JP2018056234A - プリント回路板、電子機器及びプリント回路板の製造方法 - Google Patents

プリント回路板、電子機器及びプリント回路板の製造方法 Download PDF

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Publication number
JP2018056234A
JP2018056234A JP2016188369A JP2016188369A JP2018056234A JP 2018056234 A JP2018056234 A JP 2018056234A JP 2016188369 A JP2016188369 A JP 2016188369A JP 2016188369 A JP2016188369 A JP 2016188369A JP 2018056234 A JP2018056234 A JP 2018056234A
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JP
Japan
Prior art keywords
solder
printed circuit
circuit board
lands
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016188369A
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English (en)
Japanese (ja)
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JP2018056234A5 (enExample
Inventor
邦彦 峰岸
Kunihiko Minegishi
邦彦 峰岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016188369A priority Critical patent/JP2018056234A/ja
Priority to US15/687,763 priority patent/US10076037B2/en
Priority to CN201710865333.4A priority patent/CN107872922B/zh
Publication of JP2018056234A publication Critical patent/JP2018056234A/ja
Publication of JP2018056234A5 publication Critical patent/JP2018056234A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2016188369A 2016-09-27 2016-09-27 プリント回路板、電子機器及びプリント回路板の製造方法 Pending JP2018056234A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016188369A JP2018056234A (ja) 2016-09-27 2016-09-27 プリント回路板、電子機器及びプリント回路板の製造方法
US15/687,763 US10076037B2 (en) 2016-09-27 2017-08-28 Printed circuit board, electronic device, and manufacturing method of printed circuit board
CN201710865333.4A CN107872922B (zh) 2016-09-27 2017-09-22 印刷电路板、电子设备以及印刷电路板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016188369A JP2018056234A (ja) 2016-09-27 2016-09-27 プリント回路板、電子機器及びプリント回路板の製造方法

Publications (2)

Publication Number Publication Date
JP2018056234A true JP2018056234A (ja) 2018-04-05
JP2018056234A5 JP2018056234A5 (enExample) 2019-11-07

Family

ID=61686008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016188369A Pending JP2018056234A (ja) 2016-09-27 2016-09-27 プリント回路板、電子機器及びプリント回路板の製造方法

Country Status (3)

Country Link
US (1) US10076037B2 (enExample)
JP (1) JP2018056234A (enExample)
CN (1) CN107872922B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019197886A (ja) * 2018-05-07 2019-11-14 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、及び電子機器
JP2019220679A (ja) * 2018-06-18 2019-12-26 キヤノン株式会社 電子モジュール、電子機器、電子モジュールの製造方法、及び電子機器の製造方法
KR20200066550A (ko) * 2018-11-30 2020-06-10 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
JP2020113626A (ja) * 2019-01-10 2020-07-27 株式会社デンソー 半導体装置およびその製造方法
US11121089B2 (en) 2018-11-30 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10398037B2 (en) 2017-02-20 2019-08-27 Canon Kabushiki Kaisha Printed circuit board and electronic device
US11382209B2 (en) 2018-05-07 2022-07-05 Canon Kabushiki Kaisha Method for manufacturing printed circuit board, printed circuit board, and electronic device
US10861785B2 (en) 2018-06-18 2020-12-08 Canon Kabushiki Kaisha Electronic module, electronic device, manufacturing method for electronic module, and manufacturing method for electronic device
CN111601456B (zh) * 2020-05-07 2021-11-19 合肥联宝信息技术有限公司 一种印刷电路板及电路的制造方法
JP7511180B2 (ja) * 2020-07-27 2024-07-05 パナソニックＩｐマネジメント株式会社 実装方法およびそれにより形成される実装構造体
CN114554722A (zh) * 2021-12-29 2022-05-27 中国航空工业集团公司西安航空计算技术研究所 一种表贴元器件可靠连接设计方法
CN115000024B (zh) * 2022-04-18 2023-09-08 锐石创芯(重庆)科技有限公司 一种芯片封装结构及方法

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JP2008016460A (ja) * 2006-06-30 2008-01-24 Toshiba Corp プリント回路板、電子機器
JP2008091649A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体装置
JP2008192815A (ja) * 2007-02-05 2008-08-21 Toshiba Corp 積層型半導体装置
JP2010225822A (ja) * 2009-03-24 2010-10-07 Panasonic Corp 電子部品接合方法および電子部品
JP2014175519A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 回路装置の製造方法、半導体部品の実装構造および回路装置
WO2016017076A1 (ja) * 2014-07-29 2016-02-04 パナソニックＩｐマネジメント株式会社 半導体実装品とその製造方法

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JP3554533B2 (ja) * 2000-10-13 2004-08-18 シャープ株式会社 チップオンフィルム用テープおよび半導体装置
JP3608536B2 (ja) * 2001-08-08 2005-01-12 松下電器産業株式会社 電子部品実装方法
US6986454B2 (en) * 2003-07-10 2006-01-17 Delphi Technologies, Inc. Electronic package having controlled height stand-off solder joint
CN100468673C (zh) * 2004-09-03 2009-03-11 松下电器产业株式会社 凸块形成方法及焊接凸块
CN100585822C (zh) * 2005-03-15 2010-01-27 松下电器产业株式会社 倒装片安装方法、凸起形成方法以及安装装置
JP4864591B2 (ja) * 2006-08-08 2012-02-01 神港精機株式会社 はんだ付け方法およびはんだ付け装置
JP5186741B2 (ja) * 2006-08-18 2013-04-24 富士通セミコンダクター株式会社 回路基板及び半導体装置
JP2008311458A (ja) * 2007-06-15 2008-12-25 Panasonic Corp 半導体装置実装構造体およびその製造方法ならびに半導体装置の剥離方法
KR101022942B1 (ko) * 2008-11-12 2011-03-16 삼성전기주식회사 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법
JP5168160B2 (ja) * 2009-01-15 2013-03-21 ソニー株式会社 半導体装置及び半導体装置の製造方法
JP6786781B2 (ja) * 2015-09-25 2020-11-18 日亜化学工業株式会社 発光装置の製造方法

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Publication number Priority date Publication date Assignee Title
JP2008016460A (ja) * 2006-06-30 2008-01-24 Toshiba Corp プリント回路板、電子機器
JP2008091649A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体装置
JP2008192815A (ja) * 2007-02-05 2008-08-21 Toshiba Corp 積層型半導体装置
JP2010225822A (ja) * 2009-03-24 2010-10-07 Panasonic Corp 電子部品接合方法および電子部品
JP2014175519A (ja) * 2013-03-11 2014-09-22 Panasonic Corp 回路装置の製造方法、半導体部品の実装構造および回路装置
WO2016017076A1 (ja) * 2014-07-29 2016-02-04 パナソニックＩｐマネジメント株式会社 半導体実装品とその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019197886A (ja) * 2018-05-07 2019-11-14 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、及び電子機器
JP7362286B2 (ja) 2018-05-07 2023-10-17 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、及び電子機器
JP2019220679A (ja) * 2018-06-18 2019-12-26 キヤノン株式会社 電子モジュール、電子機器、電子モジュールの製造方法、及び電子機器の製造方法
JP7366578B2 (ja) 2018-06-18 2023-10-23 キヤノン株式会社 電子モジュール及び電子機器
KR20200066550A (ko) * 2018-11-30 2020-06-10 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
US11121089B2 (en) 2018-11-30 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
KR102358285B1 (ko) * 2018-11-30 2022-02-04 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 반도체 패키지 디바이스 및 그 제조 방법
JP2020113626A (ja) * 2019-01-10 2020-07-27 株式会社デンソー 半導体装置およびその製造方法
JP7167721B2 (ja) 2019-01-10 2022-11-09 株式会社デンソー 半導体装置およびその製造方法

Also Published As

Publication number Publication date
CN107872922A (zh) 2018-04-03
US10076037B2 (en) 2018-09-11
US20180092211A1 (en) 2018-03-29
CN107872922B (zh) 2021-09-24

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