JP2017515301A5 - - Google Patents
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- Publication number
- JP2017515301A5 JP2017515301A5 JP2016558294A JP2016558294A JP2017515301A5 JP 2017515301 A5 JP2017515301 A5 JP 2017515301A5 JP 2016558294 A JP2016558294 A JP 2016558294A JP 2016558294 A JP2016558294 A JP 2016558294A JP 2017515301 A5 JP2017515301 A5 JP 2017515301A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate carrier
- carrier system
- protective layer
- layer stack
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 9
- 239000011241 protective layer Substances 0.000 claims 7
- 230000007723 transport mechanism Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461991350P | 2014-05-09 | 2014-05-09 | |
| US61/991,350 | 2014-05-09 | ||
| PCT/US2015/024147 WO2015171226A1 (en) | 2014-05-09 | 2015-04-02 | Substrate carrier system with protective covering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017515301A JP2017515301A (ja) | 2017-06-08 |
| JP2017515301A5 true JP2017515301A5 (enExample) | 2018-05-17 |
Family
ID=54392836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016558294A Pending JP2017515301A (ja) | 2014-05-09 | 2015-04-02 | 保護カバーを有する基板キャリアシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10096509B2 (enExample) |
| JP (1) | JP2017515301A (enExample) |
| KR (1) | KR20170002603A (enExample) |
| CN (1) | CN106575720B (enExample) |
| TW (1) | TW201606902A (enExample) |
| WO (1) | WO2015171226A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6533835B2 (ja) * | 2017-01-31 | 2019-06-19 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 基板を処理する方法、及び基板を保持するための基板キャリア |
| CN108738365B (zh) * | 2017-02-24 | 2022-03-01 | 应用材料公司 | 用于真空系统中使用的载体、用于真空处理的系统、和用于基板的真空处理的方法 |
| KR20190087996A (ko) * | 2017-09-05 | 2019-07-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 마스크 디바이스를 핸들링하는 방법들, 마스크 디바이스를 교환하기 위한 장치, 마스크 교환 챔버, 및 진공 시스템 |
| JP2020503663A (ja) * | 2017-11-23 | 2020-01-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 基板を支持するための基板キャリア、マスクチャッキング装置、真空処理システム、及び基板キャリアを動作させる方法 |
| KR20190114216A (ko) * | 2018-03-29 | 2019-10-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 정전척 및 기판처리장치 |
| WO2020037494A1 (en) * | 2018-08-21 | 2020-02-27 | Applied Materials, Inc. | Ultra-thin ceramic coating on separator for batteries |
| US11586160B2 (en) * | 2021-06-28 | 2023-02-21 | Applied Materials, Inc. | Reducing substrate surface scratching using machine learning |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3095790B2 (ja) | 1991-01-22 | 2000-10-10 | 富士電機株式会社 | 静電チャック |
| JPH09151362A (ja) * | 1995-11-30 | 1997-06-10 | Honda Electron Co Ltd | 保護用積層粘着フィルム |
| JP3847855B2 (ja) * | 1996-07-31 | 2006-11-22 | 三島 満 | 抗菌、抗カビ、抗汚染性を有する多層剥離再生型保護シート |
| JP3805134B2 (ja) | 1999-05-25 | 2006-08-02 | 東陶機器株式会社 | 絶縁性基板吸着用静電チャック |
| JP2001035907A (ja) * | 1999-07-26 | 2001-02-09 | Ulvac Japan Ltd | 吸着装置 |
| KR20020046214A (ko) | 2000-12-11 | 2002-06-20 | 어드밴스드 세라믹스 인터내셔날 코포레이션 | 정전척 및 그 제조방법 |
| JP2003060020A (ja) * | 2001-06-07 | 2003-02-28 | Komatsu Ltd | 静電チャック装置 |
| JP2002357838A (ja) | 2001-05-31 | 2002-12-13 | Hitachi Industries Co Ltd | 基板貼り合わせ方法及びその装置 |
| JP4166449B2 (ja) * | 2001-07-30 | 2008-10-15 | 株式会社アルバック | 真空処理装置 |
| JP2003179128A (ja) | 2001-12-11 | 2003-06-27 | Ngk Spark Plug Co Ltd | 静電チャック |
| JP2003243493A (ja) | 2002-02-15 | 2003-08-29 | Taiheiyo Cement Corp | 双極型静電チャック |
| WO2005004229A1 (ja) | 2003-07-08 | 2005-01-13 | Future Vision Inc. | 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム |
| US20070223173A1 (en) | 2004-03-19 | 2007-09-27 | Hiroshi Fujisawa | Bipolar Electrostatic Chuck |
| CN100470756C (zh) | 2004-06-28 | 2009-03-18 | 京瓷株式会社 | 静电卡盘 |
| CN101326627B (zh) | 2005-12-06 | 2010-06-09 | 创意科技股份有限公司 | 静电卡盘用电极片以及静电卡盘 |
| TW200735254A (en) * | 2006-03-03 | 2007-09-16 | Ngk Insulators Ltd | Electrostatic chuck and producing method thereof |
| US20080062609A1 (en) | 2006-08-10 | 2008-03-13 | Shinji Himori | Electrostatic chuck device |
| JP5059450B2 (ja) * | 2007-03-06 | 2012-10-24 | 東京エレクトロン株式会社 | 基板載置台及び基板処理装置 |
| US7989022B2 (en) | 2007-07-20 | 2011-08-02 | Micron Technology, Inc. | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
| JP5112808B2 (ja) | 2007-10-15 | 2013-01-09 | 筑波精工株式会社 | 静電型補強装置 |
| JP2010034510A (ja) * | 2008-07-02 | 2010-02-12 | Murata Mfg Co Ltd | 静電チャック |
| JP5283699B2 (ja) | 2008-07-08 | 2013-09-04 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
| JP2009088558A (ja) | 2008-12-22 | 2009-04-23 | Canon Anelva Corp | 静電チャック装置 |
| KR101001454B1 (ko) | 2009-01-23 | 2010-12-14 | 삼성모바일디스플레이주식회사 | 정전척 및 이를 구비한 유기전계발광 소자의 제조장치 |
| WO2011137371A2 (en) * | 2010-04-30 | 2011-11-03 | Applied Materials, Inc. | Vertical inline cvd system |
| KR101903199B1 (ko) | 2010-12-08 | 2018-10-01 | 에바텍 아크티엔게젤샤프트 | 기판 상에 레이어를 증착하는 방법 및 장치 |
| US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
| JP5665679B2 (ja) | 2011-07-14 | 2015-02-04 | 住友重機械工業株式会社 | 不純物導入層形成装置及び静電チャック保護方法 |
| JP2013163837A (ja) * | 2012-02-09 | 2013-08-22 | Canon Tokki Corp | 蒸着装置並びに蒸着装置を用いた成膜方法 |
| JP2013197465A (ja) * | 2012-03-22 | 2013-09-30 | Toshiba Corp | 静電チャック装置および露光装置 |
| KR102047001B1 (ko) | 2012-10-16 | 2019-12-03 | 삼성디스플레이 주식회사 | 정전 척 |
| US9740111B2 (en) | 2014-05-16 | 2017-08-22 | Applied Materials, Inc. | Electrostatic carrier for handling substrates for processing |
| US10978334B2 (en) | 2014-09-02 | 2021-04-13 | Applied Materials, Inc. | Sealing structure for workpiece to substrate bonding in a processing chamber |
-
2015
- 2015-04-02 WO PCT/US2015/024147 patent/WO2015171226A1/en not_active Ceased
- 2015-04-02 CN CN201580024181.4A patent/CN106575720B/zh not_active Expired - Fee Related
- 2015-04-02 JP JP2016558294A patent/JP2017515301A/ja active Pending
- 2015-04-02 KR KR1020167034479A patent/KR20170002603A/ko not_active Withdrawn
- 2015-04-02 US US15/123,231 patent/US10096509B2/en not_active Expired - Fee Related
- 2015-04-14 TW TW104111860A patent/TW201606902A/zh unknown