JP2017536429A - ディスプレイ密封材用組成物、これを含む有機保護層、およびこれらを含むディスプレイ装置 - Google Patents
ディスプレイ密封材用組成物、これを含む有機保護層、およびこれらを含むディスプレイ装置 Download PDFInfo
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- JP2017536429A JP2017536429A JP2017513132A JP2017513132A JP2017536429A JP 2017536429 A JP2017536429 A JP 2017536429A JP 2017513132 A JP2017513132 A JP 2017513132A JP 2017513132 A JP2017513132 A JP 2017513132A JP 2017536429 A JP2017536429 A JP 2017536429A
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- acrylate
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- 239000000203 mixture Substances 0.000 title claims abstract description 95
- 239000003566 sealing material Substances 0.000 title claims abstract description 74
- 239000011241 protective layer Substances 0.000 title claims description 102
- 239000000178 monomer Substances 0.000 claims abstract description 71
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 60
- 239000003999 initiator Substances 0.000 claims abstract description 25
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000003746 surface roughness Effects 0.000 claims abstract description 17
- 238000001020 plasma etching Methods 0.000 claims abstract description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052786 argon Inorganic materials 0.000 claims abstract description 6
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 131
- -1 X is a single bond Inorganic materials 0.000 claims description 55
- 125000004432 carbon atom Chemical group C* 0.000 claims description 43
- 150000002430 hydrocarbons Chemical class 0.000 claims description 40
- 239000004215 Carbon black (E152) Substances 0.000 claims description 39
- 229930195733 hydrocarbon Natural products 0.000 claims description 39
- 125000002947 alkylene group Chemical group 0.000 claims description 27
- 125000005842 heteroatom Chemical group 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 229910052717 sulfur Inorganic materials 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 239000012760 heat stabilizer Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 8
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 5
- 239000012965 benzophenone Substances 0.000 claims description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 244000028419 Styrax benzoin Species 0.000 claims description 4
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229960002130 benzoin Drugs 0.000 claims description 4
- 235000019382 gum benzoic Nutrition 0.000 claims description 4
- 239000011669 selenium Substances 0.000 claims description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 125000005641 methacryl group Chemical group 0.000 claims description 3
- 150000002923 oximes Chemical class 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- KVJXEZUAOMGUAG-UHFFFAOYSA-N (3-benzoyl-2-hydroxyphenyl) prop-2-enoate Chemical compound OC1=C(OC(=O)C=C)C=CC=C1C(=O)C1=CC=CC=C1 KVJXEZUAOMGUAG-UHFFFAOYSA-N 0.000 claims description 2
- YBSFSNBVMRWVNW-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)phenyl]phenoxy]ethyl prop-2-enoate Chemical group C=CC(=O)OCCOC1=CC=CC=C1C1=CC=CC=C1OCCOC(=O)C=C YBSFSNBVMRWVNW-UHFFFAOYSA-N 0.000 claims description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- QJVRMZMZVYNLGH-UHFFFAOYSA-N [4-[4-(prop-2-enoyloxymethyl)phenyl]phenyl]methyl prop-2-enoate Chemical group C1=CC(COC(=O)C=C)=CC=C1C1=CC=C(COC(=O)C=C)C=C1 QJVRMZMZVYNLGH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 229910001512 metal fluoride Inorganic materials 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 abstract description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 48
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 21
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000002834 transmittance Methods 0.000 description 12
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 229910052755 nonmetal Inorganic materials 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 8
- 125000004430 oxygen atom Chemical group O* 0.000 description 8
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 8
- 239000013557 residual solvent Substances 0.000 description 8
- 125000004434 sulfur atom Chemical group 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 6
- YYROPELSRYBVMQ-UHFFFAOYSA-N 4-toluenesulfonyl chloride Chemical compound CC1=CC=C(S(Cl)(=O)=O)C=C1 YYROPELSRYBVMQ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 125000006836 terphenylene group Chemical group 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004821 distillation Methods 0.000 description 5
- 238000004128 high performance liquid chromatography Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 229940061334 2-phenylphenol Drugs 0.000 description 4
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 125000006267 biphenyl group Chemical group 0.000 description 4
- 125000006840 diphenylmethane group Chemical group 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 235000010292 orthophenyl phenol Nutrition 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229910000027 potassium carbonate Inorganic materials 0.000 description 4
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 150000001733 carboxylic acid esters Chemical class 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 2
- UKRUNIUJAMCKER-UHFFFAOYSA-N 1-phenylethenylsulfanylbenzene Chemical group C=1C=CC=CC=1C(=C)SC1=CC=CC=C1 UKRUNIUJAMCKER-UHFFFAOYSA-N 0.000 description 2
- FVNIIPIYHHEXQA-UHFFFAOYSA-N 2-(4-methoxynaphthalen-1-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C12=CC=CC=C2C(OC)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 FVNIIPIYHHEXQA-UHFFFAOYSA-N 0.000 description 2
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 2
- UMTXKRPANUNUCO-UHFFFAOYSA-N 2-[4-(2-phenylpropan-2-yl)phenoxy]ethyl prop-2-enoate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=CC=C1 UMTXKRPANUNUCO-UHFFFAOYSA-N 0.000 description 2
- 125000003006 2-dimethylaminoethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
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- 125000004386 diacrylate group Chemical group 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
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- 239000000741 silica gel Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- FJKOQFIGFHTRRW-UHFFFAOYSA-N (2-methoxy-3-methylphenyl)-(3-methylphenyl)methanone Chemical compound COC1=C(C)C=CC=C1C(=O)C1=CC=CC(C)=C1 FJKOQFIGFHTRRW-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- IXJJELULBDAIMY-UHFFFAOYSA-N 1,2,5,6-tetrahydrotriazine Chemical compound C1CC=NNN1 IXJJELULBDAIMY-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- BUZYGTVTZYSBCU-UHFFFAOYSA-N 1-(4-chlorophenyl)ethanone Chemical compound CC(=O)C1=CC=C(Cl)C=C1 BUZYGTVTZYSBCU-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
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- 150000003624 transition metals Chemical class 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JBWKIWSBJXDJDT-UHFFFAOYSA-N triphenylmethyl chloride Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(Cl)C1=CC=CC=C1 JBWKIWSBJXDJDT-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- GRXOWOKLKIZFNP-UHFFFAOYSA-N undecane-1,1-diol Chemical compound CCCCCCCCCCC(O)O GRXOWOKLKIZFNP-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- RXBXBWBHKPGHIB-UHFFFAOYSA-L zinc;diperchlorate Chemical compound [Zn+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O RXBXBWBHKPGHIB-UHFFFAOYSA-L 0.000 description 1
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Abstract
Description
置換または非置換の2個以上のフェニル基を有するモノマー;および、
芳香族炭化水素基を有しないモノマー、
を含み、
下記数式1で表されるプラズマエッチング率が約400nm/min以下であり、表面粗さ(roughness)が約2nm以下である。
T0は、基材上に前記ディスプレイ密封材用組成物をスプレーで塗布し、紫外線を約100mW/cm2で約10秒間照射し硬化させて製造されたサンプルの厚さ(nm)であり、
T1は、前記製造されたサンプルを2500W ICP電源、300W RF電源、DCバイアス200V、アルゴン(Ar)流量50sccm、10mtorrの圧力条件で1分間プラズマ処理した後の厚さ(nm)であり、
前記T0およびT1は、基材の厚さを除いた厚さを表したもので、Mはプラズマ処理時間(min)である。
以下、添付した図面を参照して、本出願の具体例をより詳しく説明する。しかし、本出願に開示されている技術は、ここで説明される具体例に限定されず、他の形態で具体化することもできる。単に、ここで紹介する具体例は、開示されている内容が徹底して完全になるように、そして、当業者に本出願の思想が十分に伝達されるようにするために提供されるものである。図面において、各構成要素を明確に表現するために構成要素の幅や厚さ等の大きさをある程度拡大して表している。また、説明の便宜のため、構成要素の一部のみを図示したりもしたが、当業者であれば構成要素の残りの部分についても容易に把握できる。また、該当分野において通常の知識を有する者であれば、本出願の技術的思想を逸脱しない範囲内で、本出願の思想を多様な他の形態で具現できると考える。
置換または非置換の2個以上のフェニル基を有するモノマー;および、
芳香族炭化水素基を有しないモノマー、
を含み、
下記数式1で表されるプラズマエッチング率が約400nm/min以下であり、表面粗さ(roughness)が約2nm以下であるものでもよい。
T0は、基材上にディスプレイ密封材用組成物をスプレ−で塗布し、紫外線を100mW/cm2で10秒間照射し硬化させて製造されたサンプルの厚さ(nm)であり、
T1は、前記製造されたサンプルを2500W ICP電源、300W RF電源、DCバイアス200V、アルゴン(Ar)流量50sccm、10mtorrの圧力条件で1分間プラズマ処理した後の厚さ(nm)であり、
前記T0およびT1は、基材厚さを除いた厚さを表したものであり、Mは、プラズマ処理時間(min)である。
Z1、Z2は、それぞれ独立して下記化学式2で表され、
a、bはそれぞれ0ないし2の整数で、a+bは1ないし4の整数である。
Xは単結合、酸素原子、または硫黄原子であり、
Yは、置換または非置換の炭素数1ないし10の直鎖状アルキレン基または置換または非置換の炭素数1ないし20のアルコキシ基であり、
R1は、水素または炭素数1ないし5のアルキル基であり、
cは0または1である。
(実施例)
以下、実施例、比較例および試験例を挙げて本発明の構成および効果をより具体的に説明する。しかし、これらの実施例、比較例および試験例は、本発明に対する理解を助けるために例示の目的としてのみ提供されただけで、本発明の範疇および範囲が、下記実施例、比較例および試験例によって制限されるものではない。
冷却管と攪拌機とを備えた3000mlの反応基にジクロロメタン(dichloromethane、シグマアルドリッチ社)300mlを入れ、4−ヒドロキシブチルアクリレート(4−hydroxibutyl acrylate、新中村化学工業株式会社)200gとトリエチルアミン168gとを入れ、フラスコ内の温度を0℃に下げた後、p−トルエンスルホニルクロライド(p−toluene sulfonyl chloride、シグマアルドリッチ社)278gをジクロロメタン500mlに溶かした溶液を2時間滴下して攪拌した。さらに5時間攪拌後、残留溶媒を蒸留で除去した。得られた化合物300gをアセトニトリル(acetonitrile、シグマアルドリッチ社)1000mlに入れて炭酸カリウム(potassium carbonate、シグマアルドリッチ社)220gと2−フェニルフェノール(2−phenylphonol、シグマアルドリッチ社)141gを追加して80℃で攪拌した。残留溶媒と反応残留物を除去して、下記式5の化合物(分子量296.36)をHPLC純度93%で得た。
冷却管と攪拌機とを備えた2000mlのフラスコにジクロロメタン(dichloromethane、シグマアルドリッチ社)600mlを入れてヒドロキシエチルメタアクリレート(hydroxyethyl methacrylate、シグマアルドリッチ社)58.8gとトリエチルアミン(triethylamine、シグマアルドリッチ社)52.2gを0℃で攪拌しながら、トリフェニルクロロメタン(triphenyl chloromethane、シグマアルドリッチ社)100gをゆっくり添加した。温度を25℃に上げた後、4時間攪拌した。ジクロロメタンを減圧蒸留して除去した後、シリカゲルカラムによって下記式6の化合物124gをHPLC純度97%で得た。
冷却管と攪拌機とを備えた2000mlのフラスコにアセトニトリル(acetonitrile、フィッシャー社)800mlを入れて炭酸カリウム(potassium carbonate、シグマアルドリッチ社)180gとアクリル酸108gを0℃で攪拌しながら、4,4’−ビス(クロロメチル)ビフェニル(4,4’−bis(chloromethyl)biphenyl、TCI社)150gをゆっくり添加した。温度を70℃に上げた後、12時間攪拌した。アセトニトリルを減圧蒸留して除去した後、シリカゲルカラムによって下記式7の化合物177gをHPLC純度97%で得た。
冷却管と攪拌機とを備えた3000mlの反応基にジクロロメタン(dichloromethane、シグマアルドリッチ社)300mlを入れ、ヒドロキシエチルアクリレート(hydroxiethyl acrylate、新中村化学工業株式会社)200gとトリエチルアミン168gとを入れ、フラスコ内の温度を0℃に下げた後、p−トルエンスルホニルクロライド(p−toluene sulfonyl chloride、シグマアルドリッチ社)278gをジクロロメタン500mlに溶かした溶液を2時間滴下して攪拌した。さらに5時間攪拌後、残留溶媒を蒸留で除去した。得られた化合物300gをアセトニトリル(acetonitrile、シグマアルドリッチ社)1000mlに入れて炭酸カリウム(potassim carbonate、シグマアルドリッチ社)220gと2−フェニルフェノール(2−phenylphonol、シグマアルドリッチ社)141gを追加して80℃で攪拌した。残留溶媒と反応残留物を除去して、下記式8の化合物(分子量296.36)をHPLC純度93%で得た。
冷却管と攪拌機とを備えた3000mlの反応基にジクロロメタン(dichloromethane、シグマアルドリッチ社)300mlを入れ、ヒドロキシエチルアクリレート(hydroxyethyl acrylate、シグマアルドリッチ社)400gとトリエチルアミン168gを入れ、フラスコ内の温度を0℃に下げた後、p−トルエンスルホニルクロライド(p−toluene sulfonyl chloride、シグマアルドリッチ社)278gをジクロロメタン500mlに溶かした溶液を2時間滴下して攪拌した。さらに5時間攪拌後、残留溶媒を蒸留で除去した。得られた化合物300gをアセトニトリル(acetonitrile、シグマアルドリッチ社)1000mlに入れ、炭酸カリウム(potassium carbonate、シグマアルドリッチ社)220gと2,2’−ビスフェノール(2,2’−bisphonol、シグマアルドリッチ社)141gを追加して80℃で攪拌した。残留溶媒と反応残留物を除去して、下記式9の化合物(分子量382.41)をHPLC純度91%で得た。
冷却管と攪拌機とを備えた1000mlの反応基にベンゼンチオール(benzene thiol)100g、ジクロロメタン(dichloromethane、シグマアルドリッチ社)200mlに過塩素酸亜鉛(zinc perchlorate、シグマアルドリッチ社)8.2gを入れて攪拌しながら、スチレンオキシド(strene oxide、シグマアルドリッチ社)109.05gをゆっくり滴下して常温で反応を進行する。4時間後、水とジクロロメタンを用いて無機物を除去した後、残留溶媒を蒸留して192gの1次生成物を得た。2000mlの反応基に得られた1次生成物150gとトリエチルアミン(triethylamine、シグマアルドリッチ社)70.31g、ジクロロメタン500mlを0℃で攪拌しながら、塩化アクリル(acryloyl chloride、シグマアルドリッチ社)64.84gをゆっくり滴下して反応を進めた。滴下が完了した後、温度をゆっくり常温に上げた後、さらに4時間攪拌する。反応終了後、ノルマルヘキサン(n−hexane、大井化金株式会社)で精製して塩と不純物を除去し、残留溶剤を減圧蒸留して下記式10の化合物(分子量284.37)をHPLC純度85%で得た。
(a1)ドデカンジオ−ルジメタアクリレート(dodecandiol dimethacrylate、サートマー社)
(a2)トリエチレングリコ−ルジメタアクリレート(triethylene glycol dimethacrylate、BASF社)
(a3)トリメチロールプロパントリアクリレート(trimethylolpropane triacrylate、BASF社)
(a4)2−ジメチルアミノエチルアクリレート(2−dimethylaminoethyl acrylate、アクロス株式会社)
(B)置換または非置換の2個以上のフェニル基を有するモノマー:
(b1)製造例1のモノマー
(b2)製造例2のモノマー
(b3)製造例3のモノマー
(b4)製造例4のモノマー
(b5)製造例5のモノマー
(b6)製造例6のモノマー
(b7)CP−011(4−クミルフェノキシエチルアクリレート、韓農化成株式会社)
(b8)ビスフェノールAジメタクリレート(bisphenol A dimethacrylate、アルドリッチ社)
(b9)BPM−102(ビスフェノールAエトキシ化(10)ジメタクリレート、韓農化成株式会社)
(b10)ビスフェノールFエトキシレート(2)ジアクリレート(bisphenol F ethoxylate(2)diacrylate、アルドリッチ社)
(C)光開始剤:リン系開始剤(Darocur TPO、BASF社)。
(a1)90重量部、(b1)10重量部および(C)5重量部を125ml茶色ポリプロピレンボトルに入れ、シェイカーを用いて3時間攪拌し、実施例1のディスプレイ密封材用組成物を製造した。
各成分の種類および含量を下記表1ないし表3に記載した通りに用いたことを除いては、実施例1と同様の方法でディスプレイ密封材用組成物を製造した。
(1)プラズマエッチング率(%):厚さ525±5μmのシリコンウェハー上に前記実施例および比較例のディスプレイ密封材用組成物をスプレーで塗布し、紫外線を100mW/cm2で10秒間照射して硬化させて形成された、有機保護層の厚さ5μmの試片を製造した。製造された試片をICPドライエッチャー(プラズマラボシステム133、オックスフォード・インストゥルメンツ株式会社)を用いてICP電力2500W、RE電力300W、DCバイアス200V、Arフロー50sccm、圧力10mtorrの条件で、アルゴンガスを1分間プラズマ処理した。プラズマエッチング率は、プラズマ処理前の有機保護層の厚さ(T0)と処理後の有機保護層の厚さ(T1)とを測定して、下記式1によって計算し、下記表1ないし3に結果を表した。前記T0およびT1は、基材厚さを除いた厚さを表し、Mはプラズマ処理時間(min)である。
Xは単結合、酸素原子、または硫黄原子であり、
Yは、置換または非置換の炭素数1ないし10の直鎖状アルキレン基または置換または非置換の炭素数1ないし20のアルコキシレン基であり、
R1は、水素または炭素数1ないし5のアルキル基であり、
cは0または1である。
Claims (14)
- 光硬化性モノマーおよび光重合開始剤を含むディスプレイ密封材用組成物であって、
前記光硬化性モノマーは、
芳香族炭化水素基を有しないモノマー;および、
置換または非置換の2個以上のフェニル基を有するモノマー、
を含み、
下記数式1で表されるプラズマエッチング率が約400nm/min以下であり、原子間力顕微鏡によって測定された表面粗さ(roughness)が、約2nm以下であるディスプレイ密封材用組成物:
T0は、基材上に前記ディスプレイ密封材用組成物をスプレーで塗布し、紫外線を100mW/cm2で10秒間照射し硬化させて製造されたサンプルの厚さ(nm)であり、
T1は、前記製造されたサンプルを2500W ICP電源、300W RF電源、DCバイアス200V、アルゴン(Ar)流量50sccm、10mtorrの圧力条件で1分間プラズマ処理した後の厚さ(nm)であり、
前記T0およびT1は、基材厚さを除いた厚さを表したものであり、Mはプラズマ処理時間(min)である)。 - 前記置換または非置換の2個以上のフェニル基を有するモノマーは、下記式1の構造を含む、請求項1に記載のディスプレイ密封材用組成物:
Z1、Z2は、それぞれ独立して、下記化学式2で表され、
a、bはそれぞれ0ないし2の整数であり、a+bは1ないし4の整数である。)
Xは、単結合、OまたはSであり、
Yは、置換もしくは非置換の炭素数1ないし10の直鎖状アルキレン基、または置換もしくは非置換の炭素数1ないし20のアルコキシ基であり、
R1は、水素または炭素数1ないし5のアルキル基であり、
cは、0または1である。) - 前記置換または非置換の2個以上のフェニル基を有するモノマーは、4−(メタ)アクリルオキシ−2−ヒドロキシベンゾフェノン、エチル−3,3−ジフェニル(メタ)アクリレート、ベンゾイルオキシフェニル(メタ)アクリレート、ビスフェノールAジ(メタ)アクリレート、エトキシ化ビスフェノールAジ(メタ)アクリレート、2−フェニルフェノキシエチル(メタ)アクリレート、2,2’−フェニルフェノキシエチルジ(メタ)アクリレート、2−フェニルフェノキシプロピル(メタ)アクリレート、2,2’−フェニルフェノキシプロピルジ(メタ)アクリレート、2−フェニルフェノキシブチル(メタ)アクリレート、2,2’−フェニルフェノキシブチルジ(メタ)アクリレート、2−(3−フェニルフェニル)エチル(メタ)アクリレート、2−(4−ベンジルフェニル)エチル(メタ)アクリレート、2−フェニル−2−(フェニルチオ)エチル(メタ)アクリレート、2−(トリフェニルメチルオキシ)エチル(メタ)アクリレート、4−(トリフェニルメチルオキシ)ブチル(メタ)アクリレート、3−(ビフェニル−2−イルオキシ)ブチル(メタ)アクリレート、2−(ビフェニル−2−イルオキシ)ブチル(メタ)アクリレート、4−(ビフェニル−2−イルオキシ)プロピル(メタ)アクリレート、3−(ビフェニル−2−イルオキシ)プロピル(メタ)アクリレート、2−(ビフェニル−2−イルオキシ)プロピル(メタ)アクリレート、4−(ビフェニル−2−イルオキシ)エチル(メタ)アクリレート、3−(ビフェニル−2−イルオキシ)エチル(メタ)アクリレート、2−(4−ベンジルフェニル)エチル(メタ)アクリレート、4,4’−ジ(アクリロイルオキシメチル)ビフェニル、2,2’−ジ(2−アクリロイルオキシエトキシ)ビフェニル、これらの構造異性体、またはこれらの混合物のいずれか一つである、請求項1に記載のディスプレイ密封材用組成物。
- 前記置換または非置換の2個以上のフェニル基を有するモノマーは、重量平均分子量が約100g/molないし約1000g/molである、請求項1に記載のディスプレイ密封材用組成物。
- 前記芳香族炭化水素基を有しないモノマーは、ビニル基、アクリル基、メタクリル基のうち一つ以上を1個ないし3個有するモノマーである、請求項1に記載のディスプレイ密封材用組成物。
- 前記光硬化性モノマー中、前記置換または非置換の2個以上のフェニル基を有するモノマーを約5重量%ないし約45重量%で含む、請求項1に記載のディスプレイ密封材用組成物。
- 前記光硬化性モノマー中、前記芳香族炭化水素基を有しないモノマーを約55重量%ないし約95重量%で含む、請求項1に記載のディスプレイ密封材用組成物。
- 前記光硬化性モノマーは、C、H、O、NまたはSから選ばれる元素のみからなる、請求項1に記載のディスプレイ密封材用組成物。
- 前記光重合開始剤は、トリアジン系、アセトフェノン系、ベンゾフェノン系、チオキサントン系、ベンゾイン系、リン系、オキシム系の中から選ばれる1種以上である、請求項1に記載のディスプレイ密封材用組成物。
- 熱安定剤をさらに含むものである、請求項1に記載のディスプレイ密封材用組成物。
- 前記熱安定剤は、前記ディスプレイ密封材用組成物中に、固形分基準で、約100ppmないし約1000ppmで含むものである、請求項10に記載のディスプレイ密封材用組成物。
- ディスプレイ部材および前記ディスプレイ部材上に形成された複合保護層を含み、前記複合保護層は、無機保護層および有機保護層を含み、前記有機保護層は、請求項1ないし請求項9のいずれか一項のディスプレイ密封材用組成物の硬化物を含むディスプレイ装置。
- 前記無機保護層は、金属、金属酸化物、金属フッ化物、金属窒化物、金属酸窒化物、金属ホウ化物、金属酸ホウ化物、金属シリサイドから選ばれる1種以上を含み、
前記金属は、シリコン(Si)、アルミニウム(Al)、セレニウム(Se)、亜鉛(Zn)、アンチモン(Sb)、インジウム(In)、ゲルマニウム(Ge)、スズ(Sn)、ビスマス(Bi)、遷移金属、ランタノイド金属の中から選ばれる1種以上を含む、請求項12に記載のディスプレイ装置。 - 前記ディスプレイ部材は、LED(light emitting diode)、OLED(Organic light emitting diode)、OLED照明(light instrument)またはLED照明である、請求項12に記載のディスプレイ装置。
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KR101871549B1 (ko) | 2018-07-03 |
US20170342172A1 (en) | 2017-11-30 |
JP6575971B2 (ja) | 2019-09-18 |
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US20170298164A1 (en) | 2017-10-19 |
TWI593736B (zh) | 2017-08-01 |
CN107155328B (zh) | 2022-05-31 |
CN107075033B (zh) | 2022-05-31 |
TW201617394A (zh) | 2016-05-16 |
US10570220B2 (en) | 2020-02-25 |
JP6670833B2 (ja) | 2020-03-25 |
KR20160053750A (ko) | 2016-05-13 |
US10316112B2 (en) | 2019-06-11 |
TWI588198B (zh) | 2017-06-21 |
CN107155328A (zh) | 2017-09-12 |
KR20160053751A (ko) | 2016-05-13 |
TW201625729A (zh) | 2016-07-16 |
CN107075033A (zh) | 2017-08-18 |
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