WO2016068414A1 - 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치 - Google Patents
디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치 Download PDFInfo
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- WO2016068414A1 WO2016068414A1 PCT/KR2015/003614 KR2015003614W WO2016068414A1 WO 2016068414 A1 WO2016068414 A1 WO 2016068414A1 KR 2015003614 W KR2015003614 W KR 2015003614W WO 2016068414 A1 WO2016068414 A1 WO 2016068414A1
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- substituted
- meth
- acrylate
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- 239000000203 mixture Substances 0.000 title claims abstract description 89
- 239000003566 sealing material Substances 0.000 title claims abstract description 23
- 239000000178 monomer Substances 0.000 claims abstract description 81
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 51
- 239000003999 initiator Substances 0.000 claims abstract description 23
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 132
- 239000011241 protective layer Substances 0.000 claims description 103
- -1 benzoyloxyphenyl Chemical group 0.000 claims description 50
- 125000004432 carbon atom Chemical group C* 0.000 claims description 33
- 239000008393 encapsulating agent Substances 0.000 claims description 31
- 239000004215 Carbon black (E152) Substances 0.000 claims description 29
- 229930195733 hydrocarbon Natural products 0.000 claims description 29
- 150000002430 hydrocarbons Chemical class 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- 125000002947 alkylene group Chemical group 0.000 claims description 19
- 125000005842 heteroatom Chemical group 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- 239000000565 sealant Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000012760 heat stabilizer Substances 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000012965 benzophenone Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 244000028419 Styrax benzoin Species 0.000 claims description 4
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 229960002130 benzoin Drugs 0.000 claims description 4
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 claims description 4
- 235000019382 gum benzoic Nutrition 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 239000011669 selenium Substances 0.000 claims description 4
- 125000006836 terphenylene group Chemical group 0.000 claims description 4
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 125000006267 biphenyl group Chemical group 0.000 claims description 3
- 125000006840 diphenylmethane group Chemical group 0.000 claims description 3
- 150000002923 oximes Chemical class 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- QJVRMZMZVYNLGH-UHFFFAOYSA-N [4-[4-(prop-2-enoyloxymethyl)phenyl]phenyl]methyl prop-2-enoate Chemical group C1=CC(COC(=O)C=C)=CC=C1C1=CC=C(COC(=O)C=C)C=C1 QJVRMZMZVYNLGH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 150000001721 carbon Chemical class 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 2
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 2
- KVJXEZUAOMGUAG-UHFFFAOYSA-N (3-benzoyl-2-hydroxyphenyl) prop-2-enoate Chemical compound OC1=C(OC(=O)C=C)C=CC=C1C(=O)C1=CC=CC=C1 KVJXEZUAOMGUAG-UHFFFAOYSA-N 0.000 claims 1
- BSODYJGWJACDKZ-UHFFFAOYSA-N 2-[4-[4-(2-prop-2-enoyloxyethoxy)phenyl]phenoxy]ethyl prop-2-enoate Chemical group C1=CC(OCCOC(=O)C=C)=CC=C1C1=CC=C(OCCOC(=O)C=C)C=C1 BSODYJGWJACDKZ-UHFFFAOYSA-N 0.000 claims 1
- 125000003860 C1-C20 alkoxy group Chemical group 0.000 claims 1
- 150000008062 acetophenones Chemical class 0.000 claims 1
- 150000008366 benzophenones Chemical class 0.000 claims 1
- 229910001512 metal fluoride Inorganic materials 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
- 150000003918 triazines Chemical class 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 33
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 18
- 239000010410 layer Substances 0.000 description 16
- 230000003746 surface roughness Effects 0.000 description 16
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- 238000002834 transmittance Methods 0.000 description 15
- 238000002360 preparation method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 229910052755 nonmetal Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 8
- 239000013557 residual solvent Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- YYROPELSRYBVMQ-UHFFFAOYSA-N 4-toluenesulfonyl chloride Chemical compound CC1=CC=C(S(Cl)(=O)=O)C=C1 YYROPELSRYBVMQ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000004128 high performance liquid chromatography Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 150000002843 nonmetals Chemical class 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229910000027 potassium carbonate Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTUVQQKHBMGYEH-UHFFFAOYSA-N 2-(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC=NC=N1 QTUVQQKHBMGYEH-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 3
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- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 125000004434 sulfur atom Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 2
- UMTXKRPANUNUCO-UHFFFAOYSA-N 2-[4-(2-phenylpropan-2-yl)phenoxy]ethyl prop-2-enoate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=CC=C1 UMTXKRPANUNUCO-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 2
- 125000003006 2-dimethylaminoethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- 229940061334 2-phenylphenol Drugs 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
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- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- GTZOYNFRVVHLDZ-UHFFFAOYSA-N dodecane-1,1-diol Chemical compound CCCCCCCCCCCC(O)O GTZOYNFRVVHLDZ-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
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- 150000005846 sugar alcohols Polymers 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- GRXOWOKLKIZFNP-UHFFFAOYSA-N undecane-1,1-diol Chemical compound CCCCCCCCCCC(O)O GRXOWOKLKIZFNP-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- FJKOQFIGFHTRRW-UHFFFAOYSA-N (2-methoxy-3-methylphenyl)-(3-methylphenyl)methanone Chemical compound COC1=C(C)C=CC=C1C(=O)C1=CC=CC(C)=C1 FJKOQFIGFHTRRW-UHFFFAOYSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
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- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
Definitions
- the present invention relates to a composition for a display encapsulant, an organic protective layer comprising the same, and a display device including the same.
- Organic electroluminescent devices used in an optical display device are susceptible to deterioration or deterioration of properties under the influence of an environment such as moisture or gas.
- the interface between the metal field and the organic light emitting layer may be peeled off under the influence of moisture.
- the metal may be highly resistant to oxidation of the metal, and the organic material itself may be altered by moisture or oxygen.
- oxidation of the organic material and the electrode material may be caused by the outgas generated from the outside or the inside, thereby reducing the light emission characteristics of the organic EL device. Therefore, the organic electroluminescent device should be encapsulated with a composition for encapsulation that protects it from moisture or oxygen.
- the organic electroluminescent element is encapsulated in a multilayer structure in which an inorganic protective layer and an organic protective layer are formed.
- the inorganic protective layer is formed by deposition by plasma, in which the organic protective layer may be etched by the plasma. Such etching may damage the encapsulation function of the organic protective layer.
- the organic light emitting diode may have low luminous properties and may have low reliability.
- the problem to be solved by the present invention is to provide a composition for a display sealing material that can implement an organic protective layer with high plasma resistance.
- Another problem to be solved by the present invention is to provide a composition for a display encapsulant that can implement an organic protective layer having a significantly low moisture permeability and oxygen permeability.
- Another object of the present invention is to provide a composition for a display encapsulant that can implement an organic protective layer excellent in transparency.
- Another object of the present invention is to provide a composition for a display encapsulant that can implement an organic protective layer having excellent surface flatness with low surface roughness.
- Another problem to be solved by the present invention is to provide a composition for a display encapsulant that can implement an organic protective layer that can protect the device from the influence of the environment, including water and gas to give the device over time reliability.
- Another object of the present invention is to provide a display device including a cured product of the composition for display encapsulant of the present invention.
- the composition for display sealing material which is one aspect of this invention is a composition for display sealing materials containing a photocurable monomer and a photoinitiator,
- the said photocurable monomer is a monomer which does not have an aromatic hydrocarbon group;
- a monomer having no aromatic hydrocarbon group in the photocurable monomer in an amount of about 55 wt% to about 95 wt%.
- A is a hydrocarbon containing two or more substituted or unsubstituted phenyl groups or a heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups
- Z 1 and Z 2 are each independently the following Chemical Formula 2,
- a and b are each an integer of 0 to 2, and a + b is an integer of 1 to 4)
- X is a single bond, O, or S,
- Y is a substituted or unsubstituted linear alkylene group having 1 to 10 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms,
- R 1 is hydrogen or an alkyl group having 1 to 5 carbon atoms, c is 0 or 1).
- a display device includes a device member and a protective layer formed on the device member, the protective layer includes an inorganic protective layer and an organic protective layer, and the organic protective layer seals the display. It may include a cured product of the ash composition.
- composition of the present invention has the effect of implementing an organic protective layer with high plasma resistance.
- composition of the present invention has the effect of implementing an organic protective layer significantly lower moisture permeability and oxygen permeability.
- composition of the present invention has the effect of implementing an organic protective layer excellent in transparency.
- composition of the present invention has the effect of implementing an organic protective layer excellent in surface flatness with low surface roughness.
- composition of the present invention can implement an organic protective layer that can protect the display device from the influence of the environment including water and gas to impart reliability over time to the device.
- FIG. 1 is a cross-sectional view of a display device according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of a display device according to another embodiment of the present invention.
- (meth) acryl may mean acryl and / or methacryl.
- hetero atom means any one atom selected from the group consisting of N, O, S and P
- hetero means any one selected from the group consisting of N, O, S and P. It means substituted by the atom of.
- plasma resistance may be determined according to an etching rate that is etched when the cured product of the sealant composition is plasma treated, and the lower the etching rate, the better the plasma resistance.
- alkylene group refers to alkanediyl groups connected by saturated hydrocarbon without double bonds between (meth) acrylates at both ends.
- carbon number of an alkylene group means only carbon number in the alkylene group itself except carbon in a di (meth) acrylate group.
- composition for a display encapsulant may include a photocurable monomer and a photopolymerization initiator.
- the photocurable monomer means a photocurable monomer capable of curing reaction by a photopolymerization initiator.
- a photocurable monomer a non-silicone monomer containing no silicon (Si) may be used.
- the monomer may be formed of only an element selected from C, H, O, N, or S, but is not limited thereto.
- the photocurable monomer may be synthesized by a conventional synthetic method, or may be used by purchasing a commercially available product.
- the composition for a display sealant includes a photocurable monomer and a photopolymerization initiator, the photocurable monomer, a monomer having no aromatic hydrocarbon group; And a monomer having two or more substituted or unsubstituted phenyl groups represented by Formula 1, wherein the monomer having two or more substituted or unsubstituted phenyl groups in the photocurable monomer is about 5% by weight to about 45% by weight And a monomer having no aromatic hydrocarbon group in the photocurable monomer in an amount of about 55 wt% to about 95 wt%.
- A is a hydrocarbon containing two or more substituted or unsubstituted phenyl groups or a heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups
- Z 1 and Z 2 are each independently the following Chemical Formula 2,
- a and b are integers of 0-2, respectively, and a + b is an integer of 1-4.
- X is a single bond, O, or S,
- Y is a substituted or unsubstituted linear alkylene group having 1 to 10 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms,
- R 1 is hydrogen or an alkyl group having 1 to 5 carbon atoms, and c is 0 or 1.
- A is a hydrocarbon containing two or more substituted or unsubstituted phenyl groups or a heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups.
- the hydrocarbon containing two or more substituted or unsubstituted phenyl groups or the heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups is a single bond, an oxygen atom, without condensation of two or more substituted or unsubstituted phenyl groups.
- a sulfur atom a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a substituted or unsubstituted alkylene group having 3 to 6 carbon atoms, an ethenylene group, an ethynylene group or a carbonyl group.
- the hydrocarbon containing two or more phenyl groups or the heteroatom containing hydrocarbon containing two or more phenyl groups may be substituted or unsubstituted biphenyl group, substituted or unsubstituted triphenylmethyl group, substituted or unsubstituted terphenyl group.
- the monomer having two or more substituted or unsubstituted phenyl groups may be mono (meth) acrylate, di (meth) acrylate or a mixture thereof, and examples thereof include 4- (meth) acryloxy-2-hydroxybenzo.
- the (meth) acrylate referred to in the present invention is not limited to one example, and the present invention further includes all acrylates in the structural isomer relationship.
- the present invention provides 3,2'-phenylphenoxyethyldi (meth) corresponding to its structural isomers. ) Acrylate, 3,3'-phenylphenoxyethyldi (meth) acrylate, and the like.
- the monomer having two or more phenyl groups may be a mono (meth) acrylate of the formula (3).
- R 2 is hydrogen or a methyl group
- R 3 is a substituted or unsubstituted linear alkylene group having 1 to 10 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms
- R 4 is substituted Or a hydrocarbon containing two or more unsubstituted phenyl groups or a heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups.
- the hydrocarbon containing two or more substituted or unsubstituted phenyl groups or the heteroatom containing hydrocarbon including two or more substituted or unsubstituted phenyl groups may be a single, uncondensed two or more substituted or unsubstituted phenyl groups. It is meant to be connected by a bond, an oxygen atom, a sulfur atom, a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, an alkylene group having 3 to 6 carbon atoms substituted or unsubstituted with a hetero atom, an ethenylene group, an ethynylene group or a carbonyl group.
- the hydrocarbon containing two or more substituted or unsubstituted phenyl groups or the heteroatom containing hydrocarbon including two or more substituted or unsubstituted phenyl groups may be a substituted or unsubstituted biphenyl group, a substituted or unsubstituted triphenyl.
- the monomer having two or more phenyl groups may be di (meth) acrylate of the following formula (4).
- R 5 and R 9 are each independently hydrogen or a methyl group
- R 6 and R 8 are each independently a substituted or unsubstituted linear alkylene group having 1 to 10 carbon atoms, or a substituted or unsubstituted carbon number.
- R 7 is a hydrocarbon containing two or more substituted or unsubstituted phenyl groups or a heteroatom containing hydrocarbon containing two or more substituted or unsubstituted phenyl groups.
- the hydrocarbon containing two or more substituted or unsubstituted phenyl groups or the heteroatom containing hydrocarbon including two or more substituted or unsubstituted phenyl groups may be a single, uncondensed two or more substituted or unsubstituted phenyl groups. It is connected by a bond, an oxygen atom, a sulfur atom, a substituted or unsubstituted C1-C4 alkyl group, a hetero atom substituted or unsubstituted C3-C6 alkylene group, ethenylene group, ethynylene group, or carbonyl group.
- the hydrocarbon may be a substituted or unsubstituted biphenylene group, a substituted or unsubstituted triphenylmethylene group, a substituted or unsubstituted terphenylene group, a substituted or unsubstituted quarterphenylene group, 2-phenyl-2- ( Phenylthio) ethylene group, 2,2-diphenylpropylene group, diphenylmethylene group, and the like, but is not limited thereto.
- a and b are each an integer of 0 to 2
- a + b is an integer of 1 to 4
- a + b is 1 or 2 integers.
- the weight average molecular weight of the monomer having two or more substituted or unsubstituted phenyl groups may be about 100 g / mol or more and about 1000 g / mol or less, about 130 g / mol or more and about 700 g / mol or less, and about 150 g / mol or more May be up to 600 g / mol.
- the monomer having an aromatic hydrocarbon group may be included in an amount of about 5 wt% to about 45 wt%, more specifically about 10 wt% to about 40 wt%, based on the total weight of the photocurable monomer. Within this range, the viscosity may be suitable for forming the sealant and at the same time excellent in plasma resistance.
- the photocurable monomer may include a monomer having no aromatic hydrocarbon group.
- the monomer having no aromatic hydrocarbon group does not include an aromatic hydrocarbon group, and may include monomers having 1 to 20, specifically 1 to 6, vinyl, acrylic, or methacryl groups as photocuring functional groups. For example, one or three, one or two, one or two may be included.
- the weight average molecular weight of the monomer having no aromatic hydrocarbon group may be about 100 g / mol or more and about 500 g / mol or less, about 130 g / mol or more and about 400 g / mol or less, and about 200 g / mol or more and about 300 g / mol It may be: Within the weight average molecular weight range of the monomer, it can exhibit a more advantageous effect.
- the monomer not having an aromatic hydrocarbon group may include a monofunctional monomer having a photocurable functional group, a polyfunctional monomer, or a mixture thereof.
- the monomer having no aromatic hydrocarbon group may be a (meth) acrylate monomer, and an unsaturated carboxylic acid having an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, or a hydroxyl group and an alkyl group having 1 to 20 carbon atoms.
- ester Unsaturated carboxylic acid esters having an amino alkyl group having 1 to 20 carbon atoms
- Vinyl cyanide compounds Unsaturated amide compounds
- the "polyhydric alcohol” is an alcohol having two or more hydroxyl groups, it may mean an alcohol having 2 to 20, preferably 2 to 10, more preferably 2 to 6.
- the (meth) acrylate monomer having no aromatic hydrocarbon group among monomers having no aromatic hydrocarbon group may be substituted or unsubstituted C1 to C20 alkyl group, substituted or unsubstituted C1 to C20 alkyl silyl group, substituted or unsubstituted.
- the monomer having no aromatic hydrocarbon group is a non-aromatic system containing no aromatic group, a mono (meth) acrylate having an alkyl group having 1 to 20 carbon atoms, a mono (meth) acrylate having an amine group, and a substitution. Or a di (meth) acrylate having an unsubstituted alkylene group having 1 to 20 carbon atoms, a di (meth) acrylate having an ethylene oxide group, and a tri (meth) acrylate having an ethylene oxide group. .
- Mono (meth) acrylate having a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms is specifically decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth ) Acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylic Latex, arachidyl (meth) acrylate or mixtures thereof, but is not limited thereto.
- Mono (meth) acrylates having amine groups may be, but are not limited to, 2-aminoethyl (meth) acrylate, 2-dimethylaminoethyl (meth) acrylate or mixtures thereof.
- the di (meth) acrylate having a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms may be, for example, a di (meth) acrylate having an alkylene group having 1 to 20 carbon atoms, and may be a substituted or unsubstituted long chain. It may be a non-silicone di (meth) acrylate containing an alkylene group.
- the composition for encapsulation includes an organic barrier layer on an organic light emitting device or an inorganic layer encapsulating the organic light emitting device by a method such as vapor deposition. Easy to form.
- Di (meth) acrylate which has a substituted or unsubstituted C1-C20 alkylene group is octanediol di (meth) acrylate, nonandiol di (meth) acrylate, decanediol di (meth) acrylate, for example.
- the composition for encapsulation may further improve photocurability and lower viscosity.
- Di (meth) acrylate or tri (meth) acrylate having an ethylene oxide group is specifically, ethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate or It may be a mixture thereof, but is not limited thereto.
- the monomer having no aromatic hydrocarbon group may be included in an amount of about 55 wt% to about 95 wt%, specifically about 60 wt% to about 90 wt%, based on the total weight of the photocurable monomer.
- the viscosity of the composition for display sealing material within the said range may be suitable for sealing material formation of an organic electroluminescent element.
- the photopolymerization initiator includes without limitation any conventional photopolymerization initiator capable of carrying out the photocurable reaction.
- the photopolymerization initiator may include a triazine, acetophenone, benzophenone, thioxanthone, benzoin, phosphorus, oxime or mixtures thereof.
- Triazine initiators include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (3 ', 4'-dimethoxy Styryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxy naphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxy phenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2- Biphenyl-4,6-bis (trichloromethyl) -s-triazine, bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphtho-1-yl) -4,6 -B
- acetophenone-based initiators examples include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methyl propiophenone, pt-butyl trichloro acetophenone and pt-butyl Dichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholino propan-1-one , 2-benzyl-2-dimethyl amino-1- (4-morpholino phenyl) -butan-1-one, mixtures thereof.
- benzophenone initiators benzophenone, benzoyl benzoic acid, benzoyl benzoic acid methyl, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis (dimethyl amino) benzophenone, 4,4'-dichloro Benzophenone, 3,3'-dimethyl-2-methoxy benzophenone or mixtures thereof.
- Thioxanthone initiators include thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, and 2-chloro thioke Santon or mixtures thereof.
- the benzoin-based initiator may be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal or mixtures thereof.
- the phosphorus initiator may be bisbenzoylphenyl phosphine oxide, benzoyldiphenyl phosphine oxide or mixtures thereof.
- oximes examples include 2- (o-benzoyloxime) -1- [4- (phenylthio) phenyl] -1,2-octanedione and 1- (o-acetyloxime) -1- [9-ethyl-6- ( 2-methylbenzoyl) -9H-carbazol-3-yl] ethanone, or mixtures thereof.
- the photopolymerization initiator may be included in an amount of about 0.1 part by weight to about 20 parts by weight based on 100 parts by weight of the total photocurable monomer and the photopolymerization initiator in the composition for display encapsulant. Within this range, photopolymerization can sufficiently occur during exposure, and the transmittance can be prevented from being lowered due to the unreacted initiator remaining after the photopolymerization. Specifically about 0.5 to about 10 parts by weight, more specifically about 1 to about 8 parts by weight.
- the photopolymerization initiator may be included in about 0.1% by weight to about 10% by weight, specifically about 0.1% by weight to about 8% by weight, based on solids, of the composition for the display encapsulant. Within this range, photopolymerization can take place sufficiently and the transmittance can be prevented from being lowered due to the remaining unreacted initiator.
- photoacid generators or photopolymerization initiators such as carbazole, diketones, sulfonium, iodonium, diazo, and biimidazole may be used.
- composition for a display encapsulant according to another embodiment of the present invention may further include an antioxidant.
- Antioxidants can improve the thermal stability of the encapsulation layer.
- the antioxidant may include, but is not limited to, one or more selected from the group consisting of phenolic, quinone, amine and phosphite based.
- antioxidants include tetrakis [methylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate)] methane, tris (2,4-di-tert-butylphenyl) phosphite, and the like. Can be mentioned.
- the antioxidant may be included in an amount of about 0.01 parts by weight to about 3 parts by weight, specifically about 0.01 parts by weight to about 1 part by weight, based on 100 parts by weight of the photocurable monomer and the photopolymerization initiator in the composition for the display encapsulant. Within this range, excellent thermal stability can be exhibited.
- the composition for display encapsulant of another embodiment of the present invention may further include a heat stabilizer.
- the composition for display sealing materials of another Example of this invention can suppress the viscosity change in normal temperature of the composition for sealing materials.
- the light transmittance and photocurability may be higher and the plasma etching rate may be lower than that of the sealant composition that does not include a heat stabilizer.
- it further comprises a heat stabilizer is the same as the composition for a display sealing material of an embodiment of the present invention. Therefore, hereinafter, only the thermal stabilizer will be described.
- a heat stabilizer is contained in the composition for sealing materials and suppresses the viscosity change in normal temperature of a composition, and can use a normal heat stabilizer without a restriction
- a heat stabilizer may use a sterically hindered phenolic heat stabilizer.
- the heat stabilizer may be included in an amount of about 2000 ppm or less, for example, about 0.01 ppm to about 2000 ppm, for example, about 100 ppm to about 1000 ppm, based on the solid content of the composition for the display encapsulant.
- the heat stabilizer in the above range can further improve the storage stability and fairness of the liquid state of the composition for sealing material.
- the display encapsulant composition may be cured by irradiating ultraviolet light at about 10 mW / cm 2 to about 500 mW / cm 2 for about 1 second to about 100 seconds, but is not limited thereto.
- the composition for a display encapsulant may have a plasma etch rate of about 400 nm / min or less, and a roughness of about 2 nm or less.
- Plasma Etch Rate (nm / min) (T0-T1) / M
- T0 is a thickness (nm) of a sample prepared by spraying the composition for the display encapsulant on a substrate and irradiating UV light at about 100 mW / cm 2 for about 10 seconds
- T1 represents the prepared sample. 2500W ICP power supply, 300W RF power supply, DC bias 200V, argon (Ar) flow rate 50 sccm, thickness after 10 minutes plasma treatment at 10mtorr conditions (nm), and T0 and T1 is the thickness excluding the substrate thickness
- M is the plasma treatment time (min).
- This remarkably low level can provide an organic protective layer with high plasma resistance.
- the plasma etching rate may be about 400 nm / min or less, specifically about 10 to 390 nm / min, and about 10 to 385 nm / min.
- the plasma etch rate represented by Equation 1 exceeds about 400 nm / min, damage to the organic layer is increased, thereby deteriorating reliability of the device.
- the surface roughness is a deposition surface roughness measured by measuring surface curvature when the composition for the display encapsulant is deposited on a substrate, and the lower the surface roughness may contribute to the flatness of the display.
- the illuminance referred to in the present invention may be a method by illuminance measuring method according to a general method known to those skilled in the art. For example, it can be measured using an atomic force microscope (AFM).
- the surface roughness is preferably about 2 nm or less, and may be about 0 nm to about 2 nm, about 0 nm to about 1.9 nm, and about 0 nm to about 1.85 nm when measured by AFM (Atomic Force Microscope). .
- the surface roughness of the present invention is about 2 nm or less, it is possible to provide an organic protective layer having a flat surface, and an inorganic protective layer formed after deposition of the organic protective layer may be deposited flat. If the surface roughness exceeds about 2 nm, the organic protective layer is not planarized, and may cause the inorganic protective layer to be broken when the inorganic protective layer is deposited on the surface of the cured product.
- the display device including the organic protective layer formed of the composition for the display encapsulant may have an outgas generation amount of about 2000 ppm or less. Within this range, the life of the device member can be long and the reliability can be increased. Specifically, about 10 ppm to about 1000 ppm.
- the outgas generation amount can be measured by a conventional method.
- the composition for display encapsulant is applied onto a glass substrate, and ultraviolet rays are irradiated at about 100 mW / cm 2 for about 10 seconds to cure to form a cured specimen having a coating thickness of about 5 ⁇ m.
- TD-GC / MS (TD: JTD505III, GC / MS: Clarus 600, Perkin Elmer Co., Ltd.) for a film thickness of about 5 ⁇ m about 10 °C / from about 40 °C to about 320 °C for a certain area (1x5 cm2)
- the composition for a display encapsulant may have a color coordinate value YI (ASTM D1925) measured after curing of about 0.5 or less, specifically about 0.1 to about 0.5. Within this range, the display encapsulant is transparent and can be applied to the display by transmitting light close to white light.
- the said color coordinate value can be measured by a conventional method.
- the composition for display encapsulant is applied onto a glass substrate, and ultraviolet rays are irradiated at about 100 mW / cm 2 for about 10 seconds to cure to form a cured specimen having a coating thickness of 5 ⁇ m.
- the color coordinate value YI (ASTM D1925) is calculated after measuring the transmittance for wavelength 300nm-800nm by using a UV-visible spectrophotometer (UV-2450, SHIMADZU) analyzer for the coating thickness of 5 ⁇ m.
- composition for the display encapsulant may provide a transparent organic protective layer having a high transmittance of about 90% or more and about 100% or less, specifically about 95% or more and about 100% or less, measured after curing.
- the total light transmittance and haze were measured using a haze meter (NDH-5000, Nippon Denshoku) at a wavelength of about 400 to about 700 nm according to ASTM D1003-95 5.
- the composition for display encapsulant should be transparent without showing color for the purpose of being applied to the light emitting front surface.
- the display encapsulant exhibits color, a problem may occur in that the color coordinates are distorted after the transmission of the light embodied in the display light source after the encapsulant is transmitted to the front part.
- the efficiency of light emitted from the front side decreases, so that the display may not be clearly seen.
- the composition for display encapsulation according to the embodiments of the present invention can be used as a seal for the organic electroluminescent device.
- the organic electroluminescent device may be damaged by the surrounding environment, for example liquid or gas, specifically moisture or oxygen, or by chemicals used in the manufacturing process of the device including the organic electroluminescent device.
- It can also be used as a sealing material to form an organic protective layer that shields the organic electroluminescent device from the surrounding environment in order to prevent deterioration of properties.
- composition for display sealant can be used as a sealant for the device member.
- the device member may be damaged by the surrounding environment, for example liquid or gas, in particular moisture or oxygen, or by chemicals used in the manufacturing process of the device comprising the organic electroluminescent element. It can also be used as a sealing material to form an organic protective layer that blocks the device member from the surrounding environment in order to prevent deterioration of properties.
- the device member may be, for example, a flexible organic electroluminescent device, an organic electroluminescent device, or the like.
- composition for display encapsulant according to the embodiments of the present invention may be used for forming an organic protective layer formed on an organic electroluminescent device, or an organic protective layer formed on an inorganic protective layer formed on an organic electroluminescent device.
- the organic protective layer may be formed using a method such as deposition, inkjet, but is not limited thereto.
- a display device comprises a device member and a composite protective layer formed on the device member, the composite protective layer includes an inorganic protective layer and an organic protective layer, the organic protective layer is It may be formed of a composition for a display sealant of the embodiments of the invention.
- the display apparatus 100 is formed on the substrate 10, the device member 20 formed on the substrate 10, and the device member 20, and the inorganic protective layer 31 and the organic protective layer 32.
- the display means a light emitting diode (LED), an organic light emitting diode (OLED), a light instrument, and the lighting includes both OLED lighting and LED lighting, but is generally used in the art. It also includes all display devices.
- LED light emitting diode
- OLED organic light emitting diode
- the lighting includes both OLED lighting and LED lighting, but is generally used in the art. It also includes all display devices.
- the device member may be a flexible organic electroluminescent device, an organic electroluminescent device, or the like, but is not limited thereto.
- the substrate 10 is not particularly limited, and for example, a transparent glass, a plastic film, a silicon or a metal substrate may be used.
- the device member 20 may be, for example, an organic electroluminescent device, and includes an organic light emitting layer formed between the first electrode, the second electrode, and the first electrode and the second electrode, and the organic light emitting layer includes a hole injection layer and a hole.
- the transport layer, the light emitting layer, the electron transport layer, and the electron injection layer may be sequentially stacked, but is not limited thereto.
- the composite protective layer 30 includes an inorganic protective layer 31 and an organic protective layer 32.
- the inorganic protective layer 31 and the organic protective layer 32 have different components constituting the layers, respectively. It can act as a sealing material for the member.
- the inorganic protective layer 31 is different from the organic protective layer 32 and a component, and may complement the effect of the organic protective layer 32.
- the inorganic protective layer 31 may be formed of an inorganic material having excellent light transmittance and excellent moisture and / or oxygen barrier properties.
- the inorganic protective layer 31 may be a metal, a nonmetal, an intermetallic compound or alloy, a nonmetal intermetallic compound or alloy, an oxide of a metal or nonmetal, a fluoride of a metal or a nonmetal, a nitride of a metal or a nonmetal, a carbide of a metal or a nonmetal.
- Metals or nonmetals include silicon (Si), aluminum (Al), selenium (Se), zinc (Zn), antimony (Sb), indium (In), germanium (Ge), tin (Sn), bismuth (Bi), transitions Metal, lanthanide metal, and the like, but is not limited thereto.
- the inorganic protective layer is AlOx, In 2 O 3 , including silicon oxide (SiOx), silicon nitride (SiNx), silicon oxygen nitride (SiOxNy), ZnSe, ZnO, Sb 2 O 3 , Al 2 O 3 , and the like.
- SiOx silicon oxide
- SiNx silicon nitride
- SiOxNy silicon oxygen nitride
- ZnSe ZnO
- Sb 2 O 3 Al 2 O 3
- SnO 2 may be.
- x and y are each 1-5.
- the inorganic protective layer 31 may be deposited through a plasma process, a vacuum process, for example, sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma vapor deposition, and a combination thereof.
- the thickness of the inorganic protective layer 31 is not particularly limited, but may be 100 kPa to 2000 kPa.
- the sealing effect may be excellent within the above range.
- the organic protective layer 32 may be formed by deposition, inkjet, screen printing, spin coating, blade coating, curing alone or a combination thereof of the composition for display encapsulant of the embodiments of the present invention.
- the composition for display encapsulant may be coated to a thickness of about 1 ⁇ m to about 50 ⁇ m, and may be cured by irradiating ultraviolet light at about 10 mW / cm 2 to about 500 mW / cm 2 for about 1 second to about 100 seconds.
- the organic protective layer and the inorganic protective layer may be alternately deposited in three or more layers.
- the smoothing property of the inorganic protective layer can be ensured, and defects of the inorganic protective layer can be prevented from propagating to another inorganic protective layer.
- the inorganic protective layer deposited between two or more organic protective layers may complement or enhance the sealing effect on the device.
- the composite protective layer 30 alternately includes the inorganic protective layer 31 and the organic protective layer 32, but the total number of the inorganic protective layer 31 and the organic protective layer 32 is not limited.
- the total number of inorganic protective layer 31 and organic protective layer 32 may vary depending on the level of permeation resistance to oxygen and / or moisture and / or water vapor and / or chemicals.
- the total number of the inorganic protective layer 31 and the organic protective layer 32 may be 10 or less, for example, 2 to 7 layers. Specifically, it may be formed of seven layers in the order of the inorganic protective layer / organic protective layer / inorganic protective layer / organic protective layer / inorganic protective layer / organic protective layer / inorganic protective layer.
- the display device may have an outgas generation amount of about 2000 ppm or less. Within this range, the life of the device member can be long and the reliability can be increased. Specifically, about 10 ppm to about 1000 ppm.
- FIG. 2 is a cross-sectional view of a display device according to another embodiment of the present invention.
- the display device 200 is formed on the substrate 10, the device member 20 formed on the substrate 10, and the device member 20 and the inorganic protective layer 31.
- an organic protective layer 30 including the organic protective layer 32, and the inorganic protective layer 31 encapsulates the internal space 40 in which the barrier member 20 is accommodated, and the organic protective layer 32. May be formed of the composition for a display encapsulant of the embodiments of the present invention. Except that the inorganic protective layer 31 is not in contact with the device member 20, the description thereof is omitted because it is substantially the same as the organic light emitting display device of an embodiment of the present invention described above.
- reaction product was purified with normal hexane (n-hexane, Daejung Gold Co., Ltd.) to remove salts and impurities, and the residual solvent was evaporated under reduced pressure to obtain a compound of formula 10 (molecular weight 284.37) with an HPLC purity of 85%.
- normal hexane n-hexane, Daejung Gold Co., Ltd.
- a composition for a display sealant was prepared in the same manner as in Example 1 except that the type and content of each component were used as described in Tables 1 to 3 below.
- Plasma etch rate (%) An organic protective film formed by coating a composition for display sealants of Examples and Comparative Examples with a spray on a silicon wafer having a thickness of 525 ⁇ 25 ⁇ m and irradiating with UV at 100 mW / cm 2 for 10 seconds for curing.
- a specimen having a layer thickness of 5 ⁇ m was prepared.
- the prepared specimen was plasma treated with argon gas for 1 minute using ICP dry etcher (Plasma lab system 133, Oxford instruments) under ICP power 2500W, RE power 300W, DC bias 200V, Ar flow 50 sccm, pressure 10mtorr.
- Plasma etch rate was calculated by the following formula 1 by measuring the thickness (T0) of the organic protective layer before the plasma treatment and the thickness (T1) of the organic protective layer after the treatment, the results are shown in Tables 1-3.
- T0 and T1 represent the thickness excluding the substrate thickness, and M is the plasma treatment time (min).
- Plasma Etch Rate (nm / min) (T0-T1) / M
- Color coordinate value YI (ASTM D1925): Transmittance of the wavelength 300nm-800nm was measured using a UV-visible spectrophotometer (UV-2450, SHIMADZU Co., Ltd.) analysis equipment for the specimen prepared by the method of (1) Then, the color coordinate value YI (ASTM D1925) is calculated.
- the plasma etching rate is low, the plasma resistance is remarkably excellent, and the surface roughness value is 2 nm or less, and the flatness is excellent.
- the color coordinate value YI ASTM D19205
- the comparative example has a problem that the etch rate is higher than that shown in the embodiment or the surface roughness is high.
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Abstract
Description
단위: 중량부 | 실시예 | |||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | ||
(A) | (a1) | 90 | 80 | 70 | 60 | 60 | 60 | - | - | - | - | - | 60 | 60 |
(a2) | - | - | - | - | - | - | 60 | 50 | - | - | - | - | - | |
(a3) | - | - | - | - | - | - | 20 | - | 30 | 30 | - | - | - | |
(a4) | - | - | - | - | - | - | - | 20 | 30 | 30 | 60 | - | - | |
(B) | (b1) | 10 | 20 | 30 | 40 | - | - | 20 | 30 | - | - | - | - | - |
(b2) | - | - | - | - | 40 | - | - | - | 40 | - | 20 | - | - | |
(b3) | - | - | - | - | - | 40 | - | - | - | 40 | 20 | - | - | |
(b4) | - | - | - | - | - | - | - | - | - | - | - | 40 | - | |
(b5) | - | - | - | - | - | - | - | - | - | - | - | - | 40 | |
(b6) | - | - | - | - | - | - | - | - | - | - | - | - | - | |
(b7) | - | - | - | - | - | - | - | - | - | - | - | - | - | |
(b8) | - | - | - | - | - | - | - | - | - | - | - | - | - | |
(b9) | - | - | - | - | - | - | - | - | - | - | - | - | - | |
(b10) | - | - | - | - | - | - | - | - | - | - | - | - | - | |
(C) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |
플라즈마 식각률(nm/min) | 385 | 364 | 357 | 331 | 328 | 342 | 353 | 341 | 320 | 336 | 326 | 325 | 342 | |
표면조도(nm) | 1.24 | 1.33 | 1.52 | 1.83 | 1.86 | 1.65 | 1.44 | 1.64 | 1.87 | 1.73 | 1.74 | 1.83 | 1.54 | |
색좌표값 YI | 0.41 | 0.41 | 0.41 | 0.41 | 0.4 | 0.42 | 0.41 | 0.41 | 0.42 | 0.42 | 0.41 | 0.41 | 0.41 | |
광투과율(%) | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 |
단위: 중량부 | 실시예 | ||||||||||||
14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 | 22 | 23 | 24 | 25 | ||
(A) | (a1) | 60 | - | - | - | - | - | 60 | 60 | 60 | 60 | - | - |
(a2) | - | 50 | - | 60 | - | 30 | - | - | - | - | 70 | - | |
(a3) | - | - | 30 | - | 70 | - | - | - | - | - | - | 70 | |
(a4) | - | 20 | 30 | - | - | 30 | - | - | - | - | - | - | |
(B) | (b1) | - | - | - | - | - | - | - | - | - | - | - | 20 |
(b2) | - | - | - | - | - | - | - | - | - | - | - | - | |
(b3) | - | - | - | 20 | - | - | - | - | - | - | - | - | |
(b4) | - | 30 | - | - | 20 | - | 35 | 35 | 35 | 35 | - | - | |
(b5) | - | - | 40 | 20 | - | 20 | - | - | - | - | 20 | - | |
(b6) | 40 | - | - | - | 10 | 20 | - | - | - | - | - | - | |
(b7) | - | - | - | - | - | - | 5 | - | - | - | - | - | |
(b8) | - | - | - | - | - | - | - | 5 | - | - | 10 | - | |
(b9) | - | - | - | - | - | - | - | - | 5 | - | - | - | |
(b10) | - | - | - | - | - | - | - | - | - | 5 | - | 10 | |
(C) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |
플라즈마 식각률(nm/min) | 360 | 340 | 335 | 338 | 348 | 328 | 323 | 320 | 320 | 321 | 354 | 352 | |
표면조도(nm) | 1.74 | 1.64 | 1.68 | 1.53 | 1.74 | 1.52 | 1.83 | 1.82 | 1.83 | 1.82 | 1.63 | 1.64 | |
색좌표값 YI | 0.43 | 0.42 | 0.41 | 0.41 | 0.42 | 0.42 | 0.42 | 0.42 | 0.42 | 0.42 | 0.42 | 0.42 | |
광투과율(%) | 100 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 |
단위: 중량부 | 비교예 | |||||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | ||
(A) | (a1) | 100 | 50 | 60 | 95 | - | - | - | - | - | - | 50 | - | - | 30 | - |
(a2) | - | - | 40 | - | 40 | - | - | 50 | - | - | - | - | 30 | - | - | |
(a3) | - | - | - | 5 | - | 20 | - | - | 30 | - | - | 50 | - | - | 50 | |
(a4) | - | - | - | - | - | 20 | 40 | - | - | 40 | - | - | 20 | 20 | - | |
(B) | (b1) | - | 50 | - | - | 60 | - | - | - | - | - | - | - | - | - | 30 |
(b2) | - | - | - | - | - | - | 30 | 20 | - | - | - | - | - | - | - | |
(b3) | - | - | - | - | - | 60 | 30 | - | - | - | - | - | - | - | - | |
(b4) | - | - | - | - | - | - | - | 30 | 40 | - | - | - | - | - | - | |
(b5) | - | - | - | - | - | - | - | - | 30 | 30 | - | - | 30 | - | - | |
(b6) | - | - | - | - | - | - | - | - | - | 30 | - | 30 | - | 30 | - | |
(b7) | - | - | - | - | - | - | - | - | - | - | 50 | 20 | - | - | - | |
(b8) | - | - | - | - | - | - | - | - | - | - | - | - | 20 | - | - | |
(b9) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 20 | |
(b10) | - | - | - | - | - | - | - | - | - | - | - | - | - | 20 | - | |
(C) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |
플라즈마식각률(nm/min) | 418 | 327 | 610 | 820 | 280 | 314 | 308 | 312 | 296 | 310 | 324 | 318 | 287 | 320 | 322 | |
표면조도(nm) | 1.14 | 2.16 | 1.24 | 1.22 | 3.42 | 2.43 | 3.13 | 2.24 | 3.35 | 3.14 | 2.54 | 2.43 | 3.65 | 2.44 | 2.42 | |
색좌표값 YI | 0.41 | 0.41 | 0.41 | 0.41 | 0.45 | 0.46 | 0.44 | 0.41 | 0.41 | 0.43 | 0.46 | 0.45 | 0.48 | 0.45 | 0.45 | |
광투과율(%) | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 99 | 100 | 99 | 99 | 95 | 99 | 99 |
Claims (16)
- 광경화성 모노머 및 광중합 개시제를 포함하는 디스플레이 밀봉재용 조성물로서,상기 광경화성 모노머는, 방향족 탄화수소기를 가지지 않는 모노머; 및 하기 화학식 1의 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머를 포함하고,상기 광경화성 모노머 중 상기 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머를 약 5중량% 내지 약 45중량%로 포함하고, 상기 광경화성 모노머 중 상기 방향족 탄화수소기를 가지지 않는 모노머를 약 55중량% 내지 약 95중량%로 포함하는 디스플레이 밀봉재용 조성물:<화학식 1>(상기 식에서, A는 치환 또는 비치환된 2개 이상의 페닐기를 포함하는 탄화수소 또는 치환 또는 비치환된 2개 이상의 페닐기를 포함하는 헤테로원자 함유 탄화수소이고,Z1, Z2는 각각 독립적으로 하기 화학식 2이고,a, b는 각각 0~2의 정수이며, a+b는 1 내지 4의 정수이다)<화학식 2>(상기 식에서, *는 A의 탄소에 대한 연결부이고,X는 단일결합, O, 또는 S이고,Y는 치환 또는 비치환된 탄소수 1~10의 직쇄상 알킬렌기, 또는 치환 또는 비치환된 탄소수 1~20의 알콕시기이고,R1은 수소 또는 탄소수 1~5의 알킬기이며, c는 0 또는 1이다).
- 제1항에 있어서,상기 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머는 모노(메트)아크릴레이트 및 디(메트)아크릴레이트 중 하나 이상인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,상기 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머는 4-(메트)아크릴옥시-2-하이드록시벤조페논, 에틸-3,3-디페닐(메트)아크릴레이트, 벤조일옥시페닐(메트)아크릴레이트, 비스페놀에이디(메트)아크릴레이트, 에톡시레이티드비스페놀에이디(메트)아크릴레이트, 2-페닐페녹시에틸(메트)아크릴레이트, 2,2'-페닐페녹시에틸디(메트)아크릴레이트, 2-페닐페녹시프로필(메트)아크릴레이트, 2,2'-페닐페녹시프로필디(메트)아크릴레이트, 2-페닐페녹시부틸(메트)아크릴레이트, 2,2'-페닐페녹시부틸디(메트)아크릴레이트, 2-(3-페닐페닐)에틸(메트)아크릴레이트, 2-(4-벤질페닐)에틸(메트)아크릴레이트, 2-페닐-2-(페닐티오)에틸(메트)아크릴레이트, 2-(트리페닐메틸옥시)에틸(메트)아크릴레이트, 4-(트리페닐메틸옥시)부틸(메트)아크릴레이트, 3-(비페닐-2-일옥시)부틸(메트)아크릴레이트, 2-(비페닐-2-일옥시)부틸(메트)아크릴레이트, 4-(비페닐-2-일옥시)프로필(메트)아크릴레이트, 3-(비페닐-2-일옥시)프로필(메트)아크릴레이트, 2-(비페닐-2-일옥시)프로필(메트)아크릴레이트, 4-(비페닐-2-일옥시)에틸(메트)아크릴레이트, 3-(비페닐-2-일옥시)에틸(메트)아크릴레이트, 2-(4-벤질페닐)에틸(메트)아크릴레이트, 4,4'-디(아크릴로일옥시메틸)비페닐, 2,2'-디(2-아크릴로일옥시에톡시)비페닐, 이들의 구조이성질체 또는 이들의 혼합물 중의 하나인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서, 상기 2개 이상의 페닐기를 포함하는 탄화수소 또는 2개 이상의 페닐기를 포함하는 헤테로원자 함유 탄화수소는 치환 또는 비치환된 비페닐기, 치환 또는 비치환된 트리페닐메틸기, 치환 또는 비치환된 터페닐기, 치환 또는 비치환된 비페닐렌기, 치환 또는 비치환된 터페닐렌기, 치환 또는 비치환된 쿼터페닐렌기, 치환 또는 비치환된 2-페닐-2-(페닐티오)에틸기, 치환 또는 비치환된 2,2-디페닐프로판기, 치환 또는 비치환된 디페닐메탄기, 치환 또는 비치환된 큐밀페닐기(cumyl phenyl), 치환 또는 비치환된 비스페놀 F기, 치환 또는 비치환된 비스페놀 A기, 치환 또는 비치환된 비페닐옥시기, 치환 또는 비치환된 터페닐옥시기, 치환 또는 비치환된 쿼터페닐옥시기, 치환 또는 비치환된 퀸퀴페닐옥시기인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,상기 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머는 중량평균분자량이 약 100g/mol 내지 약 1000g/mol인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,상기 광경화성 모노머 중 상기 치환 또는 비치환된 2개 이상의 페닐기를 갖는 모노머를 약 10중량% 내지 약 40중량%로 포함하고, 상기 광경화성 모노머 중 상기 방향족 탄화수소기를 가지지 않는 모노머를 약 60중량% 내지 약 90중량%로 포함하는 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,방향족 탄화수소기를 가지지 않는 모노머는 아민기를 갖는 모노(메트)아크릴레이트, 치환 또는 비치환된 C1 내지 C20의 알킬렌기를 갖는 디(메트)아크릴레이트, 에틸렌 옥사이드기를 갖는 디(메트)아크릴레이트 및 에틸렌 옥사이드기를 갖는 트리(메트)아크릴레이트 중 1종 이상인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,상기 광경화성 모노머는 C, H, O, N 또는 S에서 선택되는 원소만으로 이루어지는 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,상기 광중합 개시제는 트리아진계, 아세토페논계, 벤조페논계, 티오크산톤계, 벤조인계, 인계, 옥심계 중에서 선택되는 1종 이상인 디스플레이 밀봉재용 조성물.
- 제1항에 있어서,열안정제를 더 포함하는 것인 디스플레이 밀봉재용 조성물.
- 제12항에 있어서,상기 열안정제는 상기 디스플레이 밀봉재용 조성물 중 고형분 기준으로 약 100ppm 내지 약 1000ppm 으로 포함하는 것인 디스플레이 밀봉재용 조성물.
- 디스플레이 부재, 및 상기 디스플레이 부재 위에 형성된 복합보호층을 포함하고,상기 복합보호층은 무기보호층 및 유기보호층을 포함하고,상기 유기보호층은 제1항 내지 제11항 중 어느 한 항의 디스플레이 밀봉재용 조성물의 경화물을 포함하는 디스플레이 장치.
- 제14항에 있어서,상기 무기보호층은 금속, 금속 산화물, 금속 불화물, 금속 질화물, 금속 산질화물, 금속 붕소화물, 금속 산붕소화물, 금속 실리사이드에서 선택되는 1종 이상을 포함하고,상기 금속은 실리콘(Si), 알루미늄(Al), 셀레늄(Se), 아연(Zn), 안티몬(Sb), 인듐(In), 게르마늄(Ge), 주석(Sn), 비스무트(Bi), 전이금속, 란탄족 금속 중에서 선택되는 1종 이상을 포함하는 디스플레이 장치.
- 제14항에 있어서,상기 디스플레이 부재는 LED(light emitting diode), OLED(Organic light emitting diode), OLED 조명(light instrument) 또는 LED 조명인 디스플레이 장치.
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US15/512,869 US10570220B2 (en) | 2014-10-29 | 2015-04-10 | Composition for display sealing material, organic protection layer comprising same, and display device comprising same |
CN201580057390.9A CN107075033B (zh) | 2014-10-29 | 2015-04-10 | 用于显示器密封材料的组成物及含有其显示器装置 |
JP2017523239A JP6670833B2 (ja) | 2014-10-29 | 2015-04-10 | ディスプレイ密封材用組成物、これを含む有機保護層、及びこれを含むディスプレイ装置 |
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KR1020150050505A KR101871549B1 (ko) | 2014-10-29 | 2015-04-09 | 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치 |
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