JP2016530705A5 - - Google Patents

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Publication number
JP2016530705A5
JP2016530705A5 JP2016523735A JP2016523735A JP2016530705A5 JP 2016530705 A5 JP2016530705 A5 JP 2016530705A5 JP 2016523735 A JP2016523735 A JP 2016523735A JP 2016523735 A JP2016523735 A JP 2016523735A JP 2016530705 A5 JP2016530705 A5 JP 2016530705A5
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JP
Japan
Prior art keywords
ring
overlap region
silicon
ceramic
top surface
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JP2016523735A
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English (en)
Japanese (ja)
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JP6867159B2 (ja
JP2016530705A (ja
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Priority claimed from US14/020,774 external-priority patent/US20150001180A1/en
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Publication of JP2016530705A5 publication Critical patent/JP2016530705A5/ja
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JP2016523735A 2013-06-28 2014-04-30 縁部クリティカルディメンジョンの均一性制御用のプロセスキット Active JP6867159B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361841194P 2013-06-28 2013-06-28
US61/841,194 2013-06-28
US14/020,774 US20150001180A1 (en) 2013-06-28 2013-09-06 Process kit for edge critical dimension uniformity control
US14/020,774 2013-09-06
PCT/US2014/036010 WO2014209489A1 (en) 2013-06-28 2014-04-30 Process kit for edge critical dimension uniformity control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020164401A Division JP2021010016A (ja) 2013-06-28 2020-09-30 縁部クリティカルディメンジョンの均一性制御用のプロセスキット

Publications (3)

Publication Number Publication Date
JP2016530705A JP2016530705A (ja) 2016-09-29
JP2016530705A5 true JP2016530705A5 (enExample) 2017-06-08
JP6867159B2 JP6867159B2 (ja) 2021-04-28

Family

ID=52114576

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016523735A Active JP6867159B2 (ja) 2013-06-28 2014-04-30 縁部クリティカルディメンジョンの均一性制御用のプロセスキット
JP2020164401A Pending JP2021010016A (ja) 2013-06-28 2020-09-30 縁部クリティカルディメンジョンの均一性制御用のプロセスキット

Family Applications After (1)

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JP2020164401A Pending JP2021010016A (ja) 2013-06-28 2020-09-30 縁部クリティカルディメンジョンの均一性制御用のプロセスキット

Country Status (6)

Country Link
US (1) US20150001180A1 (enExample)
JP (2) JP6867159B2 (enExample)
KR (1) KR102190302B1 (enExample)
CN (1) CN105283944B (enExample)
TW (1) TWM495617U (enExample)
WO (1) WO2014209489A1 (enExample)

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US9947517B1 (en) * 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
US20190287835A1 (en) * 2018-02-01 2019-09-19 Yield Engineering Systems, Inc. Interchangeable Edge Rings For Stabilizing Wafer Placement And System Using Same
JP7138514B2 (ja) * 2018-08-22 2022-09-16 東京エレクトロン株式会社 環状部材、プラズマ処理装置及びプラズマエッチング方法
US11682574B2 (en) 2018-12-03 2023-06-20 Applied Materials, Inc. Electrostatic chuck design with improved chucking and arcing performance
CN115136278A (zh) * 2020-02-04 2022-09-30 朗姆研究公司 等离子处理系统的射频信号滤波器装置
CN115087758A (zh) 2020-02-11 2022-09-20 朗姆研究公司 用于控制晶片晶边/边缘上的沉积的承载环设计
CN111508803B (zh) * 2020-04-23 2023-01-17 北京北方华创微电子装备有限公司 半导体工艺腔室、晶片边缘保护方法及半导体设备
CN113802111B (zh) * 2020-06-13 2023-10-31 拓荆科技股份有限公司 使用等离子体处理衬底的设备及改善晶圆薄膜表面形貌的方法
CN115885061A (zh) * 2020-06-25 2023-03-31 朗姆研究公司 具有径向变化等离子体阻抗的承载环
FI130020B (en) * 2021-05-10 2022-12-30 Picosun Oy Substrate processing apparatus and method
US20230066418A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Focus ring for a plasma-based semiconductor processing tool
KR102744850B1 (ko) * 2022-08-10 2024-12-19 솔믹스 주식회사 포커스 링 및 이를 포함하는 플라즈마 식각장치
CN115910738B (zh) * 2022-11-01 2025-02-18 上海积塔半导体有限公司 一种通过改变部件尺寸来调节Emax工艺腔体均匀性的方法

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JP3121524B2 (ja) * 1995-06-07 2001-01-09 東京エレクトロン株式会社 エッチング装置
US6284093B1 (en) * 1996-11-29 2001-09-04 Applied Materials, Inc. Shield or ring surrounding semiconductor workpiece in plasma chamber
JP4602545B2 (ja) * 1997-09-16 2010-12-22 アプライド マテリアルズ インコーポレイテッド プラズマチャンバの半導体ワークピース用シュラウド
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JP4676074B2 (ja) * 2001-02-15 2011-04-27 東京エレクトロン株式会社 フォーカスリング及びプラズマ処理装置
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JP2005303099A (ja) * 2004-04-14 2005-10-27 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
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JP2010045200A (ja) * 2008-08-13 2010-02-25 Tokyo Electron Ltd フォーカスリング、プラズマ処理装置及びプラズマ処理方法
JP2011035026A (ja) * 2009-07-30 2011-02-17 Seiko Epson Corp ドライエッチング装置、半導体装置の製造方法、制御リング
JP5719599B2 (ja) * 2011-01-07 2015-05-20 東京エレクトロン株式会社 基板処理装置

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