nikon Corp | 基板収納ケース及びこれを用いる露光装置 |
JP2005086092A (ja) | 2003-09-10 | 2005-03-31 | Tokyo Seimitsu Co Ltd | 露光マスク収容器 |
JP4667018B2 (ja) | 2004-11-24 | 2011-04-06 | ミライアル株式会社 | レチクル搬送容器 |
US7808616B2 (en) * | 2005-12-28 | 2010-10-05 | Nikon Corporation | Reticle transport apparatus, exposure apparatus, reticle transport method, and reticle processing method |
US7591624B2 (en) * | 2006-01-09 | 2009-09-22 | International Business Machines Corporation | Reticle storage pod (RSP) transport system utilizing FOUP adapter plate |
JP4800155B2 (ja) * | 2006-09-04 | 2011-10-26 | 信越ポリマー株式会社 | 基板収納容器及び逆止弁 |
US7826729B2 (en) | 2007-09-17 | 2010-11-02 | Airmar Technology Corporation | Underwater camera assembly |
TWI414464B (zh) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | 具有固定結構之極紫外光光罩儲存傳送盒 |
TWI492622B (zh) * | 2011-08-31 | 2015-07-11 | Realtek Semiconductor Corp | 網路訊號接收系統與網路訊號接收方法 |
TWI501910B (zh) * | 2011-11-17 | 2015-10-01 | Gudeng Prec Ind Co Ltd | 具有排水結構之極紫外光光罩儲存傳送盒 |
US9715175B2 (en) * | 2012-06-15 | 2017-07-25 | Nikon Corporation | Mask protection device, exposure apparatus, and method for manufacturing device |
US10593577B2 (en) * | 2016-04-06 | 2020-03-17 | Entegris, Inc. | Substrate container with window retention spring |
-
2018
- 2018-07-16 WO PCT/US2018/042275 patent/WO2019018281A1/en active Application Filing
- 2018-07-16 CN CN201880049119.4A patent/CN110945434B/zh active Active
- 2018-07-16 US US16/631,121 patent/US11914287B2/en active Active
- 2018-07-16 KR KR1020207004684A patent/KR102398973B1/ko active IP Right Grant
- 2018-07-16 JP JP2020502632A patent/JP6796741B2/ja active Active
- 2018-07-20 TW TW107125196A patent/TWI699849B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090103061A1 (en) * | 2004-10-29 | 2009-04-23 | Nikon Corporation | Reticle Protection Member, Reticle Carrying Device, Exposure Device and Method for Carrying Reticle |
US20130051785A1 (en) * | 2011-08-31 | 2013-02-28 | Benjamin J. Pope | Camera window assembly for electronic device |
US20140291198A1 (en) * | 2013-03-26 | 2014-10-02 | Gudeng Precision Industrial Co., Ltd. | Reticle pod having gas guiding apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2019018281A1 (en) | 2019-01-24 |
JP6796741B2 (ja) | 2020-12-09 |
TW201921565A (zh) | 2019-06-01 |
JP2020528160A (ja) | 2020-09-17 |
US20200159109A1 (en) | 2020-05-21 |
US11914287B2 (en) | 2024-02-27 |
CN110945434A (zh) | 2020-03-31 |
CN110945434B (zh) | 2022-06-21 |
KR102398973B1 (ko) | 2022-05-17 |
KR20200020981A (ko) | 2020-02-26 |
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