KR20170002603A - 보호 커버링을 갖는 기판 캐리어 시스템 - Google Patents

보호 커버링을 갖는 기판 캐리어 시스템 Download PDF

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Publication number
KR20170002603A
KR20170002603A KR1020167034479A KR20167034479A KR20170002603A KR 20170002603 A KR20170002603 A KR 20170002603A KR 1020167034479 A KR1020167034479 A KR 1020167034479A KR 20167034479 A KR20167034479 A KR 20167034479A KR 20170002603 A KR20170002603 A KR 20170002603A
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KR
South Korea
Prior art keywords
substrate
substrate carrier
electrode
protective layer
carrier system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020167034479A
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English (en)
Korean (ko)
Inventor
주오퀴안 왕
존 엠. 화이트
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20170002603A publication Critical patent/KR20170002603A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H01L51/56—
    • H01L21/6831—
    • H01L21/6835—
    • H01L21/68757—
    • H01L21/68785—
    • H01L51/001—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020167034479A 2014-05-09 2015-04-02 보호 커버링을 갖는 기판 캐리어 시스템 Withdrawn KR20170002603A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09
US61/991,350 2014-05-09
PCT/US2015/024147 WO2015171226A1 (en) 2014-05-09 2015-04-02 Substrate carrier system with protective covering

Publications (1)

Publication Number Publication Date
KR20170002603A true KR20170002603A (ko) 2017-01-06

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167034479A Withdrawn KR20170002603A (ko) 2014-05-09 2015-04-02 보호 커버링을 갖는 기판 캐리어 시스템

Country Status (6)

Country Link
US (1) US10096509B2 (enExample)
JP (1) JP2017515301A (enExample)
KR (1) KR20170002603A (enExample)
CN (1) CN106575720B (enExample)
TW (1) TW201606902A (enExample)
WO (1) WO2015171226A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180101162A (ko) * 2017-01-31 2018-09-12 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하는 방법 및 기판을 홀딩하기 위한 기판 캐리어
WO2019186411A1 (en) * 2018-03-29 2019-10-03 Applied Materials, Inc. Electrostatic chuck and substrate processing apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102123482B1 (ko) * 2017-02-24 2020-06-16 어플라이드 머티어리얼스, 인코포레이티드 진공 시스템에서 사용하기 위한 캐리어, 진공 프로세싱을 위한 시스템, 및 기판의 진공 프로세싱을 위한 방법
WO2019050507A1 (en) * 2017-09-05 2019-03-14 Applied Materials, Inc. METHODS OF MANIPULATING A MASKING DEVICE, APPARATUS FOR EXCHANGING A MASKING DEVICE, MASK EXCHANGING CHAMBER, AND VACUUM SYSTEM
WO2019101319A1 (en) * 2017-11-23 2019-05-31 Applied Materials, Inc. Substrate carrier for supporting a substrate, mask chucking apparatus, vacuum processing system, and method of operating a substrate carrier
KR102657356B1 (ko) 2018-08-21 2024-04-16 어플라이드 머티어리얼스, 인코포레이티드 배터리들을 위한 분리기 상의 초박형 세라믹 코팅
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

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JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH09151362A (ja) * 1995-11-30 1997-06-10 Honda Electron Co Ltd 保護用積層粘着フィルム
JP3847855B2 (ja) * 1996-07-31 2006-11-22 三島 満 抗菌、抗カビ、抗汚染性を有する多層剥離再生型保護シート
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) * 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
KR20020046214A (ko) 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2003060020A (ja) * 2001-06-07 2003-02-28 Komatsu Ltd 静電チャック装置
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP4166449B2 (ja) * 2001-07-30 2008-10-15 株式会社アルバック 真空処理装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
DE112005000621B4 (de) 2004-03-19 2019-01-31 Creative Technology Corporation Bipolare elektrostatische Haltevorrichtung
US7586734B2 (en) * 2004-06-28 2009-09-08 Kyocera Corporation Electrostatic chuck
WO2007066572A1 (ja) 2005-12-06 2007-06-14 Creative Technology Corporation 静電チャック用電極シート及び静電チャック
TW200735254A (en) * 2006-03-03 2007-09-16 Ngk Insulators Ltd Electrostatic chuck and producing method thereof
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
JP5059450B2 (ja) * 2007-03-06 2012-10-24 東京エレクトロン株式会社 基板載置台及び基板処理装置
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
WO2010004915A1 (ja) 2008-07-08 2010-01-14 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP2009088558A (ja) * 2008-12-22 2009-04-23 Canon Anelva Corp 静電チャック装置
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
KR101796656B1 (ko) * 2010-04-30 2017-11-13 어플라이드 머티어리얼스, 인코포레이티드 수직 인라인 화학기상증착 시스템
CN103261477B (zh) 2010-12-08 2015-09-30 欧瑞康先进科技股份公司 用于向基底上沉积层的设备和方法
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180101162A (ko) * 2017-01-31 2018-09-12 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하는 방법 및 기판을 홀딩하기 위한 기판 캐리어
WO2019186411A1 (en) * 2018-03-29 2019-10-03 Applied Materials, Inc. Electrostatic chuck and substrate processing apparatus

Also Published As

Publication number Publication date
CN106575720A (zh) 2017-04-19
US20180166316A1 (en) 2018-06-14
JP2017515301A (ja) 2017-06-08
CN106575720B (zh) 2019-01-15
WO2015171226A1 (en) 2015-11-12
TW201606902A (zh) 2016-02-16
US10096509B2 (en) 2018-10-09

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